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1. 发明授权

US08371027B2 Electronic components mounting method 有权
标题翻译：电子元件安装方式
公开(公告)号：US08371027B2
公开(公告)日：2013-02-12
申请号：US12279024
申请日：2007-04-12
申请人： Masafumi Inoue , Mitsuhaya Tsukamoto , Masahiro Kihara , Syoichi Nishi
发明人： Masafumi Inoue , Mitsuhaya Tsukamoto , Masahiro Kihara , Syoichi Nishi
IPC分类号： H05K3/36
CPC分类号： H05K3/3484 , H05K1/0269 , H05K3/0008 , H05K3/303 , H05K13/0812 , H05K2203/0195 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/53091 , Y10T29/53174
摘要： In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.
摘要翻译：在由多个电子部件安装装置形成的电子部件安装系统通过彼此连接而构成安装电路基板的电子部件安装工序中，印刷在电路基板上的焊锡膏位置的数据作为前馈数据到电子元件放置装置和放置状态检查装置。基于焊接位置数据，更新控制参数，该控制参数控制由于电子元件放置设备而导致的元件放置操作中的放置位置和指示在放置状态检查中的元件的标准位置的检查参数。因此，可以通过有效且适当地使用从各处理获得的检查信息来实现精确的安装。

2. 发明授权

US08020286B2 Electronic component mounting system and electronic component mounting method 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US08020286B2
公开(公告)日：2011-09-20
申请号：US12090274
申请日：2006-12-20
申请人： Masafumi Inoue , Mitsuhaya Tsukamoto , Syoichi Nishi , Masahiro Kihara
发明人： Masafumi Inoue , Mitsuhaya Tsukamoto , Syoichi Nishi , Masahiro Kihara
IPC分类号： H05K3/36 , H05K3/20
CPC分类号： H05K13/082 , Y10T29/49128 , Y10T29/4913 , Y10T29/53174
摘要： One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data. Then, once the substrate has been delivered to an electronic component placing apparatus, the substrate height measurement apparatus again measures the height of the substrate at specific height measurement points to obtain substrate height correction data, and based on the initial substrate height data and the substrate height correction data, updates a control parameter for controlling the component placing operation performed by a loading head. In this manner, discrepancies in the positions of the heights of individual substrates can be accurately corrected, and mounting defects due to positioning errors in the direction of the heights of the substrates can be prevented.
摘要翻译：本发明的一个目的是提供一种电子部件安装系统和电子部件安装方法，其可以防止由于基板的厚度方向上的定位误差引起的安装缺陷，并且可以提供特定的安装质量。根据通过连接多个用于安装电子部件的装置的电子部件安装系统，印刷检查装置的高度测量装置22测量在基板的上表面上指定的高度测量点处的高度，并输出测量结果作为衬底高度数据。然后，一旦基板被输送到电子部件放置装置，基板高度测量装置再次测量特定高度测量点处的基板的高度，以获得基板高度校正数据，并且基于初始基板高度数据和基板高度校正数据，更新用于控制由装载头执行的部件放置操作的控制参数。以这种方式，可以精确地校正单个基板的高度位置的差异，并且可以防止由于基板的高度方向上的定位误差而导致的安装缺陷。

3. 发明申请

US20090014501A1 ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT PLACING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
标题翻译：电子元件安装系统，电子元件放置装置和电子元件安装方法
公开(公告)号：US20090014501A1
公开(公告)日：2009-01-15
申请号：US12162588
申请日：2007-03-26
申请人： Syoichi Nishi , Mitsuhaya Tsukamoto , Masahiro Kihara , Masafumi Inoue
发明人： Syoichi Nishi , Mitsuhaya Tsukamoto , Masahiro Kihara , Masafumi Inoue
IPC分类号： B23K31/12 , B23K1/20
CPC分类号： B23K31/12 , H01L2224/75 , H01L2224/81 , H01L2924/3511 , H05K1/0269 , H05K3/1216 , H05K3/3436 , H05K3/3484 , H05K13/0409 , H05K13/0465 , H05K13/08 , H05K2201/035 , H05K2201/10984 , H05K2203/0338 , H05K2203/163 , Y02P70/613
摘要： Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint.
摘要翻译：关于电子部件安装，其中具有在其下表面上具有用于外部连接的多个焊料凸块的电子部件安装在板上，在预先测量焊膏的焊膏的高度位置的电子部件安装操作中，并且通过装载头将电子部件安装在印刷了焊锡膏的印刷电路板上，是否需要焊锡膏向焊料凸块的转印是否需要根据锡膏的高度。在判断需要进行转印的情况下，执行焊膏的转印，之后将电子部件安装在基板上。因此，通过焊接将能够容易翘曲变形的薄型半导体封装安装在基板上的情况下，可以防止不良接合。

