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1. 发明授权

US09390019B2 Method and apparatus for providing high-performance and highly-scalable storage acceleration 有权
标题翻译：用于提供高性能和高度可扩展的存储加速的方法和装置
公开(公告)号：US09390019B2
公开(公告)日：2016-07-12
申请号：US11365474
申请日：2006-02-28
申请人： Martin Patterson , Matthias Oberdorfer
发明人： Martin Patterson , Matthias Oberdorfer
IPC分类号： G06F15/173 , G06F15/167 , G06F15/16 , G06F12/08 , H04L29/08
CPC分类号： G06F12/0866 , G06F12/0813 , G06F12/084 , G06F2212/263 , G06F2212/314 , H04L67/2819 , H04L67/2842 , H04L67/288
摘要： A method and apparatus of providing high performance and highly scalable storage acceleration includes a cluster node-spanning RAM disk (CRD) interposed in the data path between a storage server and a computer server. The CRD addresses performance problems with applications that need to access large amounts of data and are negatively impacted by the latency of classic disk-based storage systems. It solves this problem by placing the data the application needs into a large (with respect to the server's main memory) RAM-based cache where it can be accessed with extremely low latency, hence improving the performance of the application significantly. The CRD is implemented using a novel architecture which has very significant cost and performance advantages over existing or alternative solutions.
摘要翻译：提供高性能和高度可扩展的存储加速的方法和装置包括插入在存储服务器和计算机服务器之间的数据路径中的集群节点跨越RAM盘（CRD）。 CRD解决了需要访问大量数据的应用程序的性能问题，并受到传统的基于磁盘的存储系统的延迟的负面影响。它通过将应用程序需要的数据放置在相对于服务器的主存储器（RAM）的高速缓存中来解决这个问题，可以以极低的延迟访问它，从而显着提高了应用程序的性能。 CRD使用一种新颖的架构实现，与现有或替代解决方案相比，其具有非常显着的成本和性能优势。

2. 发明授权

US07931849B2 Non-destructive laser optical integrated circuit package marking 有权
标题翻译：无损激光光学集成电路封装标记
公开(公告)号：US07931849B2
公开(公告)日：2011-04-26
申请号：US12242545
申请日：2008-09-30
申请人： Joseph Martin Patterson
发明人： Joseph Martin Patterson
IPC分类号： B29C35/08 , H01L21/66 , B23K26/00
CPC分类号： H01L23/544 , B41M5/24 , B41M5/267 , H01L24/48 , H01L24/49 , H01L2223/5448 , H01L2223/54486 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method is provided for laser optically marking integrated circuit (IC) packages in a non-destructive manner. The method provides an IC die encapsulated as a package in a compound of glass spheres and epoxy. An acute angle is defined between a laser optical path and an IC package planar surface. The IC package surface is scanned with a laser, and in response to ablating the IC package surface, a legible mark on the planar surface.
摘要翻译：提供了一种用于以非破坏性方式激光对集成电路（IC）封装进行光学标记的方法。该方法提供封装在玻璃球和环氧树脂化合物中的IC封装。在激光光路和IC封装平面之间限定锐角。 IC封装表面用激光扫描，并且响应于消除IC封装表面，在平坦表面上具有清晰的标记。

3. 发明授权

US07916397B2 Micro array lens using optical fiber 有权
标题翻译：微阵列镜头采用光纤
公开(公告)号：US07916397B2
公开(公告)日：2011-03-29
申请号：US12822070
申请日：2010-06-23
申请人： Joseph Martin Patterson
发明人： Joseph Martin Patterson
IPC分类号： G02B27/10
CPC分类号： G02B3/0056
摘要： An optical fiber micro array lens is provided along with an associated fabrication method. The micro array lens is fabricated from a mesh of optical fibers. The mesh includes a first plurality of cylindrical optical fibers. Each fiber from the first plurality has a flat bottom surface and a hemicylindrical top surface. The top and bottom surfaces are aligned in parallel with a central fiber axis. The mesh also includes a second plurality of cylindrical optical fibers. Each fiber from the second plurality has a hemicylindrical bottom surface overlying and in contact with the top surfaces of the first plurality of optical fibers, and a flat top surface. The top and bottom surfaces are aligned in parallel with a central fiber axis. Each contact of the first and second plurality of optical fibers forms a lens assembly in a micro array of lenses.
摘要翻译：提供了一种光纤微阵列透镜以及相关的制造方法。微阵列透镜由光纤网制成。网格包括第一多个圆柱形光纤。来自第一多个的每个纤维具有平坦的底表面和半圆柱形顶表面。顶部和底部表面与中心纤维轴平行排列。网格还包括第二多个圆柱形光纤。来自第二多个光纤的每个光纤具有覆盖并与第一多个光纤的顶表面接触的半圆柱形底表面和平坦的顶表面。顶部和底部表面与中心纤维轴平行排列。第一和第二多个光纤的每个接触在透镜的微阵列中形成透镜组件。

