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1. 发明申请

US20100302551A1 SHAPE MEASURING DEVICE 有权
标题翻译：形状测量装置
公开(公告)号：US20100302551A1
公开(公告)日：2010-12-02
申请号：US12745546
申请日：2008-12-02
申请人： Masaru Akamatsu , Hidehisa Hashizume , Yasuhide Nakai
发明人： Masaru Akamatsu , Hidehisa Hashizume , Yasuhide Nakai
IPC分类号： G01B11/24
CPC分类号： G01B11/24
摘要： When a shape of an end face of a disc-shaped measurement target is to be measured on the basis of its projection image, a shape measuring device in which a non-parallel light component is not contained in a light flux projected to the measurement target as much as possible and moreover, correct shape measurement can be made by ensuring parallelism between a light projection direction and each face of front and back sides of the measurement target.There are provided a collimator lens 3 for having outgoing light of a point light source 2 pass and collimating the same in a light projection direction R1 and a single or a plurality of apertures 8 shielding passage of light in a range outside an image pickup range of a camera seen from the light projection direction R1 or passage of light in a range inside the image pickup range and outside a boundary located in a range outside a projection image of a measurement portion in the light projection direction R1 in the light flux traveling from the collimator lens 3 to the measurement target 1 side. Moreover, a parallel supporting portion 21 for supporting one of the faces of the measurement target 1 in parallel with the light projection direction R1 at a position on the center side with respect to the measurement portion in the measurement target 1 supported by a center sucking and supporting mechanism 9 is provided.
摘要翻译：当基于其投影图像来测量盘形测量目标的端面的形状时，在投影到测量目标的光束中不包含非平行光分量的形状测量装置此外，可以通过确保光投射方向与测量对象的前后面的每个面之间的平行度来进行正确的形状测量。设置有用于使点光源2的出射光沿光投射方向R1通过并准直的准直透镜3，以及屏蔽光的通过的单个或多个孔8，该光束在图像拾取范围之外的范围内从光投影方向R1看的照相机或者在图像摄取范围内的范围内的光的通过，以及位于光投射方向R1上的测量部分的投影图像外的范围内的边界准直透镜3到测量对象1侧。此外，平行支撑部分21用于在测量对象1中心侧的位置处相对于测量目标1中的一个中心吸力支撑的一个位置支撑测量对象1的一个面与光投射方向R1平行，提供支撑机构9。

2. 发明授权

US07456978B2 Shape measuring apparatus 有权
标题翻译：形状测量仪
公开(公告)号：US07456978B2
公开(公告)日：2008-11-25
申请号：US11274200
申请日：2005-11-16
申请人： Masaru Akamatsu
发明人： Masaru Akamatsu
IPC分类号： G01B11/04
CPC分类号： G01B11/028 , G01B11/2433
摘要： A shape measuring apparatus includes a point light source including a white light-emitting diode, a collimator lens for forming a parallel beam as a result of causing light emitted from the point light source to be incident upon the collimator lens, a telecentric lens device, including two-side telecentric optics or object-side telecentric optics, for being irradiated with the light that has passed an object to be measured from the collimator lens, and an image sensor for projecting thereon an image of the object produced by the light that has passed through the telecentric lens device.
摘要翻译：一种形状测量装置，包括：点光源，包括白色发光二极管，用于形成平行光束的准直透镜，使得从点光源发射的光入射到准直透镜上;远心透镜装置，包括两侧远心光学器件或物体侧远心光学器件，用于从准直透镜照射已经通过待测物体的光;以及图像传感器，用于在其上投射由具有通过远心透镜装置。

3. 发明授权

US08228509B2 Shape measuring device 有权
标题翻译：形状测量装置
公开(公告)号：US08228509B2
公开(公告)日：2012-07-24
申请号：US12745546
申请日：2008-12-02
申请人： Masaru Akamatsu , Hidehisa Hashizume , Yasuhide Nakai
发明人： Masaru Akamatsu , Hidehisa Hashizume , Yasuhide Nakai
IPC分类号： G01B11/00
CPC分类号： G01B11/24
摘要： A shape measuring device including a light projecting device for projecting a light flux to a measurement portion, and image pickup device for picking up a projection image of the measurement portion. The light projecting device includes a collimator lens having outgoing light of a point light source pass and collimating the same in a light projection direction and one or more apertures shielding passage of light in a range outside an image pickup range or passage of light in a range inside the image pickup range and outside a boundary located in a range outside a projection image of a measurement portion. Moreover, a parallel supporting portion for supporting a face of the measurement target in parallel with the light projection direction at a position on the center side with respect to the measurement portion in the measurement target supported by a center sucking and supporting mechanism is provided.
摘要翻译：一种形状测量装置，包括用于将光束投射到测量部分的投光装置，以及用于拾取测量部分的投影图像的图像拾取装置。该投光装置包括：准直透镜，其具有点光源的出射光，并沿光投射方向准直;以及一个或多个孔，遮光光线的范围在摄像范围之外的范围内，或光的通过范围在图像拾取范围内并且位于测量部分的投影图像之外的范围内的边界之外。此外，还提供一种平行的支撑部分，用于在由中心吸引和支撑机构支撑的测量对象中的相对于测量部分的中心侧的位置处与光投射方向平行地支撑测量对象的面。

