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1. 发明授权

US06376157B1 Method of manufacturing a semiconductor device, chemical solution to form fine pattern, and semiconductor device 失效
标题翻译：制造半导体器件的方法，形成精细图案的化学溶液和半导体器件
公开(公告)号：US06376157B1
公开(公告)日：2002-04-23
申请号：US09539862
申请日：2000-03-31
申请人： Mikihiro Tanaka , Takeo Ishibashi
发明人： Mikihiro Tanaka , Takeo Ishibashi
IPC分类号： G03F740
CPC分类号： G03F7/40
摘要： In a method of manufacturing a semiconductor device, a first resist pattern, which evolves an acid, is formed on a semiconductor substrate. The first resist pattern is treated with a chemical solution containing a crosslinking agent and a swelling promoter. The crosslinking agent is capable to bring about crosslinking in the presence of an acid at the surface layer of the first resist pattern. The crosslinking agent and swelling promoter in the chemical solution permeate into the surface layer of the first resist pattern, thereby swells the surface layer. The chemical solution is removed from the surface of the first resist pattern. The first resist pattern is caused to evolve an acid, by which a crosslinked film is formed in the swollen surface layer of the first resist pattern. Thus, a second resist pattern is formed, and the semiconductor substrate is etched through the second resist pattern as a mask. The resist pattern thus obtained has a fine feature which exceeds the limit of the wavelength of light for exposure.
摘要翻译：在制造半导体器件的方法中，在半导体衬底上形成放出酸的第一抗蚀剂图案。第一抗蚀剂图案用含有交联剂和溶胀促进剂的化学溶液处理。交联剂能够在第一抗蚀剂图案的表面层处的酸存在下进行交联。化学溶液中的交联剂和溶胀促进剂渗透到第一抗蚀剂图案的表面层中，从而使表面层膨胀。从第一抗蚀剂图案的表面去除化学溶液。使第一抗蚀剂图案析出酸，由此在第一抗蚀剂图案的溶胀表面层中形成交联膜。因此，形成第二抗蚀剂图案，并且通过第二抗蚀剂图案来蚀刻半导体衬底作为掩模。由此获得的抗蚀剂图案具有超过用于曝光的光的波长的极限的微细特征。

2. 发明授权

US06266242B1 Circuit module and information processing apparatus 有权
标题翻译：电路模块及信息处理装置
公开(公告)号：US06266242B1
公开(公告)日：2001-07-24
申请号：US09557161
申请日：2000-04-25
申请人： Takashi Maruyama , Akira Yamagiwa , Ryoichi Kurihara , Masakazu Sakaue , Yasuhiro Uemura , Mikihiro Tanaka
发明人： Takashi Maruyama , Akira Yamagiwa , Ryoichi Kurihara , Masakazu Sakaue , Yasuhiro Uemura , Mikihiro Tanaka
IPC分类号： H05K720
CPC分类号： G06F1/206 , G06F1/20 , G06F1/203 , H01L23/36 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/16225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a high heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector to be electrically connected to the outside, a system control circuit for controlling transfer of a signal between the processor and the connector, and a printed board on which the processor, the connector and the system control circuit are mounted. The CPU module further provides a heat release plate one side of which is pasted with the printed board and the other side of which is substantially planar. The printed board has a cavity formed therein so that the processor may be fitted in the cavity in a bare-chip state. One side of the bare chip is jointed with the heat release plate.
摘要翻译：本发明提供一种信息处理装置，其可以设计成小而薄的小型和薄型CPU模块，其具有高的散热效果并且适合于此。 CPU模块包括处理器，电连接到外部的连接器，用于控制处理器和连接器之间的信号传送的系统控制电路，以及印刷电路板，处理器，连接器和系统控制电路被安装。 CPU模块还提供一个散热片，其一面与印刷电路板粘贴，另一侧基本上是平面的。印刷板具有形成在其中的空腔，使得处理器可以以裸芯片状态装配在空腔中。裸芯片的一侧与散热板接合。

