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1. 发明授权

US06503361B1 Polishing method and polishing apparatus using the same 失效
标题翻译：抛光方法和使用其的抛光装置
公开(公告)号：US06503361B1
公开(公告)日：2003-01-07
申请号：US09090803
申请日：1998-06-04
申请人： Masaru Nyui , Mikichi Ban
发明人： Masaru Nyui , Mikichi Ban
IPC分类号： C23F104
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12
摘要： This specification discloses a polishing method of polishing the surface of a film layer provided on the surface of a substrate by polishing means with both of them driven relative to each other, having a position detecting step of detecting a predetermined position on the surface of the film layer, a first measuring step of applying momentary light from a light source to the predetermined position, and detecting the light beam from the predetermined position by a light receiving element to thereby measure the film thickness at the predetermined position, and a controlling step of controlling the polishing state by using data obtained in the first measuring step. The specification also discloses a polishing apparatus using such polishing method.
摘要翻译：该说明书公开了一种抛光方法，其通过抛光装置抛光设置在基板的表面上的膜层的表面，两者都被相对于彼此驱动，具有位置检测步骤，该位置检测步骤检测膜的表面上的预定位置第一测量步骤，将来自光源的瞬时光施加到预定位置，并且由光接收元件检测来自预定位置的光束，从而测量预定位置处的膜厚度;以及控制步骤，通过使用在第一测量步骤中获得的数据的抛光状态。本说明书还公开了使用这种抛光方法的抛光装置。

2. 发明授权

US6165050A Method of manufacturing semiconductor device using precision polishing apparatus with detecting means 失效
标题翻译：使用具有检测装置的精密抛光装置制造半导体器件的方法
公开(公告)号：US6165050A
公开(公告)日：2000-12-26
申请号：US303647
申请日：1999-05-03
申请人： Mikichi Ban , Matsuomi Nishimura , Kazuo Takahashi
发明人： Mikichi Ban , Matsuomi Nishimura , Kazuo Takahashi
IPC分类号： B24B37/04 , B24B49/00 , H01L21/302
CPC分类号： H01L21/67219 , B24B37/04 , B24B49/00 , H01L21/67271 , H01L21/67745
摘要： In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out of an unloading unit as products. The defective articles are classified in a discriminating device in conformity with the kinds of defects and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.
摘要翻译：为了回收有缺陷的物品，从装载单元运送的晶片以指定的顺序被输送到晶片储存单元，抛光单元，预漂洗单元，漂洗单元，脱水脱水单元和干燥单元，以及在缺陷检查装置中，有缺陷的物品被分类，其余的作为产品从卸载单元中取出。有缺陷的物品根据缺陷的种类分类在鉴别装置中，并通过返回管道返回到抛光单元，漂洗单元或干燥单元。

3. 发明授权

US5904611A Precision polishing apparatus 失效
标题翻译：精密抛光装置
公开(公告)号：US5904611A
公开(公告)日：1999-05-18
申请号：US840627
申请日：1997-04-25
申请人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura
发明人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura
IPC分类号： B24B37/34 , B24B55/00 , B24B1/00
CPC分类号： B24B37/345 , B24B55/00
摘要： A precision polishing apparatus has a first hermetically sealed chamber provided with polishing means, a third hermetically sealed chamber capable of communicating with the first hermetically sealed chamber through a second hermetically sealed chamber, first and second opening-closing means for alternately placing the first and the third hermetically sealed chamber in communication with with the second hermetically sealed chamber, and atmosphere pressure control means for controlling the atmosphere pressure of the first and the second hermetically sealed chamber so that the atmosphere pressure of the first hermetically sealed chamber may become lower than the atmosphere pressure of the second hermetically sealed chamber when at least the first opening-closing means is opened.
摘要翻译：精密抛光装置具有设置有抛光装置的第一密封室，能够通过第二密封室与第一密封室连通的第三密封室，第一和第二打开 - 关闭装置，用于交替地放置第一和第二密封室与第二密封室连通的第三密封室，以及用于控制第一和第二密封室的气氛压力的大气压力控制装置，使得第一密封室的气氛压力可能变得低于大气至少第一打开 - 关闭装置打开时，第二密封室的压力。