4. 发明申请

US20100134615A1 SHAPE MEASUREMENT APPARATUS AND SHAPE MEASUREMENT METHOD 有权
标题翻译：形状测量装置和形状测量方法
公开(公告)号：US20100134615A1
公开(公告)日：2010-06-03
申请号：US12452230
申请日：2008-07-18
申请人： Masaru Akamatsu , Hidehisa Hashizume , Yasuhide Nakai
发明人： Masaru Akamatsu , Hidehisa Hashizume , Yasuhide Nakai
IPC分类号： H04N5/14
CPC分类号： G01B11/2433 , G01N21/94 , G01N21/9503
摘要： To provide a shape measurement apparatus and a shape measurement method with which it is possible to perform a shape measurement, when a shape of an end surface of a disk-shaped semiconductor wafer or the like is measured on the basis of a projection image thereof, without receiving an influence of a contaminant on the end surface.With a rotation supporting mechanism 9 supporting a wafer 1, the wafer 1 is supported in a range from a first supporting position rotated by +δ with respect to a predetermined reference supporting position to a second supporting position rotated by −δ degrees at two or more supporting positions including the first supporting position and the second supporting position, a projection image of the end surface of the wafer 1 supported at the respective supporting positions is picked up by an image sensor 7, an index value of an end surface value is calculated for each of a plurality of obtained projection images, a selection of one representative value based on the plurality of calculated index values or a calculation of one aggregate value is performed, and a measurement value for the shape of the end surface of the wafer 1 corresponding to the reference supporting position is derived. At that time, when a radius of the wafer 1 and a chamfer width are set as r and k, δ≧cos−1 ((r−k)/r) is desirably satisfied.
摘要翻译：为了提供可以进行形状测量的形状测量装置和形状测量方法，当基于其投影图像来测量盘形半导体晶片等的端面的形状时，而不会在端面上受到污染物的影响。通过支撑晶片1的旋转支撑机构9，晶片1被支撑在从相对于预定基准支撑位置旋转+δ的第一支撑位置到在两个以上旋转-δ度的第二支撑位置的范围内包括第一支撑位置和第二支撑位置的支撑位置，由图像传感器7拾取支撑在各支撑位置处的晶片1的端面的投影图像，计算端面值的指标值执行多个获得的投影图像中的每一个，基于多个计算出的指标值的一个代表值的选择或一个聚合值的计算，并且对应于晶片1的端面的形状的测量值对应于导出参考支撑位置。此时，当晶片1的半径和倒角宽度被设定为r和k时，希望满足δ≥cos-1（（r-k）/ r）。

5. 发明申请

US20060109484A1 Shape measuring apparatus 有权
标题翻译：形状测量仪
公开(公告)号：US20060109484A1
公开(公告)日：2006-05-25
申请号：US11274200
申请日：2005-11-16
申请人： Masaru Akamatsu
发明人： Masaru Akamatsu
IPC分类号： G01B11/24
CPC分类号： G01B11/028 , G01B11/2433
摘要： A shape measuring apparatus includes a point light source including a white light-emitting diode, a collimator lens for forming a parallel beam as a result of causing light emitted from the point light source to be incident upon the collimator lens, a telecentric lens device, including two-side telecentric optics or object-side telecentric optics, for being irradiated with the light that has passed an object to be measured from the collimator lens, and an image sensor for projecting thereon an image of the object produced by the light that has passed through the telecentric lens device.
摘要翻译：一种形状测量装置，包括：点光源，包括白色发光二极管，用于形成平行光束的准直透镜，使得从点光源发射的光入射到准直透镜上;远心透镜装置，包括两侧远心光学器件或物体侧远心光学器件，用于从准直透镜照射已经通过待测物体的光;以及图像传感器，用于在其上投射由具有通过远心透镜装置。

