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    • 8. 发明申请
    • METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20110186970A1
    • 2011-08-04
    • US12840184
    • 2010-07-20
    • Min Chul SUNG
    • Min Chul SUNG
    • H01L21/3105H01L23/28
    • H01L21/3105H01L23/28H01L2924/0002H01L2924/00
    • A method for manufacturing a semiconductor device comprises: etching a semiconductor substrate to form a plurality of pillars; depositing a first protective film on the sidewalls of the pillar; first etching the semiconductor substrate with the pillar deposited with the first protective film as a mask; forming a first insulating film on the sidewalls of the pillar and the first etched semiconductor substrate; second etching the semiconductor substrate with the pillar including the first insulating film as a mask; forming a second protective film and a second insulating film on the surface of the second etched semiconductor substrate; depositing a barrier film on the sidewalls of the pillar including the second insulating film; and removing the first insulating film, the second insulating film and the barrier film disposed at one sidewall of the pillar to form a contact hole defined by the first protective film and the second protective film.
    • 一种制造半导体器件的方法包括:蚀刻半导体衬底以形成多个柱; 在所述柱的侧壁上沉积第一保护膜; 首先用沉积有第一保护膜的柱作为掩模蚀刻半导体衬底; 在所述柱和所述第一蚀刻半导体衬底的侧壁上形成第一绝缘膜; 用包括第一绝缘膜的柱作为掩模来第二蚀刻半导体衬底; 在所述第二蚀刻半导体衬底的表面上形成第二保护膜和第二绝缘膜; 在包括第二绝缘膜的柱的侧壁上沉积阻挡膜; 以及去除第一绝缘膜,第二绝缘膜和设置在柱的一个侧壁处的阻挡膜,以形成由第一保护膜和第二保护膜限定的接触孔。