4. 发明申请

US20100327875A1 Integrated Circuit Thermally Induced Noise Analysis 有权
标题翻译：集成电路热诱导噪声分析
公开(公告)号：US20100327875A1
公开(公告)日：2010-12-30
申请号：US12490729
申请日：2009-06-24
申请人： Joseph Martin Patterson
发明人： Joseph Martin Patterson
IPC分类号： G01R31/26 , G01R31/00
CPC分类号： G01R31/2875 , G01R31/303
摘要： A system and method are provided for testing an integrated circuit (IC) using thermally induced noise analysis. The method provides an IC die and supplies electrical power to the IC die. The IC die surface is scanned with a laser, and the laser beam irradiated locations on the IC die surface are tracked. The laser scanning heats active electrical elements underlying the scanned IC die surface. A frequency response of an IC die electrical interface is measured and correlated to irradiated locations. IC die defect regions are determined in response to identifying location-correlated frequency measurements exceeding a noise threshold. For example, a frequency measurement may be correlated to a die surface location, and if frequency measurement exceeds the noise threshold, then circuitry underlying that surface area may be identified as defective. Typically, die defect regions are associated with measurements in the frequency range between about 1 Hertz and 10 kilohertz.
摘要翻译：提供了一种使用热感应噪声分析测试集成电路（IC）的系统和方法。该方法提供IC芯片并且为IC芯片提供电力。利用激光扫描IC芯片表面，并跟踪IC芯片表面上的激光束照射位置。激光扫描加热扫描IC芯片表面下方的有源电气元件。测量IC芯片电接口的频率响应并将其与辐射位置相关联。响应于识别超过噪声阈值的位置相关频率测量来确定IC芯片缺陷区域。例如，频率测量可以与模具表面位置相关联，并且如果频率测量超过噪声阈值，则该表面积下面的电路可能被识别为有缺陷的。通常，管芯缺陷区域在约1赫兹和10千赫兹之间的频率范围内的测量值相关联。

5. 发明申请

US20100177405A1 Optical Fiber Micro Array Lens 有权
标题翻译：光纤微阵列透镜
公开(公告)号：US20100177405A1
公开(公告)日：2010-07-15
申请号：US12352640
申请日：2009-01-13
申请人： Joseph Martin Patterson
发明人： Joseph Martin Patterson
IPC分类号： G02B3/06 , G02B9/04
CPC分类号： G02B3/0056
摘要： An optical fiber micro array lens is provided along with an associated fabrication method. The micro array lens is fabricated from a mesh of optical fibers. The mesh includes a first plurality of cylindrical optical fibers. Each fiber from the first plurality has a flat bottom surface and a hemicylindrical top surface. The top and bottom surfaces are aligned in parallel with a central fiber axis. The mesh also includes a second plurality of cylindrical optical fibers. Each fiber from the second plurality has a hemicylindrical bottom surface overlying and in contact with the top surfaces of the first plurality of optical fibers, and a flat top surface. The top and bottom surfaces are aligned in parallel with a central fiber axis. Each contact of the first and second plurality of optical fibers forms a lens assembly in a micro array of lenses.
摘要翻译：提供了一种光纤微阵列透镜以及相关的制造方法。微阵列透镜由光纤网制成。网格包括第一多个圆柱形光纤。来自第一多个的每个纤维具有平坦的底表面和半圆柱形顶表面。顶部和底部表面与中心纤维轴平行排列。网格还包括第二多个圆柱形光纤。来自第二多个光纤的每个光纤具有覆盖并与第一多个光纤的顶表面接触的半圆柱形底表面和平坦的顶表面。顶部和底部表面与中心纤维轴平行排列。第一和第二多个光纤的每个接触在透镜的微阵列中形成透镜组件。

