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1. 发明申请

US20120024477A1 ROOM TEMPERATURE CURING EPOXY ADHESIVE 审中-公开
标题翻译：室温固化环氧胶
公开(公告)号：US20120024477A1
公开(公告)日：2012-02-02
申请号：US13147380
申请日：2010-02-03
申请人： Michael A. Kropp
发明人： Michael A. Kropp
IPC分类号： B67D7/74 , C09J163/00 , C09J163/02
CPC分类号： C09J163/00 , C08G59/50
摘要： Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.
摘要翻译：描述了室温固化环氧粘合剂。粘合剂含有环氧树脂，乙酰乙酰氧基官能化化合物，金属盐催化剂，当量重量至少为50克/当量的胺当量的第一胺固化剂和等效重量不大于超过45克每重量的胺当量。

2. 发明申请

US20100056725A1 DICING AND DIE ATTACH ADHESIVE 失效
标题翻译：涂装胶带
公开(公告)号：US20100056725A1
公开(公告)日：2010-03-04
申请号：US12530692
申请日：2008-03-07
申请人： Eric G. Larson , Michael A. Kropp , David J. Plaut , Cheryl L. Moore
发明人： Eric G. Larson , Michael A. Kropp , David J. Plaut , Cheryl L. Moore
IPC分类号： C08L33/08 , C08L33/14 , C08F2/46 , B05D5/10 , B32B37/12
CPC分类号： H01L21/6836 , C08L63/00 , C08L2666/02 , C08L2666/14 , C09J7/20 , C09J133/08 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01047 , H01L2924/01056 , H01L2924/01073 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2891 , H01L2924/00
摘要： Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.
摘要翻译：提供了单层粘合剂，其提供了晶片切割功能所需的粘合和清洁释放的适当平衡，并且还提供随后的管芯附着步骤中所需的必要的粘合。粘合剂组合物包括具有官能团的丙烯酸酯聚合物，多官能热固性树脂，其中丙烯酸酯聚合物和热固性树脂能够彼此反应，多官能丙烯酸酯，丙烯酸酯聚合催化剂或固化剂，适于固化多官能热固性树脂的热潜催化剂和丙烯酸盐。

3. 发明申请

US20090155597A1 CONDUCTIVE ADHESIVE PRECURSOR, METHOD OF USING THE SAME, AND ARTICLE 审中-公开
标题翻译：导电胶粘剂前体，使用它的方法和文章
公开(公告)号：US20090155597A1
公开(公告)日：2009-06-18
申请号：US12330770
申请日：2008-12-09
申请人： Michael A. Kropp , Robert L.D. Zenner
发明人： Michael A. Kropp , Robert L.D. Zenner
IPC分类号： B32B27/38 , B32B37/12 , C09J9/02
CPC分类号： H05K3/321 , C08K3/36 , C08K9/02 , C08L2666/54 , C09J4/00 , C09J9/02 , C09J163/00 , H05K2201/0281 , Y10T428/31515
摘要： A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive precursor can be cured to form a conductive adhesive useful for bonding two substrates together.
摘要翻译：导电粘合剂前体具有聚环氧化物，可自由基聚合的（甲基）丙烯酸酯，导电纤维，导电的基本上为球形的颗粒，触变剂，光引发剂和热固化剂。可以将导电粘合剂前体固化以形成用于将两个基底结合在一起的导电粘合剂。

4. 发明授权

US07327039B2 Nanoparticle filled underfill 有权
标题翻译：纳米颗粒填充底层填充物
公开(公告)号：US07327039B2
公开(公告)日：2008-02-05
申请号：US10441879
申请日：2003-05-20
申请人： Scott B. Charles , Kathleen M. Gross , Steven C. Hackett , Michael A. Kropp , William J. Schultz , Wendy L. Thompson
发明人： Scott B. Charles , Kathleen M. Gross , Steven C. Hackett , Michael A. Kropp , William J. Schultz , Wendy L. Thompson
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/295 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/16 , H01L2224/2929 , H01L2224/29386 , H01L2224/73203 , H01L2224/73204 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01029 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H05K3/305 , H01L2924/00 , H01L2924/0665 , H01L2924/05442
摘要： The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.
摘要翻译：本发明提供了制造所述制品的电子制品和方法。电子制品包括使用包含热固性树脂，固化催化剂和基本上球形，非聚集，无定形和固体的表面处理纳米颗粒的反应产物的底部填充粘合剂粘合并电连接到基底的电子部件。

5. 发明授权

US06670017B2 Photocurable form-in-place gasket for electronic applications 有权
公开(公告)号：US06670017B2
公开(公告)日：2003-12-30
申请号：US09947091
申请日：2001-09-04
申请人： Mitchell Huang , Michael A. Kropp
发明人： Mitchell Huang , Michael A. Kropp
IPC分类号： B32B320
CPC分类号： C08F8/00 , B29C67/246 , B29K2063/00 , B29L2031/265 , C08L63/08 , F16J15/102 , F16J15/14 , Y10T428/215 , Y10T428/31515 , C08F10/00
摘要： Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

