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    • 1. 发明授权
    • Current sensor and mounting structure thereof
    • 电流传感器及其安装结构
    • US07344420B2
    • 2008-03-18
    • US11208535
    • 2005-08-23
    • Masatoshi Tokunaga
    • Masatoshi Tokunaga
    • H01R4/28
    • H01M10/48G01R19/0092G01R31/36G01R31/3696H01R11/287H01R13/6683
    • A linking member formed of a conductive material is integrated with a current sensor. An end of the linking member is linked and fixed to a battery terminal connected with a battery post of a battery and the other end is linked and fixed to a connecting terminal of a harness. At least a part of the current sensor having the linking member, the harness having the connecting terminal, and a fixing member that links and fixes the linking member and the connecting terminal is fixed to the battery to contact the battery in a state in which the linking member is linked and fixed to the battery terminal and the connecting terminal. Thus, vibration resistance and connection reliability of the current sensor can be improved.
    • 由导电材料形成的连接部件与电流传感器集成。 连接构件的端部被连接并固定到与电池的电池柱连接的电池端子,并且另一端连接并固定到线束的连接端子。 具有连接构件的电流传感器的至少一部分,具有连接端子的线束和连接并固定连接构件和连接端子的固定构件固定到电池以在电池中接触电池 连接构件被连接并固定到电池端子和连接端子。 因此,可以提高电流传感器的抗振动性和连接可靠性。
    • 3. 发明授权
    • Semiconductor dynamic quantity sensor
    • 半导体动量传感器
    • US07210348B2
    • 2007-05-01
    • US11075885
    • 2005-03-10
    • Masatoshi Tokunaga
    • Masatoshi Tokunaga
    • G01C19/00G01P15/00
    • G01C19/5719
    • A semiconductor dynamic quantity sensor includes moving parts displaceable in a predetermined direction over a supporting substrate and a beam portion for connecting said supporting substrate and said moving parts. The beam portion includes beams arranged in parallel and connected together at first end portions by a connecting portion. The beams bend in a direction perpendicular to the longitudinal direction of said beams. Outer side beams have an equal length and are fixed at other end portions to said supporting substrate. The moving parts are connected to the other end portion of another beam. The outer side beams and connecting portion have a parameter (A/B)/(T/L) equal to at least 20.
    • 半导体动态量传感器包括在支撑基板上沿预定方向移动的移动部件和用于连接所述支撑基板和所述运动部件的梁部分。 梁部分包括平行布置的梁,在第一端部处由连接部分连接在一起。 梁在与所述梁的纵向方向垂直的方向上弯曲。 外侧梁具有相等的长度,并且在另一端部固定到所述支撑基板。 运动部件连接到另一个梁的另一端部。 外侧梁和连接部分具有等于至少20的参数(A / B)/(T / L)。
    • 6. 发明申请
    • Semiconductor dynamic quantity sensor
    • 半导体动量传感器
    • US20050204816A1
    • 2005-09-22
    • US11075885
    • 2005-03-10
    • Masatoshi Tokunaga
    • Masatoshi Tokunaga
    • G01C19/56B81B3/00G01C19/5747G01P15/08G01P15/125H01L29/84
    • G01C19/5719
    • A semiconductor dynamic quantity sensor includes moving parts displaceable in a predetermined direction over a supporting substrate and a beam portion for connecting said supporting substrate and said moving parts. The beam portion includes beams arranged in parallel and connected together at first end portions by a connecting portion. The beams bend in a direction perpendicular to the longitudinal direction of said beams. Outer side beams have an equal length and are fixed at other end portions to said supporting substrate. The moving parts are connected to the other end portion of another beam. The outer side beams and connecting portion have a parameter (A/B)/(T/L) equal to at least 20.
    • 半导体动态量传感器包括在支撑基板上沿预定方向移动的移动部件和用于连接所述支撑基板和所述运动部件的梁部分。 梁部分包括平行布置的梁,在第一端部处由连接部分连接在一起。 梁在与所述梁的纵向方向垂直的方向上弯曲。 外侧梁具有相等的长度,并且在另一端部固定到所述支撑基板。 运动部件连接到另一个梁的另一端部。 外侧梁和连接部分具有等于至少20的参数(A / B)/(T / L)。