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    • 4. 发明授权
    • Solid-state chip cooling by use of microchannel coolant flow
    • 使用微通道冷却液流动的固态芯片冷却
    • US06388317B1
    • 2002-05-14
    • US09669468
    • 2000-09-25
    • Robert Michael Reese
    • Robert Michael Reese
    • H01L2334
    • H01L23/473H01L2924/0002H01L2924/3011H01L2924/00
    • A cooling arrangement useful for semiconductors or solid-state assemblages mounts the semiconductor or other solid-state device directly onto a first surface of a thermally conductive “heat spreader.” The heat spreader contains microchannels which open into coolant fluid ports on the second side of the heat spreader. The heat spreader, in turn, is mounted on a coolant fluid distribution or circulation plate. In one embodiment, the coolant fluid distribution plate also includes a micropump for circulating coolant fluid through the microchannels of the heat spreader. In another embodiment, the coolant fluid distribution plate simply distributes coolant applied to its fluid input port to those heat spreaders mounted thereon, and a plurality of coolant fluid distribution plates are mounted on a coolant fluid circulation plate, which uses a micropump to circulate coolant fluid to the various distribution plates and ultimately to the heat spreaders. Thus, coolant fluid is communicated directly into the support for the semiconductor chip or other solid-state device, for good heat transfer with low temperature drop.(178)
    • 用于半导体或固态组合的冷却装置将半导体或其它固态器件直接安装在导热“散热器”的第一表面上。 散热器包含微通道,其通向散热器第二侧上的冷却剂流体端口。 散热器又安装在冷却剂流体分配或循环板上。 在一个实施例中,冷却剂流体分配板还包括用于使冷却剂流体循环通过散热器的微通道的微型泵。 在另一个实施例中,冷却剂流体分配板简单地将施加到其流体输入端口的冷却剂分配到安装在其上的那些散热器,并且多个冷却剂流体分配板安装在冷却剂流体循环板上,该冷却剂流体分配板使用微型泵将冷却剂流体 到各种分配板,最终到散热器。 因此,冷却剂流体直接连接到用于半导体芯片或其它固态装置的支撑件中,用于具有低温降的良好热传递。(178)