6. 发明授权

US06664318B1 Encapsulant compositions with thermal shock resistance 有权
标题翻译：具有耐热冲击性的密封剂组合物
公开(公告)号：US06664318B1
公开(公告)日：2003-12-16
申请号：US09467455
申请日：1999-12-20
申请人： Richard M. Bymark , Frank Y. Xu , Rolf W. Biernath , Michael A. Kropp , Wayne S. Mahoney , Taun L. McKenzie , Wendy L. Thompson
发明人： Richard M. Bymark , Frank Y. Xu , Rolf W. Biernath , Michael A. Kropp , Wayne S. Mahoney , Taun L. McKenzie , Wendy L. Thompson
IPC分类号： C08K524
CPC分类号： C08L101/02 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.
摘要翻译：一种用于无溶剂，疏水树脂封装玻璃化转变温度低于0℃并含有非聚硅氧烷低聚物的热机械抗冲击固化组合物，其包含具有反应性官能度的柔性烃主链，最高约40重量％的粘合促进剂和任选的粘度调节组分。

7. 发明授权

US5856022A Energy-curable cyanate/ethylenically unsaturated compositions 失效
标题翻译：能量可固化的氰酸酯/烯属不饱和组合物
公开(公告)号：US5856022A
公开(公告)日：1999-01-05
申请号：US553622
申请日：1995-11-09
申请人： Fred B. McCormick , David J. Drath , Ilya Gorodisher , Michael A. Kropp , Michael C. Palazzotto , Melville R. V. Sahyun
发明人： Fred B. McCormick , David J. Drath , Ilya Gorodisher , Michael A. Kropp , Michael C. Palazzotto , Melville R. V. Sahyun
IPC分类号： C08F265/06 , F16F1/36 , H05K1/02 , H05K1/03 , B32B27/00
CPC分类号： F16F1/3605 , C08F265/06 , H05K1/0271 , H05K1/0353 , H05K1/0373 , Y10T428/31855 , Y10T428/31928
摘要： A composition of matter includes a polymerizable mixture comprising 1 to 99 weight percent of a first monomer and an initiator therefor, the first monomer being one of 1) at least one free-radically polymerizable monomer or 2) at least one cyanate ester monomer, and 99 to 1 weight percent of a second monomer and an initiator therefor, the second monomer being the member of 1) or 2) that is not selected as the first monomer, wherein the curative for the cyanate ester is a transition metal-containing organometallic compound curing agent and the curative for the free-radically polymerizable monomer is a free-radical generating curing agent or a transition metal-containing organometallic compound. The polymeric mixtures are useful, for example, in applications requiring high performance, such as high temperature performance; in composites, particularly structural composites; structural adhesives; vibration damping materials; electronic applications such as printed wiring boards, semiconductor encapsulants and electronic adhesives; photoresists; injection molding and prepregs; protective coatings; tough self-supporting films; and high performance binders. In addition, a curable composition comprising two partially polymerized mixed syrups of ethylenically unsaturated monomers is provided. These compositions are useful as the precursors for vibration damping materials. Further, a curable composition including (1) an ethylenically unsaturated monomer or (2) an ethylenically unsaturated monomer and a cyanate ester monomer, and certain organometallic neutral compounds is useful in the graphic arts.
摘要翻译： PCT No.PCT / US94 / 06756 Sec。 371日期：1995年11月9日 102（e）日期1995年11月9日PCT Filed 1994年6月15日PCT公布。公开号WO94 / 29369 日期1994年12月22日物质组成包括含有1至99重量％的第一单体和其引发剂的可聚合混合物，第一单体是1）至少一种可自由基聚合的单体之一或2）至少一种氰酸酯单体和99至1重量％的第二单体及其引发剂，第二单体为1）或2）未被选择为第一单体的成员，其中氰酸酯的固化剂为过渡含金属的有机金属化合物固化剂和可自由基聚合的单体的固化剂是产生自由基的固化剂或含过渡金属的有机金属化合物。聚合物混合物可用于例如需要高性能的应用，例如高温性能; 在复合材料中，特别是结构复合材料; 结构胶; 振动阻尼材料; 电子应用如印刷线路板，半导体密封剂和电子粘合剂; 光致抗蚀剂注塑和预浸料; 保护涂层; 强硬的自我支持的电影; 和高性能粘合剂。此外，提供了包含两种部分聚合的烯属不饱和单体的混合糖浆的可固化组合物。这些组合物可用作减振材料的前体。此外，包含（1）烯键式不饱和单体或（2）烯键式不饱和单体和氰酸酯单体以及某些有机金属中性化合物的可固化组合物可用于图形领域。

