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    • 1. 发明授权
    • Ion implantation method and ion implantation apparatus
    • 离子注入法和离子注入装置
    • US08368036B2
    • 2013-02-05
    • US13128414
    • 2009-08-31
    • Masayoshi Hino
    • Masayoshi Hino
    • H01J37/317
    • H01J37/3171H01J37/1472H01J2237/31706H01L21/26586H01L29/6659
    • An ion implantation method and the like by which a circular implantation region and a peripheral implantation region surrounding it and the dose amount of which is different from that of the circular implantation region can be formed within the surface of the substrate without the use of the step rotation of the substrate. The ion implantation method is forms a circular implantation region and a peripheral implantation region surrounding it and a dose amount of which is different from that of the circular implantation region within a surface of the substrate by making variable a scanning speed of the ion beam 4 within the surface of the substrate and changing a scanning speed distribution, in an X direction, of the ion beam within the surface of the substrate for each one-way scanning or each reciprocative scanning, according to a position of the substrate in a Y direction.
    • 可以在衬底的表面内形成圆形注入区域和围绕它的周边注入区域并且其剂量不同于圆形注入区域的离子注入方法等,而不使用步骤 基板的旋转。 离子注入方法通过使离子束4的扫描速度可变,形成圆周注入区域和围绕其的外围注入区域,并且其剂量不同于衬底表面内的圆形注入区域的量 根据基板在Y方向上的位置,在每个单向扫描或每次往复扫描中改变基板的表面内的离子束在X方向上的扫描速度分布。
    • 2. 发明申请
    • ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS
    • 离子植入方法和离子植入装置
    • US20120104285A9
    • 2012-05-03
    • US13128414
    • 2009-08-31
    • Masayoshi Hino
    • Masayoshi Hino
    • H01J37/317H01L21/265
    • H01J37/3171H01J37/1472H01J2237/31706H01L21/26586H01L29/6659
    • An ion implantation method and the like by which a circular implantation region and a peripheral implantation region surrounding it and the dose amount of which is different from that of the circular implantation region can be formed within the surface of the substrate without the use of the step rotation of the substrate. The ion implantation method forms a circular implantation region and a peripheral implantation region surrounding it and a dose amount of which is different from that of the circular implantation region within a surface of the substrate by making variable a scanning speed of the ion beam 4 within the surface of the substrate and changing a scanning speed distribution, in an X direction, of the ion beam within the surface of the substrate for each one-way scanning or each reciprocative scanning, according to a position of the substrate in a Y direction.
    • 可以在衬底的表面内形成圆形注入区域和围绕它的周边注入区域并且其剂量不同于圆形注入区域的离子注入方法等,而不使用步骤 基板的旋转。 离子注入方法通过使离子束4的扫描速度可变,形成圆周注入区域和围绕其的周边注入区域,并且其剂量不同于衬底表面内的圆形注入区域的量 根据基板在Y方向上的位置,对于每个单向扫描或每次往复扫描,改变基板的表面内的离子束在X方向上的扫描速度分布。
    • 3. 发明申请
    • ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS
    • 离子植入方法和离子植入装置
    • US20110215263A1
    • 2011-09-08
    • US13128414
    • 2009-08-31
    • Masayoshi Hino
    • Masayoshi Hino
    • H01J37/317H01L21/265
    • H01J37/3171H01J37/1472H01J2237/31706H01L21/26586H01L29/6659
    • An ion implantation method and the like by which a circular implantation region and a peripheral implantation region surrounding it and the dose amount of which is different from that of the circular implantation region can be formed within the surface of the substrate without the use of the step rotation of the substrate. The ion implantation method is forms a circular implantation region and a peripheral implantation region surrounding it and a dose amount of which is different from that of the circular implantation region within a surface of the substrate by making variable a scanning speed of the ion beam 4 within the surface of the substrate and changing a scanning speed distribution, in an X direction, of the ion beam within the surface of the substrate for each one-way scanning or each reciprocative scanning, according to a position of the substrate in a Y direction.
