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1. 发明授权

US09717452B2 Handheld medical diagnostic devices with lancing speed control 有权
公开(公告)号：US09717452B2
公开(公告)日：2017-08-01
申请号：US12981816
申请日：2010-12-30
申请人： Steven N. Roe , Chris Fruhauf , Max Chen
发明人： Steven N. Roe , Chris Fruhauf , Max Chen
IPC分类号： A61B5/15 , A61B5/151 , A61B5/157
CPC分类号： A61B5/150419 , A61B5/150022 , A61B5/150167 , A61B5/150175 , A61B5/150267 , A61B5/150427 , A61B5/150503 , A61B5/150572 , A61B5/150946 , A61B5/15113 , A61B5/15117 , A61B5/15132 , A61B5/15151 , A61B5/15161 , A61B5/15182 , A61B5/157
摘要： A method of controlling lancing speed of a lancing structure of a portable handheld medical diagnostic device includes providing an elongated lancet structure having a skin piercing end and a blood transport portion adjacent the skin piercing end. The skin piercing end when displaced makes an incision at a skin site to produce an amount of bodily fluid from the skin site and in which the blood transport portion transports the amount of bodily fluid away from the skin site for use by a measurement system in making a physiological measurement. A spring-driven motor assembly is operatively connected to the lancet structure. The spring-driven motor assembly displaces the lancet structure toward the skin site to make the incision for producing the amount of bodily fluid and retracts the lancet structure to carry the amount of bodily fluid away from the skin cite. A speed control mechanism is engaged with the spring-driven motor assembly as the spring-driven motor assembly retracts the lancet structure thereby decelerating the lancet structure as the lancet structure is retracted away from the skin site.

2. 发明申请

US20120172760A1 Handheld Medical Diagnostic Devices With Lancing Speed Control 有权
标题翻译：带有牵引速度控制的手持式医疗诊断装置
公开(公告)号：US20120172760A1
公开(公告)日：2012-07-05
申请号：US12981816
申请日：2010-12-30
申请人： Steven N. Roe , Chris Fruhauf , Max Chen
发明人： Steven N. Roe , Chris Fruhauf , Max Chen
IPC分类号： A61B5/151
CPC分类号： A61B5/150419 , A61B5/150022 , A61B5/150167 , A61B5/150175 , A61B5/150267 , A61B5/150427 , A61B5/150503 , A61B5/150572 , A61B5/150946 , A61B5/15113 , A61B5/15117 , A61B5/15132 , A61B5/15151 , A61B5/15161 , A61B5/15182 , A61B5/157
摘要： A method of controlling lancing speed of a lancing structure of a portable handheld medical diagnostic device includes providing an elongated lancet structure having a skin piercing end and a blood transport portion adjacent the skin piercing end. The skin piercing end when displaced makes an incision at a skin site to produce an amount of bodily fluid from the skin site and in which the blood transport portion transports the amount of bodily fluid away from the skin site for use by a measurement system in making a physiological measurement. A spring-driven motor assembly is operatively connected to the lancet structure. The spring-driven motor assembly displaces the lancet structure toward the skin site to make the incision for producing the amount of bodily fluid and retracts the lancet structure to carry the amount of bodily fluid away from the skin cite. A speed control mechanism is engaged with the spring-driven motor assembly as the spring-driven motor assembly retracts the lancet structure thereby decelerating the lancet structure as the lancet structure is retracted away from the skin site.
摘要翻译：一种控制便携式手持式医疗诊断装置的穿刺结构的穿刺速度的方法包括：提供具有皮肤刺穿端的细长刺血针结构和邻近皮肤刺穿端的血液输送部分。移位时的皮肤穿刺端在皮肤部位进行切口，以从皮肤部位产生一定量的体液，其中血液输送部分将体液的量从皮肤部位输送出去，以供测量系统制造生理测量。弹簧驱动的马达组件可操作地连接到刺血针结构。弹簧驱动的马达组件将柳叶刀结构移动到皮肤部位，以形成用于产生体液量的切口，并使柳叶刀结构缩回以将体液的数量远离皮肤引诱。当弹簧驱动的马达组件缩回柳叶刀结构，从而当刺血针结构从皮肤部位缩回时使柳叶刀结构减速，速度控制机构与弹簧驱动马达组件接合。

