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    • 3. 发明授权
    • Light emitting diode and method of making the same
    • 发光二极管及其制作方法
    • US4339689A
    • 1982-07-13
    • US115249
    • 1980-01-21
    • Haruyoshi YamanakaMasaru Kazumura
    • Haruyoshi YamanakaMasaru Kazumura
    • G02B6/42H01L33/20H01L33/30H01L33/40H01L33/00
    • H01L33/20G02B6/4206Y10S438/928
    • A light-emitting diode is comprised of:a semiconductor active layer,a semiconductor first clad layer formed on a surface of said semiconductor active layer, anda protrusion formed unitarily on a surface of said first clad layer for facing an input end of a light guide for light coupling therewith.A method of manufacturing the light emitting diode is comprised of the steps offorming a recess on one face of a semiconductor substrate,forming a semiconductor first clad layer on the abovementioned face of the semiconductor substrate, andselectively etching the substrate from the other face thereof so as to form a through-hole reaching said recess on said one face of the semiconductor substrate, thereby exposing at least a protrusion of said semiconductor first clad layer formed in said recess.
    • 发光二极管包括:半导体有源层,形成在所述半导体有源层的表面上的半导体第一覆盖层和在所述第一覆盖层的与所述第一覆盖层的输入端相对的表面上整体形成的突起 导光板与光耦合。 一种制造发光二极管的方法包括以下步骤:在半导体衬底的一个面上形成凹槽,在半导体衬底的上述表面上形成半导体第一覆盖层,并从其另一面选择性地蚀刻衬底 以形成在半导体衬底的所述一个表面上到达所述凹部的通孔,从而暴露形成在所述凹部中的所述半导体第一包覆层的至少一个凸起。