6. 发明申请

US20130139950A1 ROTATIONAL MISALIGNMENT MEASURING DEVICE OF BONDED SUBSTRATE, ROTATIONAL MISALIGNMENT MEASURING METHOD OF BONDED SUBSTRATE, AND METHOD OF MANUFACTURING BONDED SUBSTRATE 有权
标题翻译：粘结基板的旋转误差测量装置，结合基板的旋转缺陷测量方法和制造粘结基板的方法
公开(公告)号：US20130139950A1
公开(公告)日：2013-06-06
申请号：US13691491
申请日：2012-11-30
申请人： Masato KANNAKA , Masakazu Kajita , Eiji Takahashi , Yuji Yamamoto , Masaru Akamatsu , Kunio Iba , Kenji Imanishi
发明人： Masato KANNAKA , Masakazu Kajita , Eiji Takahashi , Yuji Yamamoto , Masaru Akamatsu , Kunio Iba , Kenji Imanishi
IPC分类号： G01B11/27
CPC分类号： G01B11/272
摘要： A rotational misalignment between semiconductor wafers constituting a bonded wafer is calculated. A light source is arranged at a position which is on a front side of an opening of a notch and which is separated from an outer edge portion of a bonded wafer by a predetermined interval, and outputs light to irradiate the outer edge portion of the bonded wafer including the notch. A camera receives and photoelectrically converts reflected light that is specularly-reflected by the outer edge portion of the bonded wafer including the notch among the light outputted by the light source in order to output a brightness distribution of the reflected light as an image. A computer analyzes positions of notches from the image outputted by the camera to obtain a notch position misalignment, and further calculates a rotational misalignment between semiconductor wafers using a center position misalignment between the semiconductor wafers.
摘要翻译：计算构成接合晶片的半导体晶片之间的旋转未对准。光源布置在位于凹口的开口的前侧上并且与键合晶片的外边缘部分隔开预定间隔的位置处，并输出光以照射粘合的晶片的外边缘部分晶圆包括凹口。照相机接收并光电转换由光源输出的光中包括凹口的键合晶片的外边缘部分被镜面反射的反射光，以输出作为图像的反射光的亮度分布。计算机分析由相机输出的图像的凹口的位置以获得切口位置未对准，并且还使用半导体晶片之间的中心位置未对准来计算半导体晶片之间的旋转未对准。

7. 发明授权

US08310536B2 Shape measurement apparatus and shape measurement method 有权
标题翻译：形状测量装置和形状测量方法
公开(公告)号：US08310536B2
公开(公告)日：2012-11-13
申请号：US12452230
申请日：2008-07-18
申请人： Masaru Akamatsu , Hidehisa Hashizume , Yasuhide Nakai
发明人： Masaru Akamatsu , Hidehisa Hashizume , Yasuhide Nakai
IPC分类号： H04N7/18
CPC分类号： G01B11/2433 , G01N21/94 , G01N21/9503
摘要： An apparatus and method are provided for measuring the end surface of a disk-shaped semiconductor wafer based on its projection image, without the influence of contaminants on the end surface. A rotation supporting mechanism supports a wafer between a first supporting position rotated by +δrelative to a predetermined reference position and a second supporting position rotated by −δdegrees at two or more supporting positions. An image sensor picks up a projection image of the wafer's end surface. An index value for the end surface is calculated for each of a plurality of obtained projection images. One representative value of the calculated index values or an aggregate value is obtained, and a shape measurement of the wafer's end surface corresponding to the reference supporting position is derived. When the wafer's radius and a chamfer width are set as r and k, δ≧cos−1 ((r-k)/r) is satisfied.
摘要翻译：提供了一种装置和方法，用于基于其投影图像来测量盘形半导体晶片的端面，而不受污染物在端面上的影响。旋转支撑机构支撑在相对于预定基准位置旋转+δ的第一支撑位置和在两个或更多个支撑位置处旋转-δ度的第二支撑位置之间的晶片。图像传感器拾取晶片端面的投影图像。针对多个获得的投影图像中的每一个计算端面的索引值。获得计算出的指标值的一个代表值或聚合值，得到对应于参考支撑位置的晶片端面的形状测量。当晶片的半径和倒角宽度被设置为r和k时，满足δ≥cos-1（（r-k）/ r）。

8. 发明授权

US5519494A Pipe inner surface measuring method and apparatus 失效
标题翻译：管内表面测量方法及装置
公开(公告)号：US5519494A
公开(公告)日：1996-05-21
申请号：US255987
申请日：1994-06-08
申请人： Masaru Akamatsu , Norio Suzuki , Noritsugu Fujii , Satoshi Yanai
发明人： Masaru Akamatsu , Norio Suzuki , Noritsugu Fujii , Satoshi Yanai
IPC分类号： G01B11/30
CPC分类号： G01B11/303
摘要： Light is introduced to an inner surface of a fine tube, which is an object for measurement of the inner surface roughness, through a first end of the fine tube at a small angle with respect to a center line of the fine tube and the light emerging from a second end of the fine tube after the light is reflected by multiple reflections within the fine tube is measured to evaluate the roughness of the inner surface of the fine tube. Upon such measurement, the light to be introduced to the first end of the fine tube is converged once on the center line of the fine tube and then diverged again, and the polarization direction of the light to be introduced to the first end of the fine tube is set to an angle equal to or around 90 degrees with respect to the reflection surface of the fine tube. Thus, the roughness of the inner surface of the fine tube can be calculated in accordance with a result of detection of the intensity of emergent light from the fine tube by means of a photo detector.
摘要翻译：通过细管的第一端相对于细管的中心线以小角度将光引入作为内表面粗糙度的测量对象的细管的内表面，并且光出现测量在细管内的多次反射反射光之后从细管的第二端测量细管内表面的粗糙度。在这样的测量中，被引入到细管的第一端的光在微细管的中心线上会聚一次，然后再发散，并且被引入到精细的第一端的光的偏振方向管相对于细管的反射面被设定为等于或大约90度的角度。因此，可以根据通过光电检测器检测来自细管的出射光的强度的结果来计算细管内表面的粗糙度。

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