    • 可以在衬底的表面内形成圆形注入区域和围绕它的周边注入区域并且其剂量不同于圆形注入区域的离子注入方法等,而不使用步骤 基板的旋转。 离子注入方法通过使离子束4的扫描速度可变,形成圆周注入区域和围绕其的外围注入区域,并且其剂量不同于衬底表面内的圆形注入区域的量 根据基板在Y方向上的位置,在每个单向扫描或每次往复扫描中改变基板的表面内的离子束在X方向上的扫描速度分布。
    • 4. 发明授权
    • Ion implantation method and apparatus
    • 离子注入方法和装置
    • US07935946B2
    • 2011-05-03
    • US12369307
    • 2009-02-11
    • Masayoshi Hino
    • Masayoshi Hino
    • A61N5/00G21G5/00
    • H01L21/265H01J37/20H01J37/304H01J37/3171H01J2237/20207H01J2237/20214H01J2237/20228H01J2237/20235H01J2237/31703
    • Using a beam current of an ion beam, a dose amount to a substrate, and a reference scan speed, a scan number of the substrate is calculated as an integer value in which digits after a decimal point are truncated. If the scan number is smaller than 2, the process is aborted. If the scan number is equal to or larger than 2, it is determined whether the scan number is even or odd. If the scan number is even, the current scan number is set as a practical scan number. If the scan number is odd, an even scan number which is smaller by 1 than the odd scan number is obtained, and the obtained even scan number is set as a practical scan number. A practical scan speed of the substrate is calculated by using the practical scan number, the beam current, and the dose amount.
    • 使用离子束的束电流,对基板的剂量量和参考扫描速度,计算基板的扫描编号,其中小数点后的数字被截断的整数值。 如果扫描次数小于2,则中止该过程。 如果扫描次数等于或大于2,则确定扫描号是偶数还是奇数。 如果扫描号为偶数,则将当前扫描号设置为实际的扫描号。 如果扫描数是奇数,则获得比奇数扫描数小1的偶数扫描数,将所得到的偶数扫描数设定为实际扫描次数。 通过使用实际扫描数,束电流和剂量来计算基板的实际扫描速度。
    • 5. 发明申请
    • ION IMPLANTING APPARATUS
    • 离子植入装置
    • US20100084584A1
    • 2010-04-08
    • US12545543
    • 2009-08-21
    • Masayoshi Hino
    • Masayoshi Hino
    • H01J37/22H01J37/20
    • H01J37/3171H01J37/20H01J37/22H01J37/222H01J2237/202H01J2237/20292H01J2237/221H01J2237/226H01J2237/2482
    • An illuminating device includes: a light source which is disposed outside a vacuum chamber; a light guide which guides the light emitted from the light source, into the vacuum chamber; a light projecting portion which is fixed in the vacuum chamber, and which emits the light guided by the light guide; a light receiving portion which is attached to a support table of a holder driving device, and which receives the light emitted from the light projecting portion in a state where a holder is positioned in a notch detecting position; a light guide which guides the light received by the light receiving portion; and a light emitting device which is attached to the support table, and which irradiates an outer circumferential portion of a substrate with the light guided by the light guide.
    • 照明装置包括:设置在真空室外的光源; 将从光源发射的光引导到真空室中的导光体; 一个固定在真空室中并发射由光导引导的光的光投射部分; 光接收部,其安装在保持器驱动装置的支撑台上,并且在保持器位于切口检测位置的状态下接收从所述光投射部发射的光; 引导由光接收部接收的光的导光体; 以及发光装置,其附接到支撑台,并且利用由光导引导的光来照射基板的外周部。
    • 6. 发明授权
    • Wafer handling method and ion implanter
    • 晶圆处理方法和离子注入机
    • US08519363B2
    • 2013-08-27
    • US12938856
    • 2010-11-03
    • Kohei TanakaTakashi NogamiMasayoshi Hino
    • Kohei TanakaTakashi NogamiMasayoshi Hino
    • H01J37/22H01J37/20H01J37/317
    • H01J37/3171H01J37/20H01J2237/204H01J2237/2482H01L21/67259H01L21/681H01L21/68742
    • An ion implanter performs ion implantation by irradiating a wafer having a notch at its outer peripheral region by an ion beam. In ion implanter, a twist angle adjustment mechanism is configured to adjust a twist angle, an aligner is configured to adjust an alignment angle, a wafer transfer device is configured to transfer the wafer between the aligner and the twist angle adjustment mechanism, an image processing device is configured to detect the twist angle of the wafer on the twist angle adjustment mechanism, and a control device is configured to carry out a twist control in which the wafer is rotated by the twist angle adjustment mechanism by an angle obtained from a first difference between the detected twist angle and the alignment angle and a second difference between the alignment angle and a target twist angle given as one of ion implantation conditions.