3. 发明授权

US06593063B1 Method of manufacturing a semiconductor device having an improved fine structure 失效
标题翻译：具有改善的精细结构的半导体器件的制造方法
公开(公告)号：US06593063B1
公开(公告)日：2003-07-15
申请号：US09514943
申请日：2000-02-28
申请人： Mikihiro Tanaka , Takeo Ishibashi
发明人： Mikihiro Tanaka , Takeo Ishibashi
IPC分类号： G03C500
CPC分类号： G03F7/0035 , G03F7/40 , H01L21/0273 , H01L21/0274
摘要： A first resist layer, capable of generating an acid, is formed on a semiconductor base layer and is developed in a shortened developing time than usual. The first resist pattern is covered with a second resist layer containing a material capable of crosslinkage in the presence of an acid. The acid is generated in the first resist pattern by application of heat or by exposure to light, and a crosslinked layer is formed in the second resist pattern at the interface with the first resist pattern as a cover layer for the first resist pattern, thereby the first resist pattern is caused to be thickened. The non linked portion of the second resist layer is removed and the fine resist pattern is formed. Thus, the hole diameter of the resist pattern can be reduced, or the isolation width of a resist pattern can be reduced.
摘要翻译：在半导体基底层上形成能够产生酸的第一抗蚀剂层，并且以比通常缩短的显影时间显影。第一抗蚀剂图案被包含能够在酸存在下能够交联的材料的第二抗蚀层覆盖。在第一抗蚀剂图案中通过施加热或暴露于光而产生酸，并且在与第一抗蚀剂图案的界面处的第二抗蚀剂图案中形成交联层作为第一抗蚀剂图案的覆盖层，由此，使第一抗蚀剂图案变厚。去除第二抗蚀剂层的非连接部分并形成精细抗蚀剂图案。因此，可以减小抗蚀剂图案的孔径，或者可以减小抗蚀剂图案的隔离宽度。

4. 发明授权

US06527562B2 PCI expansion adapter with PC card slot and electronic apparatus provided with the same 有权
公开(公告)号：US06527562B2
公开(公告)日：2003-03-04
申请号：US09950356
申请日：2001-09-11
申请人： Mikihiro Tanaka , Kenichi Yoshida , Hiroyuki Inokuchi , Takashi Maruyama , Kazuma Kishi , Hironori Oikawa , Hiroshi Ito , Hitoshi Yokota
发明人： Mikihiro Tanaka , Kenichi Yoshida , Hiroyuki Inokuchi , Takashi Maruyama , Kazuma Kishi , Hironori Oikawa , Hiroshi Ito , Hitoshi Yokota
IPC分类号： H01R909
CPC分类号： G06F1/185 , G06F1/181 , G06F1/184 , G06F1/186 , H01R12/52
摘要： There is provided a technology for realizing an PCI expansion adapter for a PC card which is connectable to a desktop type personal computer PCI expansion connector using a low profile PCI. The PCI expansion adapter includes an expansion unit which is provided with an electrical connector to a PCI bus, a low profile PCI expansion board provided with a PC card control element and an electrical connector to the PC card, wherein the low profile PCI expansion board and the expansion unit are connected by the electrical connectors mounted on the respective boards.

