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    • 2. 发明申请
    • Sensor and monitor system
    • 传感器和监视器系统
    • US20110160553A1
    • 2011-06-30
    • US12651213
    • 2009-12-31
    • Cary TalbotKris R. HoltzclawHans K. WanstadGary CohenBrian T. KannardKeith E. DeBrunnerJoseph Makram ArsaniousFan MengAndrew Michael BryanUlrich H. Rankers
    • Cary TalbotKris R. HoltzclawHans K. WanstadGary CohenBrian T. KannardKeith E. DeBrunnerJoseph Makram ArsaniousFan MengAndrew Michael BryanUlrich H. Rankers
    • A61B5/145
    • A61B5/14532A61B5/14514A61B2560/0209A61B2560/0276A61B2560/0412A61B2560/0443A61B2560/0456
    • A monitor system to monitor a characteristic of a user is disclosed. The monitor system includes a sensor to produce a signal indicative of a glucose characteristic measured in the user, the sensor further having a sensor port. The monitor system further includes a recorder within a recording housing, the recorder hosing also encompassing a batter. The recorder further includes a recorder port that interfaces with the sensor port in order to receive the produced signals from the sensor port. A recorder clock that assigns a time to the signals from the sensor is also defined within the recorder housing, as is a recorder processor that includes a recorder memory that is coupled to the recorder port to store the produced signals from the sensor. The recorder further includes a data port defined to interface with a dock receiver. A dock that is remotely located from the sensor and the recorder is also included with the monitor system. The dock includes the dock receiver that physically couples the recorder to the dock via the data port and a dock processor that is coupled to the dock receiver. The monitor system further includes a data processor defined to analyze the signals from the sensor that were stored in the recorder. The data processor includes: a data processor memory to store data from the recorder and a data processor clock. Further included with the data processor is a program to assign the time and date of the signals from the sensor by comparing the time and date on the data processor clock with the time assigned to the signals from the sensor by the recorder clock.
    • 公开了一种用于监视用户特性的监视器系统。 监视器系统包括传感器,用于产生指示在用户中测量的葡萄糖特性的信号,该传感器还具有传感器端口。 监视器系统还包括在记录外壳内的记录器,记录器还包括面糊。 记录器还包括与传感器端口接口以便从传感器端口接收所产生的信号的记录器端口。 在记录器外壳内也定义了一个将时间分配给传感器的信号的记录器时钟,记录器处理器还包括与记录器端口相连的记录器存储器,以存储来自传感器的信号。 记录器还包括被定义为与码头接收器接口的数据端口。 远程位于传感器和记录仪的底座也包含在监视器系统中。 码头包括通过数据端口将记录器物理耦合到坞站的坞站接收器和耦合到坞站接收器的坞站处理器。 监视器系统还包括定义为分析存储在记录器中的来自传感器的信号的数据处理器。 数据处理器包括:数据处理器存储器,用于存储来自记录器的数据和数据处理器时钟。 数据处理器还包括一个程序,通过将数据处理器时钟上的时间和日期与分配给传感器的信号的时间与记录器时钟进行比较,来分配来自传感器的信号的时间和日期。
    • 3. 发明申请
    • DISHWASHER APPLIANCE, AND ASSOCIATED METHOD
    • 洗衣机器具及相关方法
    • US20100326471A1
    • 2010-12-30
    • US12492465
    • 2009-06-26
    • Troy DalsingMichael Bryan PikeJason Duckworth
    • Troy DalsingMichael Bryan PikeJason Duckworth
    • B08B3/00
    • A47L15/4293D06F39/005
    • A dishwasher appliance is provided, and includes a control device configured to direct one of a series of automatic wash cycles to be executed by the dishwasher appliance. Each successive wash cycle within the series having an increased energy usage level over a previous automatic wash cycle, wherein each energy usage level is determined from at least one operational parameter associated with the respective automatic wash cycle. An actuator device is operably engaged with the control device, and is configured to be responsive to the user to select a subsequent automatic wash cycle to be executed by the dishwasher appliance as directed by the control device, the subsequent automatic wash cycle comprising one of a previous automatic wash cycle and a successive automatic wash cycle in the series of automatic wash cycles, with respect to the one of the series of automatic wash cycles. An associated method is also provided.