8. 发明授权

US5672400A Electronic assembly with semi-crystalline copolymer adhesive 失效
标题翻译：电子组装与半结晶共聚物粘合剂
公开(公告)号：US5672400A
公开(公告)日：1997-09-30
申请号：US576710
申请日：1995-12-21
申请人： Dennis D. Hansen , Michael A. Kropp , Glen Connell
发明人： Dennis D. Hansen , Michael A. Kropp , Glen Connell
IPC分类号： B32B27/00 , C08G69/40 , C08G69/44 , C09J9/02 , C09J177/00 , C09J177/12 , H01B1/22 , H05K3/32 , H05K3/36 , B32B9/00
CPC分类号： H05K3/323 , B32B27/00 , C08G69/40 , C08G69/44 , C09J177/00 , C09J177/12 , C09J9/02 , H01B1/22 , H05K2201/0129 , H05K2201/0141 , H05K3/361 , Y10S428/901 , Y10T428/14 , Y10T428/24917
摘要： The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition, preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern on a first substrate to a second circuit pattern on a second substrate. The adhesive composition preferably includes a semi-crystalline copolymer comprising polyether and polyamide monomeric units, a tackifier, and conductive particles.
摘要翻译：本发明提供了一种微电子组件，其中优选以薄膜形式提供的半结晶共聚物粘合剂组合物用于将第一衬底上的第一电路图案与第二衬底上的第二电路图案电互连。粘合剂组合物优选包括包含聚醚和聚酰胺单体单元的半结晶共聚物，增粘剂和导电颗粒。

9. 发明授权

US5252694A Energy-polymerization adhesive, coating, film and process for making the same 失效
标题翻译：能量聚合粘合剂，涂料，薄膜及其制造方法
公开(公告)号：US5252694A
公开(公告)日：1993-10-12
申请号：US823819
申请日：1992-01-22
申请人： Peggy S. Willett , Janis Robins , Kent S. Tarbutton , Michael A. Kropp
发明人： Peggy S. Willett , Janis Robins , Kent S. Tarbutton , Michael A. Kropp
IPC分类号： C08G65/04 , C08F2/48 , C08F4/00 , C08F4/26 , C08F4/28 , C08F4/42 , C08F4/74 , C08F290/14 , C08G59/68 , C08G65/02 , C09D4/00 , C09D163/10 , C09J4/00 , C09J163/10 , H05K3/32 , C08F283/06
CPC分类号： C08F290/144 , C08G59/68 , H05K3/321 , Y10T428/12007
摘要： Polymerizable compositions having at least one cationically polymerizable monomer; an optional free radically polymerizable monomer; an energy-polymerizable catalyst system wherein the catalyst system comprises an organometallic complex salt; a thermally decomposable ester reaction product of a tertiary alkyl alcohol and an acid that forms a chelation complex with the metal ion of the organometallic complex salt; optionally, a peroxide. The polymerized compositions are useful as cured adhesive films, pressure sensitive adhesives, protective coatings, liquid adhesives, structural and semi-structural adhesives, and free standing films.
摘要翻译：具有至少一个阳离子可聚合单体的可聚合组合物; 可选的可自由基聚合单体; 能量可聚合催化剂体系，其中催化剂体系包含有机金属络合盐; 叔烷基醇与形成与有机金属配盐的金属离子的螯合络合物的酸的热分解酯反应产物; 任选地，过氧化物。聚合的组合物可用作固化的粘合剂膜，压敏粘合剂，保护涂层，液体粘合剂，结构和半结构粘合剂和自立膜。

10. 发明授权

US09456513B2 Article with gasket having moisture transmission resistivity and method 有权
标题翻译：具有透湿电阻率和方法的垫片
公开(公告)号：US09456513B2
公开(公告)日：2016-09-27
申请号：US12705008
申请日：2010-02-12
申请人： Scott B. Charles , Michael A. Kropp , Ashu N. Mujumdar
发明人： Scott B. Charles , Michael A. Kropp , Ashu N. Mujumdar
IPC分类号： H05K5/06
CPC分类号： H05K5/061 , H05K5/062
摘要： This disclosure relates to gasket materials used for attaching and sealing covers to enclosures. More particularly, this disclosure relates to form-in-place gaskets, applied to surfaces of containers for sensitive electronic components. The gaskets include a flexible polymer and a micropowder polyolefin filler.
摘要翻译：本公开涉及用于将盖子附接和密封到外壳上的垫圈材料。更具体地说，本公开内容涉及适用于敏感电子部件的容器表面的成形衬垫。垫片包括柔性聚合物和微粉聚烯烃填料。

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