4. 发明授权

US4850709A Fabri-perot spectroscopy method and apparatus utilizing the same 失效
标题翻译： Fabri-perot光谱法和利用该法的装置
公开(公告)号：US4850709A
公开(公告)日：1989-07-25
申请号：US19665
申请日：1987-02-27
申请人： Mikichi Ban , Osamu Kakuchi , Hironori Yamamoto , Masaru Ohtsuka , Osamu Shiba , Kazuhiko Hara
发明人： Mikichi Ban , Osamu Kakuchi , Hironori Yamamoto , Masaru Ohtsuka , Osamu Shiba , Kazuhiko Hara
IPC分类号： G01J3/26
CPC分类号： G01J3/26
摘要： Fabri-Perot spectroscopy method comprises a step of directing a light beam at a first refraction angle to a first Fabri-Perot interference plate and a step of directing a light beam transmitted through the first Fabri-Perot interference plate to a second Fabri-Perot interference plate at a second refraction angle, and Fabri-Perot spectroscopy apparatus comprises Fabri-Perot interference plates, a control device for changing a spacing between the Fabri-Perot interference plates, a first optical device for directing a light beam to the first Fabri-Perot interference plate at a first refraction angle, a second optical device for directing the light beam transmitted through the Fabri-Perot interference plate at a second refraction angle different from the first refraction angle to the second Fabri-Perot interference plate, and a seal for externally sealing the Fabri-Perot interference plates. Gas for protecting the Fabri-Perot interference plates is filled in the sealed space.
摘要翻译： Fabri-Pérot光谱法包括将第一折射角的光束引导到第一Fabri-Pérot干涉板的步骤和将透射通过第一Fabri-Pérot干涉板的光束引导到第二Fabri-Pérot干涉平板以第二折射角，Fabri-Pérot光谱装置包括Fabri-Pérot干涉板，用于改变Fabri-Pérot干涉板之间的间距的控制装置，用于将光束引导到第一Fabri-Pérot的第一光学装置在第一折射角处的干涉板，用于将透射通过Fabri-Pérot干涉板的光束以不同于第一折射角的第二折射角引导到第二Fabri-Pérot干涉板的第二光学装置，以及用于外部的密封件密封Fabri-Pérot干涉板。用于保护Fabri-Pérot干涉板的气体填充在密封空间中。

5. 发明授权

US06776691B2 Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus 失效
标题翻译：抛光/清洁方法以及使用抛光装置制造布线部分的方法
公开(公告)号：US06776691B2
公开(公告)日：2004-08-17
申请号：US09971692
申请日：2001-10-09
申请人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
发明人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
IPC分类号： B24B100
CPC分类号： H01L21/67028 , B08B3/00 , B08B3/04 , B08B2203/005 , B24B37/04 , B24B57/02 , Y10T29/49165
摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.
摘要翻译：能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。

6. 发明授权

US06332835B1 Polishing apparatus with transfer arm for moving polished object without drying it 有权
标题翻译：抛光装置带有转移臂，用于移动抛光对象而不干燥
公开(公告)号：US06332835B1
公开(公告)日：2001-12-25
申请号：US09193858
申请日：1998-11-18
申请人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
发明人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
IPC分类号： B24B700
CPC分类号： H01L21/67028 , B08B3/00 , B08B3/04 , B08B2203/005 , B24B37/04 , B24B57/02 , Y10T29/49165
摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.
摘要翻译：能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。

