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2. 发明授权

US4470944A Process for producing an aromatic polyimide film 失效
标题翻译：芳族聚酰亚胺薄膜的制造方法
公开(公告)号：US4470944A
公开(公告)日：1984-09-11
申请号：US463549
申请日：1983-02-03
申请人： Toshiyuki Asakura , Masanori Mizouchi , Hiroaki Kobayashi
发明人： Toshiyuki Asakura , Masanori Mizouchi , Hiroaki Kobayashi
IPC分类号： B29C47/00 , B05D5/12 , B29B7/00 , B29C31/00 , B29C39/00 , B29C41/12 , B29D7/01 , B29K79/00 , C08J5/18 , H05K1/03 , H05K3/02 , B29D7/08
CPC分类号： C08J5/18 , B05D5/12 , C08J2379/08 , H05K1/0346 , H05K3/022 , Y10T428/31721
摘要： The present invention relates to a process for producing an of aromatic polyimide film comprising (A) casting on a support a dope containing an amide-type polar solvent and 10-45 weight percent of a polyamic acid having more than 0.4 dl/g an inherent viscosity of more than 0.4 dl/g, (B) concentrating the polymer content to be at least higher than that of the initial dope while simultaneously raising the ring closure ratio above 30%, (C) removing the solvent from the film by extraction in an aqueous medium so as to lower the solvent content of the film below 10% and (D) then heating the film to a temperature of more than 200.degree. C.The process of the present invention is useful for the production of aromatic polyimide film having a reduced rate of solvent decomposition and improved productivity.The aromatic polyimide film produced by the process of the present invention is superior in thermal as well as mechanical properties and is highly useful as an electric insulation material and also as a base for flexible printed circuits, magnetic tape, etc.
摘要翻译：本发明涉及一种芳族聚酰亚胺薄膜的制造方法，其特征在于：（A）在载体上浇铸含有酰胺型极性溶剂的涂料和10-45重量％的具有大于0.4dl / g的聚酰胺酸，其固有的粘度大于0.4dl / g，（B）将聚合物含量浓度至少高于初始涂料的含量，同时使闭环比高于30％，（C）通过萃取将溶剂从薄膜中除去，水性介质，以使膜的溶剂含量降低10％以下，（D）然后将膜加热至200℃以上。本发明的方法可用于制备具有降低溶剂分解速率并提高生产率。通过本发明的方法生产的芳族聚酰亚胺膜的热性能和机械性能都优异，作为电绝缘材料以及柔性印刷电路，磁带等的基底是非常有用的。

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