3. 发明授权

US07639492B2 Drive carrier for computer systems 有权
标题翻译：电脑系统的驱动器
公开(公告)号：US07639492B2
公开(公告)日：2009-12-29
申请号：US11741666
申请日：2007-04-27
申请人： Fred C. Thomas , Max Chen , Arthur Sandoval , Travis Lee , Matthew Peterson
发明人： Fred C. Thomas , Max Chen , Arthur Sandoval , Travis Lee , Matthew Peterson
IPC分类号： H05K5/00 , H05K7/00
CPC分类号： G11B33/128 , G06F1/187 , G11B33/1493
摘要： A drive carrier for computer systems. At least some of the illustrative embodiments are drive carriers comprising a first suspension member that defines a first side of the drive carrier, a second suspension member that defines a second side of the drive carrier (the second suspension member configured to be manually flexed resiliently away from the drive carrier during installation of a disk drive), a handle having a hinge point coupled to the suspension members (the hinge point defining an axis of rotation for the handle, and the axis of rotation lies substantially parallel to a plane in which both suspension members reside), a first pin configured to couple to a mounting hole of the disk drive (and the first pin coupled to the first suspension member), and a second pin configured to couple to a mounting hole of the disk drive (and the second pin coupled to the second suspension member, wherein the first and second pins suspend the disk drive within the drive carrier between the suspension members).
摘要翻译：计算机系统的驱动器载体。示例性实施例中的至少一些是包括限定驱动器载体的第一侧的第一悬挂构件的驱动载体，限定驱动载体的第二侧的第二悬架构件（第二悬架构件被构造成手动地弹性地远离在安装磁盘驱动器期间从驱动器载体），手柄具有联接到悬挂构件的铰接点（铰链点限定用于手柄的旋转轴线，并且旋转轴线基本上平行于两个悬挂构件），构造成联接到盘驱动器（和联接到第一悬架构件的第一销）的安装孔的第一销和被配置为联接到盘驱动器的安装孔（和第二销耦合到第二悬挂构件，其中第一和第二引脚将盘驱动器悬挂在驱动载体内的悬架构件之间）。

4. 发明授权

US06927094B2 Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wires 有权
标题翻译：使用导电棒而非接合线组装半导体芯片的方法
公开(公告)号：US06927094B2
公开(公告)日：2005-08-09
申请号：US10449488
申请日：2003-05-30
申请人： Max Chen , Ching Lu Hsu , Kuang Hann Lin , Yan-Man Tsui
发明人： Max Chen , Ching Lu Hsu , Kuang Hann Lin , Yan-Man Tsui
IPC分类号： H01L21/60 , H01L23/495 , H01L23/50 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/49562 , H01L23/49537 , H01L23/49568 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/451 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2924/00014 , H01L2924/01057 , H01L2924/13091 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： The present invention provides a semiconductor device packaging assembly and method for manufacturing the assembly. Preferably, the method of the present invention is used to assemble a plurality of semiconductor chips, such that the throughput of assembly can be enhanced. The method comprises the steps of: providing a bottom frame matrix including a plurality of bottom frame units, each of which unit comprises a bottom supporting portion and a bottom frame portion; providing a bridge frame including a plurality of bridge frame units, each of which unit comprises a bridge frame portion and a plurality of conducting bars; placing each of the semiconductor chips on each of the bottom supporting portions, respectively; and bonding each bottom frame unit and each bridge frame unit together, wherein, the conducting bars extending from each bridge frame portion toward corresponding chips are electrically coupled to bonding areas of the corresponding chips.
摘要翻译：本发明提供一种用于制造组件的半导体器件封装组件和方法。优选地，本发明的方法用于组装多个半导体芯片，使得可以提高组装的吞吐量。该方法包括以下步骤：提供包括多个底部框架单元的底部框架矩阵，每个底部框架单元包括底部支撑部分和底部框架部分; 提供一种桥框架，其包括多个桥架单元，每个桥架单元包括桥架部分和多个导电杆; 将每个半导体芯片分别放置在每个底部支撑部分上; 并且将每个底架单元和每个桥架单元结合在一起，其中，从每个桥架部分朝向相应的芯片延伸的导电棒电耦合到相应芯片的接合区域。

