会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Resin magnetic compound and molded article thereof
    • 树脂磁性复合物及其成型体
    • US5562852A
    • 1996-10-08
    • US270420
    • 1994-07-05
    • Masahito TadaKeiichiro Suzuki
    • Masahito TadaKeiichiro Suzuki
    • H01F1/08H01F1/113H01F1/00H01F1/26
    • H01F1/083H01F1/113
    • A resin magnetic compound is disclosed, comprising (i) from 65 to 77% by weight of a magnetic powder having been surface treated with from 0.01 to 5% by weight, based on the magnetic powder, of a mercaptosilane represented by the following formula (I) or a hydrolysis product of the mercaptosilane:(RO).sub.n R'.sub.(3-n) SiR"SH (I)wherein R and R' each represents an alkyl group having 1 or 2 carbon atoms; R" represents an alkylene group having from 2 to 6 carbon atoms; and n represents 2 or 3, (ii) from 14 to 30% by weight of polyphenylene sulfide resin, and (iii) from 9 to 21% by weight of glass fiber. The resin magnetic compound and a molded article obtained from the compound are excellent in thermal shock resistance, magnetic characteristics, and heat resistance.
    • 公开了一种树脂磁性化合物,其包含(i)65〜77重量%的以磁铁粉为基准,以0.01〜5重量%进行表面处理的磁性粉末的下式所示的巯基硅烷( I)或巯基硅烷的水解产物:(RO)nR'(3-n)SiR''SH(I)其中R和R'各自表示具有1或2个碳原子的烷基; R“表示碳原子数2〜6的亚烷基。 n表示2或3,(ii)14〜30重量%的聚苯硫醚树脂,(iii)9〜21重量%的玻璃纤维。 树脂磁性化合物和由该化合物得到的成型体的耐热冲击性,磁特性和耐热性优异。
    • 6. 发明授权
    • IC socket
    • IC插座
    • US07198734B2
    • 2007-04-03
    • US10471118
    • 2002-03-27
    • Naomitsu NishihataMasahito Tada
    • Naomitsu NishihataMasahito Tada
    • H01B1/24H01R12/14H05K7/14
    • C08K3/04H01R13/22
    • The invention provides an IC socket of synthetic resin, whose surface resistivity is strictly controlled to the desired level and which is much more improved in terms of electrical insulation properties, mechanical properties, heat resistance, chemical resistance, dimensional stability, etc. The IC socket is obtained by molding or otherwise forming a thermoplastic resin composition comprising 40 to 94% by mass of a thermoplastic resin, 5 to 30% by mass of a carbon precursor having a volume resistivity of 102 to 1010 Ω·cm and 1 to 30% by mass of an electrical conductive filler having a volume resistivity of less than 102 Ω·cm.
    • 本发明提供一种合成树脂的IC插座,其表面电阻率被严格控制到所需的水平,并且在电绝缘性能,机械性能,耐热性,耐化学性,尺寸稳定性等方面得到更多改进。 通过成型或以其他方式形成包含40〜94质量%的热塑性树脂的热塑性树脂组合物,5〜30质量%的体积电阻率为10〜10重量%的碳前体, SUP〜10Ω·cm,1〜30质量%的体积电阻率小于10Ω·cm的导电填料。