4. 发明授权

US08240543B2 Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method 有权
标题翻译：电子部件安装系统，电子部件放置装置和电子部件安装方法
公开(公告)号：US08240543B2
公开(公告)日：2012-08-14
申请号：US12162588
申请日：2007-03-26
申请人： Syoichi Nishi , Mitsuhaya Tsukamoto , Masahiro Kihara , Masafumi Inoue
发明人： Syoichi Nishi , Mitsuhaya Tsukamoto , Masahiro Kihara , Masafumi Inoue
IPC分类号： B23K31/12 , B23K31/00 , H01L21/00
CPC分类号： B23K31/12 , H01L2224/75 , H01L2224/81 , H01L2924/3511 , H05K1/0269 , H05K3/1216 , H05K3/3436 , H05K3/3484 , H05K13/0409 , H05K13/0465 , H05K13/08 , H05K2201/035 , H05K2201/10984 , H05K2203/0338 , H05K2203/163 , Y02P70/613
摘要： Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by soldering.
摘要翻译：关于电子部件安装，其中具有在其下表面上具有用于外部连接的多个焊料凸块的电子部件安装在板上，在预先测量焊膏的焊膏的高度位置的电子部件安装操作中，并且通过装载头将电子部件安装在印刷了焊锡膏的印刷电路板上，是否需要焊锡膏向焊料凸块的转印是否需要根据锡膏的高度。在判断需要进行转印的情况下，执行焊膏的转印，之后将电子部件安装在基板上。因此，通过焊接在板上安装导致容易翘曲变形的薄型半导体封装的情况下，可以防止不良接头。

5. 发明申请

US20090293265A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US20090293265A1
公开(公告)日：2009-12-03
申请号：US12090274
申请日：2006-12-20
申请人： Masafumi Inoue , Mitsuhaya Tsukamoto , Syoichi Nishi , Masahiro Kihara
发明人： Masafumi Inoue , Mitsuhaya Tsukamoto , Syoichi Nishi , Masahiro Kihara
IPC分类号： B23P19/00
CPC分类号： H05K13/082 , Y10T29/49128 , Y10T29/4913 , Y10T29/53174
摘要： One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality.According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data. Then, once the substrate has been delivered to an electronic component placing apparatus, the substrate height measurement apparatus again measures the height of the substrate at specific height measurement points to obtain substrate height correction data, and based on the initial substrate height data and the substrate height correction data, updates a control parameter for controlling the component placing operation performed by a loading head. In this manner, discrepancies in the positions of the heights of individual substrates can be accurately corrected, and mounting defects due to positioning errors in the direction of the heights of the substrates can be prevented.
摘要翻译：本发明的一个目的是提供一种电子部件安装系统和电子部件安装方法，其可以防止由于基板的厚度方向上的定位误差引起的安装缺陷，并且可以提供特定的安装质量。根据通过连接多个用于安装电子部件的装置的电子部件安装系统，印刷检查装置的高度测量装置22测量在基板的上表面上指定的高度测量点处的高度，并输出测量结果作为衬底高度数据。然后，一旦基板被输送到电子部件放置装置，基板高度测量装置再次测量特定高度测量点处的基板的高度，以获得基板高度校正数据，并且基于初始基板高度数据和基板高度校正数据，更新用于控制由装载头执行的部件放置操作的控制参数。以这种方式，可以精确地校正单个基板的高度位置的差异，并且可以防止由于基板的高度方向上的定位误差而导致的安装缺陷。

6. 发明申请

US20090064489A1 ELECTRONIC COMPONENTS MOUNTING SYSTEM, PLACEMENT STATE INSPECTING APPARATUS, AND ELECTRONIC COMPONENTS MOUNTING METHOD 有权
标题翻译：电子元件安装系统，放置状态检查装置和电子元件安装方法
公开(公告)号：US20090064489A1
公开(公告)日：2009-03-12
申请号：US12279024
申请日：2007-04-12
申请人： Masafumi Inoue , Mitsuhaya Tsukamoto , Masahiro Kihara , Syoichi Nishi
发明人： Masafumi Inoue , Mitsuhaya Tsukamoto , Masahiro Kihara , Syoichi Nishi
IPC分类号： B23P19/00
CPC分类号： H05K3/3484 , H05K1/0269 , H05K3/0008 , H05K3/303 , H05K13/0812 , H05K2203/0195 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/53091 , Y10T29/53174
摘要： In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.
摘要翻译：在由多个电子部件安装装置形成的电子部件安装系统通过彼此连接而构成安装电路基板的电子部件安装工序中，印刷在电路基板上的焊锡膏位置的数据作为前馈数据到电子元件放置装置和放置状态检查装置。基于焊接位置数据，更新控制参数，该控制参数控制由于电子元件放置设备而导致的元件放置操作中的放置位置和指示在放置状态检查中的元件的标准位置的检查参数。因此，可以通过有效且适当地使用从各处理获得的检查信息来实现精确的安装。