    • 提供了一种洗碗机装置,并且包括控制装置,其被配置为引导要由洗碗机装置执行的一系列自动洗涤循环中的一个。 该系列中的每个连续的洗涤循环具有比之前的自动洗涤循环增加的能量使用水平,其中每个能量使用水平由与相应的自动洗涤循环相关联的至少一个操作参数确定。 致动器装置与控制装置可操作地接合,并且被配置为响应于使用者选择将由洗碗机装置按照控制装置的指示执行的随后的自动洗涤循环,随后的自动洗涤循环包括 相对于一系列自动洗涤循环,先前的自动洗涤循环和一系列自动洗涤循环中的连续自动洗涤循环。 还提供了相关联的方法。
    • 4. 发明申请
    • LOWER RACK FOR A DISHWASHER AND ASSOCIATED APPARATUSES
    • 用于洗碗机和相关设备的下架
    • US20090151758A1
    • 2009-06-18
    • US11954711
    • 2007-12-12
    • Torkel KristenssonMichael Bryan Pike
    • Torkel KristenssonMichael Bryan Pike
    • A47L15/42A47L15/50
    • A47L15/507A47L15/4257
    • A lower rack for a dishwasher is provided, comprising a rack member movable into and out of the dishwasher along first and second tracks extending from the tub to an interior portion of the dishwasher door. The lower rack includes at least one rack roller mechanism on each laterally-opposed side portion of the rack member, for facilitating movement of the rack member with respect to the lower end of the tub and the interior portion of the open door. One of the rack roller mechanisms includes a leadingly-disposed stop portion, as the rack member is moved out of the lower end of the tub and along the interior portion of the open door for interacting with a stop feature of the corresponding one of the first and second tracks to limit egress of the rack member from the tub along the first and second tracks. Associated apparatuses are also provided.
    • 提供了一种用于洗碗机的下部机架,包括可从洗碗机延伸到洗碗机门的内部的第一和第二轨道移动进入和离开洗碗机的齿条构件。 下架在齿条构件的每个横向相对的侧部上包括至少一个齿条辊机构,以便于齿条构件相对于桶的下端和打开的门的内部的运动。 齿条辊机构中的一个包括一个引导设置的停止部分,因为齿条构件从桶的下端移动并且沿着打开的门的内部部分移动,以与第一 以及第二轨道,用于限制齿条构件沿着第一和第二轨道从桶排出。 还提供了相关装置。
    • 7. 发明授权
    • Method of processing a wafer utilizing a processing slurry
    • 使用处理浆料处理晶片的方法
    • US06354917B1
    • 2002-03-12
    • US09653097
    • 2000-08-31
    • Michael Bryan Ball
    • Michael Bryan Ball
    • B24B100
    • B24B37/24B24B37/04B24B37/042B24B37/16B24B57/02
    • A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body. The method of processing the wafer surface comprises the steps of: positioning a processing disk adjacent the wafer surface; causing the processing disk to move relative to the wafer surface; distributing a first processing slurry over the wafer surface as the processing disk moves relative to the wafer surface, wherein the first processing slurry comprises a first processing fluid and coarse processing particles; and, distributing a second processing slurry over the wafer surface as the processing disk moves relative to the wafer surface, wherein the second processing slurry comprises a second processing fluid and fine processing particles, wherein the coarse processing particles are larger than the fine processing particles.
    • 提供了使用处理浆料处理晶片的晶片处理装置和方法。 晶片处理盘包括处理盘体和固定到处理盘体的多个处理齿。 多个处理齿从盘体突出以限定相应的处理表面。 多个处理齿包括至少一对间隔开的相邻的齿,在其间限定了处理通道。 处理通道的形状使得处理通道的横截面积随其距处理盘体的距离而减小。 处理晶片表面的方法包括以下步骤:将处理盘定位在晶片表面附近; 使处理盘相对于晶片表面移动; 当处理盘相对于晶片表面移动时,将第一处理浆料分布在晶片表面上,其中第一处理浆料包括第一处理流体和粗加工颗粒; 以及当所述处理盘相对于所述晶片表面移动时,将第二处理浆料分布在所述晶片表面上,其中所述第二处理浆料包括第二处理流体和细加工颗粒,其中所述粗加工颗粒大于所述精加工颗粒。
    • 8. 发明授权
    • Wafer processing apparatus
    • 晶圆加工设备
    • US06234874B1
    • 2001-05-22
    • US09322520
    • 1999-05-28
    • Michael Bryan Ball
    • Michael Bryan Ball
    • B24B100
    • B24B37/24B24B37/04B24B37/042B24B37/16B24B57/02
    • A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body. The method of processing the wafer surface comprises the steps of: positioning a processing disk adjacent the wafer surface; causing the processing disk to move relative to the wafer surface; distributing a first processing slurry over the wafer surface as the processing disk moves relative to the wafer surface, wherein the first processing slurry comprises a first processing fluid and coarse processing particles; and, distributing a second processing slurry over the wafer surface as the processing disk moves relative to the wafer surface, wherein the second processing slurry comprises a second processing fluid and fine processing particles, wherein the coarse processing particles are larger than the fine processing particles.
