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1. 发明申请

US20110308849A1 WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：接线基板及其制造方法
公开(公告)号：US20110308849A1
公开(公告)日：2011-12-22
申请号：US13158607
申请日：2011-06-13
申请人： Hitoshi KONDO , Tomoyuki Shimodaira , Masako Sato
发明人： Hitoshi KONDO , Tomoyuki Shimodaira , Masako Sato
IPC分类号： H05K1/16 , H01K3/10 , H05K1/11
CPC分类号： H05K3/0055 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H05K3/205 , H05K3/28 , H05K3/4682 , H05K2201/10674 , H05K2203/025 , H05K2203/041 , H05K2203/0746 , H05K2203/161 , Y10T29/49165
摘要： A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.
摘要翻译：布线基板包括在一个表面侧上形成为最外层并呈现黑色或灰色的第一绝缘层，形成为暴露于第一绝缘层的第一连接焊盘，形成为最外层的第二绝缘层在另一表面侧具有黑色或灰色，以及形成为从第二绝缘层露出的第二连接焊盘，其中在第二绝缘层中形成具有形成为弯曲表面的侧壁表面的连接孔并且第二连接垫暴露于连接孔的底部。

2. 发明申请

US20090258923A1 Carrier Composition for Nucleic Acid Transport 有权
标题翻译：核酸运输载体组成
公开(公告)号：US20090258923A1
公开(公告)日：2009-10-15
申请号：US12083727
申请日：2006-10-17
申请人： Hidekazu Toyobuku , Hideo Miyao , Masako Sato , Kazuo Sekiguchi
发明人： Hidekazu Toyobuku , Hideo Miyao , Masako Sato , Kazuo Sekiguchi
IPC分类号： A61K31/713 , A61K47/28
CPC分类号： A61K9/1272 , A61K47/543 , C12N15/88
摘要： An object of the present invention is to provide a nucleic acid delivery carrier composition of low toxicity and high safety, the carrier composition, when used to administer a nucleic acid such as an siRNA into an animal-derived cell or organism, being capable of delivering efficiently the nucleic acids into the cells while protecting it from being degraded; and a nucleic acid deliver composition containing the carrier and a nucleic acid.The carrier composition for delivery of a nucleic acid is prepared by mixing (A) a cationic lipid having a steroid skeleton with (B) a tertiary ammonium salt-type cationic lipid. The nucleic acid delivery composition is prepared by mixing the nucleic acid delivery carrier with a nucleic acid.
摘要翻译：本发明的目的是提供一种低毒性和高安全性的核酸递送载体组合物，该载体组合物当用于将诸如siRNA的核酸施用于动物来源的细胞或生物体时，能够递送将核酸有效地进入细胞同时保护其免于降解; 以及含有载体和核酸的核酸递送组合物。用于递送核酸的载体组合物通过将（A）具有类固醇骨架的阳离子脂质与（B）叔铵盐型阳离子脂质混合来制备。通过将核酸递送载体与核酸混合来制备核酸递送组合物。

3. 发明授权

US06903391B2 Solid state image pickup device 失效
公开(公告)号：US06903391B2
公开(公告)日：2005-06-07
申请号：US10851416
申请日：2004-05-24
申请人： Yutaka Takeuchi , Masako Sato , Mariko Nakamura
发明人： Yutaka Takeuchi , Masako Sato , Mariko Nakamura
IPC分类号： H01L27/146 , H01L27/148 , H01L29/768
CPC分类号： H01L27/14843 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1463 , H01L27/14812
摘要： A solid state image pickup device includes: a semiconductor substrate defining light receiving areas; pixels formed in the light receiving areas, each pixel including a high and a low sensitivity photoelectric conversion element; a light shielding film formed above the light receiving areas and having an opening above each pixel, the opening exposing at least a partial area of the high and the low sensitivity photoelectric conversion element; an on-chip micro lens formed above each opening, the on-chip micro lens converging incidence light; and an inner lens formed between the light shielding film and the on-chip micro lens and above the opening, the inner lens being disposed so that the inner lens receives light converged by the on-chip micro lens, excluding a portion of the light, and further converges the received light to make the portion of the light propagate toward the opening without passing through the inner lens.

4. 发明授权

US08450852B2 Wiring substrate 有权
标题翻译：接线基板
公开(公告)号：US08450852B2
公开(公告)日：2013-05-28
申请号：US13114417
申请日：2011-05-24
申请人： Hitoshi Kondo , Tomoyuki Shimodaira , Masako Sato
发明人： Hitoshi Kondo , Tomoyuki Shimodaira , Masako Sato
IPC分类号： H01L23/12 , H01L23/053 , H01L23/14 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L23/145 , H01L23/49827 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/3511 , H01L2224/05624 , H01L2924/00014
摘要： A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin having the same composition. The plural insulation layers are formed with a filler having the same composition. The filler content of each of the plural insulation layers ranges from 30 vol % or more to 65 vol % or less. The thermal expansion coefficient of each of the plural insulation layers ranges from 12 ppm/° C. or more to 35 ppm/° C. or less.
摘要翻译：布线基板包括多个布线层，并且多个绝缘层交替层叠在另一个之上。多个绝缘层由具有相同组成的绝缘树脂形成。多个绝缘层由具有相同组成的填料形成。多个绝缘层中的每一个的填料含量为30体积％以上至65体积％以下。多个绝缘层中的每一个的热膨胀系数为12ppm /℃以上至35ppm /℃以下。