5. 发明授权

US06576985B2 Semiconductor device packaging assembly 有权
标题翻译：半导体器件封装组件
公开(公告)号：US06576985B2
公开(公告)日：2003-06-10
申请号：US09764955
申请日：2001-01-18
申请人： Max Chen , Ching Lu Hsu , Kuang Hann Lin , Yan-Man Tsui
发明人： Max Chen , Ching Lu Hsu , Kuang Hann Lin , Yan-Man Tsui
IPC分类号： H01L23495
CPC分类号： H01L23/49562 , H01L23/49537 , H01L23/49568 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/451 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2924/00014 , H01L2924/01057 , H01L2924/13091 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： The present invention provides a semiconductor device packaging assembly and method for manufacturing the assembly. Preferably, the method of the present invention is used to assemble a plurality of semiconductor chips, such that the throughput of assembly can be enhanced, by providing a bottom frame matrix including a plurality of bottom frame units, each of which unit includes a bottom supporting portion and a bottom frame portion; providing a bridge frame including a plurality of bridge frame units, each of which unit includes a bridge frame portion and a plurality of conducting bars; placing each of the semiconductor chips on each of the bottom supporting portions, respectively; and bonding each bottom frame unit and each bridge frame unit together, wherein, the conducting bars extending from each bridge frame portion toward corresponding chips are electrically coupled to bonding areas of the corresponding chips.
摘要翻译：本发明提供一种用于制造组件的半导体器件封装组件和方法。优选地，本发明的方法用于组装多个半导体芯片，使得可以通过提供包括多个底部框架单元的底部框架矩阵来提高组装的生产能力，每个底部框架单元包括底部支撑部分和底部框架部分; 提供一种桥架，包括多个桥架单元，每个桥架单元包括桥框部分和多个导电杆; 将每个半导体芯片分别放置在每个底部支撑部分上; 并且将每个底架单元和每个桥架单元结合在一起，其中，从每个桥架部分朝向相应的芯片延伸的导电棒电耦合到相应芯片的接合区域。

6. 发明授权

US06518152B2 Method of forming a trench schottky rectifier 失效
标题翻译：形成沟槽肖特基整流器的方法
公开(公告)号：US06518152B2
公开(公告)日：2003-02-11
申请号：US10043633
申请日：2002-01-10
申请人： Fwu-Iuan Hshieh , Max Chen , Koon Chong So , Yan Man Tsui
发明人： Fwu-Iuan Hshieh , Max Chen , Koon Chong So , Yan Man Tsui
IPC分类号： H01L2128
CPC分类号： H01L29/8725 , H01L29/872
摘要： A Schottky rectifier is provided. The Schottky rectifier comprises: (a) a semiconductor region having first and second opposing faces, with the semiconductor region comprising a cathode region of first conductivity type adjacent the first face and a drift region of the first conductivity type adjacent the second face, and with the drift region having a lower net doping concentration than that of the cathode region; (b) one or more trenches extending from the second face into the semiconductor region and defining one or more mesas within the semiconductor region; (c) an insulating region adjacent the semiconductor region in lower portions of the trench; (d) and an anode electrode that is (i) adjacent to and forms a Schottky rectifying contact with the semiconductor at the second face, (ii) adjacent to and forms a Schottky rectifying contact with the semiconductor region within upper portions of the trench and (iii) adjacent to the insulating region within the lower portions of the trench.
摘要翻译：提供肖特基整流器。肖特基整流器包括：（a）具有第一和第二相对面的半导体区域，半导体区域包括邻近第一面的第一导电类型的阴极区域和与第二面相邻的第一导电类型的漂移区域，以及漂移区具有比阴极区更低的净掺杂浓度; （b）从所述第二面延伸到所述半导体区域并限定所述半导体区域内的一个或多个台面的一个或多个沟槽; （c）与沟槽下部的半导体区相邻的绝缘区; （d）和阳极电极（i）在第二面处与半导体相邻并形成肖特基整流接触，（ii）与沟槽上部的半导体区域相邻并形成肖特基整流接触，以及（iii）与沟槽下部的绝缘区域相邻。

7. 发明授权

US08059941B2 Multiplex DVD player 有权
标题翻译：复用DVD播放机
公开(公告)号：US08059941B2
公开(公告)日：2011-11-15
申请号：US11104263
申请日：2005-04-12
申请人： Max Chen
发明人： Max Chen
IPC分类号： H04N5/84 , H04N5/78 , H04N5/928 , H04N7/167 , H04N7/173 , H04N9/80 , G06F13/00 , G06F17/00 , G10L19/00 , H04B1/00 , H04B1/66
CPC分类号： G11B27/105 , G11B27/10 , G11B2220/2562 , H04N5/85 , H04N9/7921 , H04N9/8042 , H04N9/8211
摘要： A method for playing DVD. A method for simultaneously outputting a DVD movie to multiple channels each having its own playback parameters such as view angle, spoken language and subtitle language, using a single DVD player.
摘要翻译：播放DVD的方法。一种使用单个DVD播放器同时将DVD影像同时输出到多个频道的方法，每个频道具有其自己的播放参数，例如视角，口语和字幕语言。