    • 提供了使用处理浆料处理晶片的晶片处理装置和方法。 晶片处理盘包括处理盘体和固定到处理盘体的多个处理齿。 多个处理齿从盘体突出以限定相应的处理表面。 多个处理齿包括至少一对间隔开的相邻的齿,在其间限定了处理通道。 处理通道的形状使得处理通道的横截面积随其距处理盘体的距离而减小。 处理晶片表面的方法包括以下步骤:将处理盘定位在晶片表面附近; 使处理盘相对于晶片表面移动; 当处理盘相对于晶片表面移动时,将第一处理浆料分布在晶片表面上,其中第一处理浆料包括第一处理流体和粗加工颗粒; 以及当所述处理盘相对于所述晶片表面移动时,将第二处理浆料分布在所述晶片表面上,其中所述第二处理浆料包括第二处理流体和细加工颗粒,其中所述粗加工颗粒大于所述精加工颗粒。
    • 9. 发明授权
    • Method of processing a wafer utilizing a processing slurry
    • US6116988A
    • 2000-09-12
    • US322629
    • 1999-05-28
    • Michael Bryan Ball
    • Michael Bryan Ball
    • B24B37/04B24B57/02B24B1/00
    • B24B37/24B24B37/04B24B37/042B24B37/16B24B57/02
    • A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body. The method of processing the wafer surface comprises the steps of: positioning a processing disk adjacent the wafer surface; causing the processing disk to move relative to the wafer surface; distributing a first processing slurry over the wafer surface as the processing disk moves relative to the wafer surface, wherein the first processing slurry comprises a first processing fluid and coarse processing particles; and, distributing a second processing slurry over the wafer surface as the processing disk moves relative to the wafer surface, wherein the second processing slurry comprises a second processing fluid and fine processing particles, wherein the coarse processing particles are larger than the fine processing particles.
    • 10. 发明授权
    • Wafer processing apparatus and method of processing a wafer utilizing a
processing slurry
    • 晶片处理装置及利用处理浆料处理晶片的方法
    • US6074286A
    • 2000-06-13
    • US2759
    • 1998-01-05
    • Michael Bryan Ball
    • Michael Bryan Ball
    • B24B37/04B24B57/02B24B5/00B24B29/00
    • B24B37/24B24B37/04B24B37/042B24B37/16B24B57/02
    • A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body. The method of processing the wafer surface comprises the steps of: positioning a processing disk adjacent the wafer surface; causing the processing disk to move relative to the wafer surface; distributing a first processing slurry over the wafer surface as the processing disk moves relative to the wafer surface, wherein the first processing slurry comprises a first processing fluid and coarse processing particles; and, distributing a second processing slurry over the wafer surface as the processing disk moves relative to the wafer surface, wherein the second processing slurry comprises a second processing fluid and fine processing particles, wherein the coarse processing particles are larger than the fine processing particles.
    • 提供了使用处理浆料处理晶片的晶片处理装置和方法。 晶片处理盘包括处理盘体和固定到处理盘体的多个处理齿。 多个处理齿从盘体突出以限定相应的处理表面。 多个处理齿包括至少一对间隔开的相邻的齿,在其间限定了处理通道。 处理通道的形状使得处理通道的横截面积随其距处理盘体的距离而减小。 处理晶片表面的方法包括以下步骤:将处理盘定位在晶片表面附近; 使处理盘相对于晶片表面移动; 当处理盘相对于晶片表面移动时,将第一处理浆料分布在晶片表面上,其中第一处理浆料包括第一处理流体和粗加工颗粒; 以及当所述处理盘相对于所述晶片表面移动时,将第二处理浆料分布在所述晶片表面上,其中所述第二处理浆料包括第二处理流体和细加工颗粒,其中所述粗加工颗粒大于所述精加工颗粒。