5. 发明授权

US08030075B2 Carrier composition for nucleic acid transport 有权
标题翻译：载体组成用于核酸转运
公开(公告)号：US08030075B2
公开(公告)日：2011-10-04
申请号：US12083727
申请日：2006-10-17
申请人： Hidekazu Toyobuku , Hideo Miyao , Masako Sato , Kazuo Sekiguchi
发明人： Hidekazu Toyobuku , Hideo Miyao , Masako Sato , Kazuo Sekiguchi
IPC分类号： C12N15/88 , C12N15/11 , A61K9/127
CPC分类号： A61K9/1272 , A61K47/543 , C12N15/88
摘要： An object of the present invention is to provide a nucleic acid delivery carrier composition of low toxicity and high safety, the carrier composition, when used to administer a nucleic acid such as an siRNA into an animal-derived cell or organism, being capable of delivering efficiently the nucleic acids into the cells while protecting it from being degraded; and a nucleic acid deliver composition containing the carrier and a nucleic acid. The carrier composition for delivery of a nucleic acid is prepared by mixing (A) a cationic lipid having a steroid skeleton with (B) a tertiary ammonium salt-type cationic lipid. The nucleic acid delivery composition is prepared by mixing the nucleic acid delivery carrier with a nucleic acid.
摘要翻译：本发明的目的是提供一种低毒性和高安全性的核酸递送载体组合物，该载体组合物当用于将诸如siRNA的核酸施用于动物来源的细胞或生物体时，能够递送将核酸有效地进入细胞同时保护其免于降解; 以及含有载体和核酸的核酸递送组合物。用于递送核酸的载体组合物通过将（A）具有类固醇骨架的阳离子脂质与（B）叔铵盐型阳离子脂质混合来制备。通过将核酸递送载体与核酸混合来制备核酸递送组合物。

6. 发明申请

US20050051860A1 Solid state image pickup device 失效
标题翻译：固态图像拾取装置
公开(公告)号：US20050051860A1
公开(公告)日：2005-03-10
申请号：US10851416
申请日：2004-05-24
申请人： Yutaka Takeuchi , Masako Sato , Mariko Nakamura
发明人： Yutaka Takeuchi , Masako Sato , Mariko Nakamura
IPC分类号： H01L27/146 , H01L31/0232
CPC分类号： H01L27/14843 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1463 , H01L27/14812
摘要： A solid state image pickup device includes: a semiconductor substrate defining light receiving areas; pixels formed in the light receiving areas, each pixel including a high and a low sensitivity photoelectric conversion element; a light shielding film formed above the light receiving areas and having an opening above each pixel, the opening exposing at least a partial area of the high and the low sensitivity photoelectric conversion element; an on-chip micro lens formed above each opening, the on-chip micro lens converging incidence light; and an inner lens formed between the light shielding film and the on-chip micro lens and above the opening, the inner lens being disposed so that the inner lens receives light converged by the on-chip micro lens, excluding a portion of the light, and further converges the received light to make the portion of the light propagate toward the opening without passing through the inner lens.
摘要翻译：固态图像拾取装置包括：限定光接收区域的半导体衬底; 像素形成在光接收区域中，每个像素包括高灵敏度和低灵敏度光电转换元件; 形成在所述光接收区域上方并且在每个像素上方具有开口的遮光膜，所述开口暴露所述高和低灵敏度光电转换元件的至少一部分区域; 在每个开口上形成的片上微透镜，片上微透镜会聚入射光; 以及形成在所述遮光膜和所述片上微透镜之间并且在所述开口之上的内透镜，所述内透镜被设置为使得所述内透镜接收除了一部分光之外的片上微透镜会聚的光，并且进一步收敛所接收的光以使光的一部分朝向开口传播而不通过内透镜。

7. 发明授权

US08669478B2 Wiring substrate and method of manufacturing the same 有权
标题翻译：接线基板及其制造方法
公开(公告)号：US08669478B2
公开(公告)日：2014-03-11
申请号：US13158607
申请日：2011-06-13
申请人： Hitoshi Kondo , Tomoyuki Shimodaira , Masako Sato
发明人： Hitoshi Kondo , Tomoyuki Shimodaira , Masako Sato
IPC分类号： H05K1/16
CPC分类号： H05K3/0055 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H05K3/205 , H05K3/28 , H05K3/4682 , H05K2201/10674 , H05K2203/025 , H05K2203/041 , H05K2203/0746 , H05K2203/161 , Y10T29/49165
摘要： A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.
摘要翻译：布线基板包括在一个表面侧上形成为最外层并呈现黑色或灰色的第一绝缘层，形成为暴露于第一绝缘层的第一连接焊盘，形成为最外层的第二绝缘层在另一表面侧具有黑色或灰色，以及形成为从第二绝缘层露出的第二连接焊盘，其中在第二绝缘层中形成具有形成为弯曲表面的侧壁表面的连接孔并且第二连接垫暴露于连接孔的底部。