5. 发明授权

US6069793A Circuit module and information processing apparatus 失效
标题翻译：电路模块及信息处理装置
公开(公告)号：US6069793A
公开(公告)日：2000-05-30
申请号：US10185
申请日：1998-01-21
申请人： Takashi Maruyama , Akira Yamagiwa , Ryoichi Kurihara , Masakazu Sakaue , Yasuhiro Uemura , Mikihiro Tanaka
发明人： Takashi Maruyama , Akira Yamagiwa , Ryoichi Kurihara , Masakazu Sakaue , Yasuhiro Uemura , Mikihiro Tanaka
IPC分类号： G06F1/20 , H01L23/36 , H05K7/20
CPC分类号： G06F1/206 , G06F1/20 , G06F1/203 , H01L23/36 , H01L2224/05599 , H01L2224/16225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/85399 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/3025
摘要： The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a nigh heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector to be electrically connected to the outside, a system control circuit for controlling transfer of a signal between the processor and the connector, and a printed board on which the processor, the connector and the system control circuit are mounted. The CPU module further provides a heat release plate one side of which is pasted with the printed board and the other side of which is substantially planar. The printed board has a cavity formed therein so that the processor may be fitted in the cavity in a bare-chip state. One side of the bare chip is jointed with the heat release plate.
摘要翻译：本发明提供一种可以设计成小型和小型的信息处理设备，以及具有最佳散热效果并且适合的小型和薄型CPU模块。 CPU模块包括处理器，电连接到外部的连接器，用于控制处理器和连接器之间的信号传送的系统控制电路，以及印刷电路板，处理器，连接器和系统控制电路被安装。 CPU模块还提供一个散热片，其一面与印刷电路板粘贴，另一侧基本上是平面的。印刷板具有形成在其中的空腔，使得处理器可以以裸芯片状态装配在空腔中。裸芯片的一侧与散热板接合。

6. 发明申请

US20100245346A1 Image Receiving Apparatus and Memory Medium 审中-公开
标题翻译：图像接收装置和存储介质
公开(公告)号：US20100245346A1
公开(公告)日：2010-09-30
申请号：US12710221
申请日：2010-02-22
申请人： Mikihiro Tanaka , Manabu Yano , Kazuharu Tanaike
发明人： Mikihiro Tanaka , Manabu Yano , Kazuharu Tanaike
IPC分类号： G06T15/00
CPC分类号： H04N9/7921 , H04M1/0266 , H04N5/76 , H04N5/907 , H04N13/189 , H04N13/31 , H04N13/359 , H04N13/398 , H04N21/41407 , H04N21/4325
摘要： This invention improves the convenience of viewing three-dimensional image displays. A mobile communications handset can accomplish three-dimensional image displays using image data received by a communications unit and a broadcast reception unit through a display unit provided with a parallax barrier panel. A control unit automatically performs actions to record the image data as an auxiliary recording while the three-dimensional image display is being performed when the three-dimensional image display is performed using the received image data. That is to say, recording of image data relating to the three-dimensional image display is performed automatically in preparation for cases where the display cannot be viewed three-dimensionally due to viewing conditions.
摘要翻译：本发明提供了观看三维图像显示器的便利性。移动通信手机可以通过具有视差屏障面板的显示单元，利用由通信单元和广播接收单元接收的图像数据来完成三维图像显示。当使用接收的图像数据执行三维图像显示时，控制单元自动执行将图像数据记录为辅助记录，同时执行三维图像显示。也就是说，对于由于观看条件三维地不能看到显示的情况，自动执行与三维图像显示有关的图像数据的记录。

7. 发明授权

US06769045B2 PCI expansion adapter with PC card slot and electronic apparatus provided with the same 有权
标题翻译：具有PC卡插槽和电子设备的PCI扩展适配器
公开(公告)号：US06769045B2
公开(公告)日：2004-07-27
申请号：US09949823
申请日：2001-09-12
申请人： Mikihiro Tanaka , Kenichi Yoshida , Hiroyuki Inokuchi , Takashi Maruyama , Kazuma Kishi , Hironori Oikawa , Hiroshi Ito , Hitoshi Yokota
发明人： Mikihiro Tanaka , Kenichi Yoshida , Hiroyuki Inokuchi , Takashi Maruyama , Kazuma Kishi , Hironori Oikawa , Hiroshi Ito , Hitoshi Yokota
IPC分类号： G06F1300
CPC分类号： G06F1/185 , G06F1/181 , G06F1/184 , G06F1/186 , H01R12/52
摘要： There is provided a technology for realizing an PCI expansion adapter for a PC card which is connectable to a desktop type personal computer PCI expansion connector using a low profile PCI. The PCI expansion adapter includes an expansion unit which is provided with an electrical connector to a PCI bus, a low profile PCI expansion board provided with a PC card control element and an electrical connector to the PC card, wherein the low profile PCI expansion board and the expansion unit are connected by the electrical connectors mounted on the respective boards.

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