7. 发明申请

US20070020748A1 Apparatus for screening proptein crystallization conditions 审中-公开
标题翻译：筛选proptein结晶条件的装置
公开(公告)号：US20070020748A1
公开(公告)日：2007-01-25
申请号：US10555033
申请日：2004-04-28
申请人： Itsuro Motegi , Hirofumi Matsuzaki , Hideyoshi Kitahara , Mitsuhaya Tsukamoto , Kouji Shimogawa , Masataka Magoori , Akira Higuchi
发明人： Itsuro Motegi , Hirofumi Matsuzaki , Hideyoshi Kitahara , Mitsuhaya Tsukamoto , Kouji Shimogawa , Masataka Magoori , Akira Higuchi
IPC分类号： C12M1/34
CPC分类号： G01N33/68 , B01D9/00 , B01D9/0077 , C30B7/00 , C30B7/02 , C30B29/58 , G01N35/028 , G01N2035/0425
摘要： The present invention is intended to provide an apparatus for screening protein crystallization conditions that can screen protein crystallization conditions efficiently by the vapor diffusion method using the sitting drop technique. In order to achieve the above-mentioned object, in an apparatus for screening protein crystallization conditions that screens protein crystallization conditions using the sitting drop technique that is one of the techniques of protein crystallization to be carried out by the vapor diffusion method, an apparatus 2 for preparing a crystallization plate that includes a dispensing means for dispensing a protein solution and a crystallization solution in wells of the crystallization plate and a seal attachment unit that seals the wells that have been subjected to dispensation is connected to a protein crystal detection apparatus 5 that detects protein crystals produced in the crystallization plate in a thermostatic chamber that stores the crystallization plate that has been subjected to the dispensing in a predetermined environment. Accordingly, the crystallization plate is transferred automatically and thus screening is carried out efficiently and automatically.
摘要翻译：本发明旨在提供一种用于筛选蛋白质结晶条件的装置，其可以通过使用坐式技术的蒸气扩散法有效地筛选蛋白质结晶条件。为了实现上述目的，在使用通过蒸气扩散法进行蛋白质结晶的技术之一的坐式滴定技术筛选蛋白质结晶条件的蛋白质结晶条件的装置中，装置2 用于制备结晶板，其包括用于在结晶板的孔中分配蛋白质溶液和结晶溶液的分配装置和将经过分配的孔密封的密封附着单元连接到蛋白质晶体检测装置5，蛋白质晶体检测装置5 检测在恒温室中在结晶板中产生的蛋白质晶体，所述恒温室存储在预定环境中进行了分散的结晶板。因此，结晶板被自动转印，从而有效且自动地进行筛选。

8. 发明授权

US06757966B2 Component mounting system and mounting method 有权
标题翻译：组件安装系统和安装方法
公开(公告)号：US06757966B2
公开(公告)日：2004-07-06
申请号：US10037094
申请日：2001-10-25
申请人： Masafumi Inoue , Mitsuhaya Tsukamoto , Masat Fujioka
发明人： Masafumi Inoue , Mitsuhaya Tsukamoto , Masat Fujioka
IPC分类号： H05K334
CPC分类号： H05K13/0465 , H05K1/0269 , H05K3/0008 , H05K3/1216 , H05K13/0817 , H05K13/083 , Y10T29/49002 , Y10T29/49131 , Y10T29/49144 , Y10T29/49826 , Y10T29/53052 , Y10T29/53091 , Y10T29/53178
摘要： A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.
摘要翻译：一种部件安装系统，其包括用于在形成在板上的电极上印刷焊料的打印机; 第一检查单元，用于检测印刷焊料的位置并输出焊料位置检测结果; 组件安装单元，用于从部件供给器托架拾取部件，并使用安装头将部件放置在板上; 第二检查单元，用于检查放置的部件的位置并输出部件位置检测结果; 焊接单元，用于通过加热和熔化焊料将部件焊接到板上; 至少基于焊料位置检测结果或分量位置检测结果，至少更新用于控制打印机操作的控制参数或部件安装单元操作的控制参数的主控制器。上述配置使得能够在整个安装过程中进行准确和有效的质量控制。

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