7. 发明授权

US6004187A Method and apparatus for measuring film thickness and film thickness distribution during polishing 失效
标题翻译：研磨过程中测量薄膜厚度和薄膜厚度分布的方法和装置
公开(公告)号：US6004187A
公开(公告)日：1999-12-21
申请号：US917853
申请日：1997-08-27
申请人： Masaru Nyui , Mikichi Ban
发明人： Masaru Nyui , Mikichi Ban
IPC分类号： G01B11/06 , B24B49/12 , H01L21/66 , B24B49/00 , B24B5/00
CPC分类号： B24B37/013 , H01L22/26
摘要： Disclosed is a method of polishing the surface of a film provided on a substrate, by use of a polishing device, while relatively moving the film surface and the polishing device. The method includes a position detecting step for detecting a predetermined position on the surface of the film, a first measurement step for measuring an absolute value of the film thickness at the predetermined position, and a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through the first measurement step. The method also includes a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of a data obtained through the first and second measurement steps, and a control step for controlling continuation/discontinuation of polishing, on the basis of a data obtained through the film thickness distribution measurement step.
摘要翻译：公开了通过使用研磨装置，在使膜面和研磨装置相对移动的同时研磨设置在基板上的膜的表面的方法。该方法包括用于检测胶片表面上的预定位置的位置检测步骤，用于测量预定位置处的膜厚绝对值的第一测量步骤，以及用于测量胶片厚度信息的第二测量步骤基于通过第一测量步骤获得的测量值来关于预定位置。该方法还包括基于通过第一和第二测量步骤获得的数据以及用于控制抛光的持续/停止的控制步骤，用于检测膜的膜厚度分布的膜厚度分布测量步骤通过膜厚分布测量步骤获得的数据。

8. 发明授权

US4294538A Image forming optical system 失效
标题翻译：成像光学系统
公开(公告)号：US4294538A
公开(公告)日：1981-10-13
申请号：US116752
申请日：1980-01-30
申请人： Mikichi Ban
发明人： Mikichi Ban
IPC分类号： G02B17/06 , G02B27/00 , G03F7/20 , G03B27/48 , G02B21/18 , G03B27/50 , G03B27/70
CPC分类号： G02B17/0636 , G03F7/70066 , G03F7/702 , G03F7/70233 , G03F7/70358
摘要： An optical system for forming a spot object or an arcuate object into an arcuate image or a spot image. This optical system has a band-like spherical mirror obtained by sectioning a concave spherical mirror. By the band-like spherical mirror, the spot object disposed on the rotational symmetry axis other than the center of curvature may be imaged into an arcuate form on a certain surface perpendicular to the rotational symmetry axis. Conversely, an arcuate object on said certain surface may form a spot image at the position whereat the spot object is disposed.
摘要翻译：一种用于将斑点物体或弓形物体形成为弓形图像或斑点图像的光学系统。该光学系统具有通过对凹球面镜进行切片而获得的带状球面镜。通过带状球面镜，设置在除了曲率中心之外的旋转对称轴上的斑点物体可以在垂直于旋转对称轴线的某个表面上成像为弓形。相反，所述特定表面上的弓形物体可以在放置点对象的位置处形成斑点图像。

9. 发明授权

US06629882B2 Precise polishing apparatus and method 失效
公开(公告)号：US06629882B2
公开(公告)日：2003-10-07
申请号：US09970302
申请日：2001-10-04
申请人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
发明人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
IPC分类号： B24B2900
CPC分类号： B24B37/105 , B24B47/10 , B24B49/12 , H01L21/00 , H01L21/68764
摘要： The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.

10. 发明授权

US06390903B1 Precise polishing apparatus and method 失效
公开(公告)号：US06390903B1
公开(公告)日：2002-05-21
申请号：US09044147
申请日：1998-03-19
申请人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
发明人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
IPC分类号： B24B2900
CPC分类号： B24B37/105 , B24B47/10 , B24B49/12 , H01L21/00 , H01L21/68764
摘要： The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.

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