8. 发明申请

US20050169608A1 Method for adjusting display of sub-picture in audio/video playback device 审中-公开
标题翻译：用于调整音频/视频播放设备中子画面显示的方法
公开(公告)号：US20050169608A1
公开(公告)日：2005-08-04
申请号：US11031436
申请日：2005-01-07
申请人： Chin-Cheng Shen , Max Chen
发明人： Chin-Cheng Shen , Max Chen
IPC分类号： G06F1/00 , H04N5/445 , H04N5/76 , H04N5/781 , H04N5/85 , H04N9/82
CPC分类号： H04N9/8227 , H04N5/445 , H04N5/85 , H04N21/4312
摘要： A method for adjusting a display of a sub-picture in an audio/video (AV) playback device is disclosed. The method provides a set of sub-picture adjusting parameter for adjusting display format of the sub-picture. The set of sub-picture adjusting parameter includes a sub-picture location adjusting parameter for adjusting display location of the sub-picture or a sub-picture size adjusting parameter for adjusting display size of the sub-picture. An input apparatus of the AV playback device is used to set the set of sub-picture adjusting parameter. The AV playback device determines, adjusts and displays the sub-picture according to the set of sub-picture adjusting parameter.
摘要翻译：公开了一种用于调整音频/视频（AV）播放设备中的子画面的显示的方法。该方法提供一组子画面调整参数，用于调整子画面的显示格式。副图像调整参数的集合包括用于调整副图像的显示位置的子图像位置调整参数或用于调整子图像的显示尺寸的子图像尺寸调整参数。 AV重放装置的输入装置用于设定子画面调整参数的集合。 AV重放装置根据副图像调整参数的集合来确定，调整和显示子画面。

9. 发明授权

US06707127B1 Trench schottky rectifier 有权
标题翻译：沟槽肖特基整流器
公开(公告)号：US06707127B1
公开(公告)日：2004-03-16
申请号：US09653084
申请日：2000-08-31
申请人： Fwu-Iuan Hshieh , Max Chen , Koon Chong So , Yan Man Tsui
发明人： Fwu-Iuan Hshieh , Max Chen , Koon Chong So , Yan Man Tsui
IPC分类号： H01L27095
CPC分类号： H01L29/8725 , H01L29/872
摘要： A Schottky rectifier is provided. The Schottky rectifier comprises: (a) a semiconductor region having first and second opposing faces, with the semiconductor region comprising a cathode region of first conductivity type adjacent the first face and a drift region of the first conductivity type adjacent the second face, and with the drift region having a lower net doping concentration than that of the cathode region; (b) one or more trenches extending from the second face into the semiconductor region and defining one or more mesas within the semiconductor region; (c) an insulating region adjacent the semiconductor region in lower portions of the trench; (d) and an anode electrode that is (i) adjacent to and forms a Schottky rectifying contact with the semiconductor at the second face, (ii) adjacent to and forms a Schottky rectifying contact with the semiconductor region within upper portions of the trench and (iii) adjacent to the insulating region within the lower portions of the trench.
摘要翻译：提供肖特基整流器。肖特基整流器包括：（a）具有第一和第二相对面的半导体区域，半导体区域包括邻近第一面的第一导电类型的阴极区域和与第二面相邻的第一导电类型的漂移区域，以及漂移区具有比阴极区更低的净掺杂浓度; （b）从所述第二面延伸到所述半导体区域并限定所述半导体区域内的一个或多个台面的一个或多个沟槽; （c）与沟槽下部的半导体区相邻的绝缘区; （d）和阳极电极（i）在第二面处与半导体相邻并形成肖特基整流接触，（ii）与沟槽上部的半导体区域相邻并形成肖特基整流接触，以及（iii）与沟槽下部的绝缘区域相邻。

10. 外观设计

USD429248S Bezel for a computer 失效
公开(公告)号：USD429248S
公开(公告)日：2000-08-08
申请号：US108315
申请日：1999-07-23
申请人： Michael Alan Koken , Max Chen , David K. Peschel
设计人： Michael Alan Koken , Max Chen , David K. Peschel

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