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    • 1. 发明授权
    • Method and apparatus for inspecting wire breaking of integrated circuit
    • 用于检查集成电路断线的方法和装置
    • US06980010B2
    • 2005-12-27
    • US10760549
    • 2004-01-21
    • Masayoshi TonouchiKodo KawaseTomoya HirosumiRyoichi Fukusawa
    • Masayoshi TonouchiKodo KawaseTomoya HirosumiRyoichi Fukusawa
    • G01R31/02G01R31/302G01R31/311H01L21/66
    • G01R31/311
    • An apparatus that inspects wire breaking of a semiconductor integrated circuit includes a voltage applying device (12), a light pulse source (14), a scanning device (16), an electromagnetic wave detection device (18), and a wire breaking detection device (20). The voltage applying device (12) maintains a semiconductor integrated circuit in a state where a predetermined voltage is being applied thereto. The light pulse source (14) generates an ultrashort light pulse (2). The scanning device (16) two-dimensionally scans and irradiates the two-dimensional circuit of the semiconductor integrated circuit by using the ultrashort light pulse (2). The electromagnetic wave detection device (18) detects an electromagnetic wave (3) radiated from a position irradiated with the ultrashort light pulse on the semiconductor integrated circuit. The wire breaking detection device (20) detects wire breaking of the irradiated position based on presence and absence or intensity of the electromagnetic wave.
    • 检查半导体集成电路的断线的装置包括电压施加装置(12),光脉冲源(14),扫描装置(16),电磁波检测装置(18)和断线检测装置 (20)。 电压施加装置(12)将半导体集成电路保持在施加预定电压的状态。 光脉冲源(14)产生超短光脉冲(2)。 扫描装置(16)通过使用超短光脉冲(2)二维地扫描并照射半导体集成电路的二维电路。 电磁波检测装置(18)检测从半导体集成电路上的超短光脉冲照射的位置辐射的电磁波(3)。 断线检测装置(20)基于有无电磁波的强度来检测照射位置的断线。
    • 2. 发明申请
    • Method and apparatus for diagnosing fault in semiconductor device
    • 用于诊断半导体器件故障的方法和装置
    • US20060006886A1
    • 2006-01-12
    • US11038485
    • 2005-01-21
    • Masatsugu YamashitaKodo KawaseMasayoshi TonouchiToshihiro KiwaKiyoshi Nikawa
    • Masatsugu YamashitaKodo KawaseMasayoshi TonouchiToshihiro KiwaKiyoshi Nikawa
    • G01R31/305
    • G01R31/311
    • An apparatus for diagnosing a fault in a semiconductor device includes an laser applying unit, a detection/conversion unit, and a fault diagnosis unit. The semiconductor device is held at a state where no bias voltage is applied thereto. The laser applying unit then applies a pulse laser beam having a predetermined wavelength to the semiconductor device so as to two-dimensionally scan the semiconductor device with the pulse laser beam. The detection/conversion unit detects an electromagnetic wave generated from a laser applied position in the semiconductor device, and converts the detected electromagnetic wave into a time-varying voltage signal that corresponds to a time-varying amplitude of an electric field of the electromagnetic wave. The fault diagnosis unit derives an electric field distribution in the semiconductor device on the basis of the time-varying voltage signal to perform fault diagnosis on the semiconductor device.
    • 用于诊断半导体器件中的故障的装置包括激光施加单元,检测/转换单元和故障诊断单元。 半导体器件保持在不施加偏置电压的状态。 激光施加单元然后将具有预定波长的脉冲激光束施加到半导体器件,以便用脉冲激光束对半导体器件进行二维扫描。 检测/转换单元检测从半导体器件中的激光施加位置产生的电磁波,并将检测到的电磁波转换成对应于电磁波的电场的时变幅度的时变电压信号。 故障诊断单元根据时变电压信号,在半导体装置中导出电场分布,对半导体装置进行故障诊断。