8. 发明授权

US08119927B2 Wiring board, method for manufacturing the same, and semiconductor package 有权
标题翻译：接线板，其制造方法以及半导体封装
公开(公告)号：US08119927B2
公开(公告)日：2012-02-21
申请号：US12464307
申请日：2009-05-12
申请人： Toshihisa Yoda , Shunichiro Matsumoto , Masako Sato
发明人： Toshihisa Yoda , Shunichiro Matsumoto , Masako Sato
IPC分类号： H05K1/16
CPC分类号： H05K1/113 , H01L23/498 , H01L23/49816 , H01L2224/16237 , H05K3/4644 , H05K2201/094 , H05K2201/09472 , H05K2201/096 , H05K2201/10674 , H05K2201/10734 , Y10T29/49155
摘要： In a wiring board, a plurality of wiring layers and a plurality of insulating layers are alternately stacked. The wiring layers are electrically connected to one another through via holes formed in the insulating layers. The wiring board includes: a connection pad which is disposed on one of the wiring layers that is on the inner side of an outermost wiring layer; and an external connection terminal which is disposed on the connection pad, and which is projected from the surface of the wiring board. The external connection terminal is passed through the outermost wiring layer.
摘要翻译：在布线板中，交替层叠多个布线层和多个绝缘层。布线层通过形成在绝缘层中的通孔彼此电连接。布线基板包括：连接焊盘，其设置在布线层中的位于最外布线层的内侧的一个布线层上; 以及外部连接端子，其设置在连接焊盘上，并且从布线板的表面突出。外部连接端子穿过最外面的布线层。

9. 发明申请

US20110316148A1 WIRING SUBSTRATE 有权
标题翻译：接线基板
公开(公告)号：US20110316148A1
公开(公告)日：2011-12-29
申请号：US13114417
申请日：2011-05-24
申请人： Hitoshi KONDO , Tomoyuki SHIMODAIRA , Masako SATO
发明人： Hitoshi KONDO , Tomoyuki SHIMODAIRA , Masako SATO
IPC分类号： H01L23/48 , H05K1/02
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L23/145 , H01L23/49827 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/3511 , H01L2224/05624 , H01L2924/00014
摘要： A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin having the same composition. The plural insulation layers are formed with a filler having the same composition. The filler content of each of the plural insulation layers ranges from 30 vol % or more to 65 vol % or less. The thermal expansion coefficient of each of the plural insulation layers ranges from 12 ppm/° C. or more to 35 ppm/° C. or less.
摘要翻译：布线基板包括多个布线层，并且多个绝缘层交替层叠在另一个之上。多个绝缘层由具有相同组成的绝缘树脂形成。多个绝缘层由具有相同组成的填料形成。多个绝缘层中的每一个的填料含量在30体积％以上至65体积％以下。多个绝缘层中的每一个的热膨胀系数为12ppm /℃以上至35ppm /℃以下。

10. 发明申请

US20090284943A1 WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE 有权
标题翻译：接线板，其制造方法和半导体封装
公开(公告)号：US20090284943A1
公开(公告)日：2009-11-19
申请号：US12464307
申请日：2009-05-12
申请人： Toshihisa YODA , Shunichiro Matsumoto , Masako Sato
发明人： Toshihisa YODA , Shunichiro Matsumoto , Masako Sato
IPC分类号： H05K7/02 , H05K1/11 , H05K3/10
CPC分类号： H05K1/113 , H01L23/498 , H01L23/49816 , H01L2224/16237 , H05K3/4644 , H05K2201/094 , H05K2201/09472 , H05K2201/096 , H05K2201/10674 , H05K2201/10734 , Y10T29/49155
摘要： In a wiring board, a plurality of wiring layers and a plurality of insulating layers are alternately stacked. The wiring layers are electrically connected to one another through via holes formed in the insulating layers. The wiring board includes: a connection pad which is disposed on one of the wiring layers that is on the inner side of an outermost wiring layer; and an external connection terminal which is disposed on the connection pad, and which is projected from the surface of the wiring board. The external connection terminal is passed through the outermost wiring layer.
摘要翻译：在布线板中，交替层叠多个布线层和多个绝缘层。布线层通过形成在绝缘层中的通孔彼此电连接。布线基板包括：连接焊盘，其设置在布线层中的位于最外布线层的内侧的一个布线层上; 以及外部连接端子，其设置在连接焊盘上，并且从布线板的表面突出。外部连接端子穿过最外面的布线层。

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