    • 离子注入机通过离子束在其外周区域照射具有凹口的晶片来进行离子注入。 在离子注入机中,扭转角度调节机构被配置为调节扭曲角度,对准器被配置为调整对准角度,晶片传送装置构造成在对准器和扭转角调节机构之间传送晶片,图像处理 装置被配置为检测扭转角度调节机构上的晶片的扭曲角度,并且控制装置被配置为执行扭转控制,其中晶片由扭转角调节机构旋转角度从第一差异 在检测到的扭转角和对准角之间,以及作为离子注入条件之一给出的对准角和目标扭转角之间的第二差。
    • 9. 发明授权
    • Ion implanting apparatus
    • 离子注入装置
    • US08153995B2
    • 2012-04-10
    • US12545543
    • 2009-08-21
    • Masayoshi Hino
    • Masayoshi Hino
    • H01J37/22H01J37/20
    • H01J37/3171H01J37/20H01J37/22H01J37/222H01J2237/202H01J2237/20292H01J2237/221H01J2237/226H01J2237/2482
    • An illuminating device includes: a light source which is disposed outside a vacuum chamber; a light guide which guides the light emitted from the light source, into the vacuum chamber; a light projecting portion which is fixed in the vacuum chamber, and which emits the light guided by the light guide; a light receiving portion which is attached to a support table of a holder driving device, and which receives the light emitted from the light projecting portion in a state where a holder is positioned in a notch detecting position; a light guide which guides the light received by the light receiving portion; and a light emitting device which is attached to the support table, and which irradiates an outer circumferential portion of a substrate with the light guided by the light guide.
    • 照明装置包括:设置在真空室外的光源; 将从光源发射的光引导到真空室中的导光体; 一个固定在真空室中并发射由光导引导的光的光投射部分; 光接收部,其安装在保持器驱动装置的支撑台上,并且在保持器位于切口检测位置的状态下接收从所述光投射部发射的光; 引导由光接收部接收的光的导光体; 以及发光装置,其附接到支撑台,并且利用由光导引导的光来照射基板的外周部。
    • 10. 发明申请
    • ION IMPLANTATION METHOD AND APPARATUS
    • 离子植入方法和装置
    • US20090200491A1
    • 2009-08-13
    • US12369290
    • 2009-02-11
    • Masayoshi Hino
    • Masayoshi Hino
    • A61N5/00
    • H01L21/265H01J37/20H01J37/304H01J37/3171H01J2237/20207H01J2237/20214H01J2237/20228H01J2237/20235H01J2237/31703
    • Using a beam current of an ion beam, and a dose amount to a substrate, and an initial value of a scan number of the substrate set to 1, a scan speed of the substrate is calculated. If the scan speed is within the range, the current scan number and the current scan speed are set as a practical scan number and a practical scan speed, respectively. If the scan speed is higher than the upper limit of the range, the calculation process is aborted. If the scan speed is lower than the lower limit of the range, the scan number is incremented by one to calculate a corrected scan number. A corrected scan speed is calculated by using the corrected scan number, etc. The above steps are repeated until the corrected scan speed is within the allowable scan speed range.
    • 使用离子束的束电流和对衬底的剂量,将衬底的扫描次数的初始值设定为1,计算衬底的扫描速度。 如果扫描速度在该范围内,则将当前扫描次数和当前扫描速度分别设定为实际扫描次数和实际扫描速度。 如果扫描速度高于该范围的上限,则中止计算过程。 如果扫描速度低于该范围的下限,则将扫描数增加1以计算校正的扫描数。 通过使用校正的扫描数等来计算校正的扫描速度。重复上述步骤,直到校正的扫描速度在允许的扫描速度范围内。