6. 发明授权

US07703102B1 Approach for allocating resources to an apparatus based on preemptable resource requirements 有权
标题翻译：基于可抢占资源需求为设备分配资源的方法
公开(公告)号：US07703102B1
公开(公告)日：2010-04-20
申请号：US11042812
申请日：2005-01-24
申请人： Christopher M. Eppstein , Ashar Aziz , Thomas Markson , Martin Patterson
发明人： Christopher M. Eppstein , Ashar Aziz , Thomas Markson , Martin Patterson
IPC分类号： G06F9/46 , G06F15/177 , G06F15/173
CPC分类号： H04L41/0896 , G06F9/5011 , H04L41/22 , H04L67/1002 , H04L67/1012 , H04L67/1023
摘要： An approach for allocating resources to an apparatus based on preemptable resource requirements generally involves a resource allocator determining that a resource that satisfies a resource requirement for one apparatus is not available but that another resource that currently satisfies another resource requirement for another apparatus does satisfy the resource requirement. The resource allocator determines that the other resource requirement for the other apparatus is characterized in that resources that currently satisfy the other resource requirement may be de-allocated from the other apparatus, such as a preemptable resource requirement. The resource allocator de-allocates the resource from the other apparatus and allocates the resource to the one apparatus. A preemptable resource requirement can be based on a suspendable resource requirement or a set of alternative resource requirements.
摘要翻译：基于可抢占的资源需求向装置分配资源的方法通常包括资源分配器，其确定满足一个装置的资源需求的资源不可用，但是当前满足另一装置的另一资源需求的另一资源确实满足资源需求。资源分配器确定另一设备的其他资源需求的特征在于，当前满足其他资源需求的资源可以从其他设备（诸如可抢占资源需求）中被去分配。资源分配器从其他设备中分配资源，并将资源分配给一个设备。可抢占的资源需求可以基于可暂停的资源需求或一组替代资源需求。

7. 发明授权

US07659750B2 Thermal electric NOR gate 有权
标题翻译：热电NOR门
公开(公告)号：US07659750B2
公开(公告)日：2010-02-09
申请号：US12120109
申请日：2008-05-13
申请人： Joseph Martin Patterson
发明人： Joseph Martin Patterson
IPC分类号： H03K19/20
CPC分类号： H03K19/02
摘要： A thermal electric (TE) binary NOR gate logic circuit is provided with a method for NOR logic gating. The method accepts a first input voltage representing an input binary logic state and generates a first thermal electric (TE) temperature in response to the first input voltage. A second input voltage is accepted representing an input binary logic state, and a second TE temperature is generated in response to the second input voltage. In response to the first and second TE temperatures, a NOR logic state output voltage is generated. More explicitly, a first control voltage is generated in response to the first TE temperature, and a second control voltage is generated in response to the second TE temperature. Then, a third TE temperature is generated in response to the first and second control voltages, which in turn generates the output voltage.
摘要翻译：热电（TE）二进制或非门逻辑电路提供了一种用于或非逻辑门控的方法。该方法接受表示输入二进制逻辑状态的第一输入电压，并且响应于第一输入电压产生第一热电（TE）温度。接受表示输入二进制逻辑状态的第二输入电压，并且响应于第二输入电压产生第二TE温度。响应于第一和第二TE温度，产生NOR逻辑状态输出电压。更明确地，响应于第一TE温度产生第一控制电压，并且响应于第二TE温度产生第二控制电压。然后，响应于第一和第二控制电压产生第三TE温度，其又产生输出电压。

8. 发明申请

US20090325322A1 Non-Destructive Laser Optical Integrated Circuit Package Marking 有权
标题翻译：非破坏性激光光学集成电路封装标记
公开(公告)号：US20090325322A1
公开(公告)日：2009-12-31
申请号：US12242545
申请日：2008-09-30
申请人： Joseph Martin Patterson
发明人： Joseph Martin Patterson
IPC分类号： H01L21/66
CPC分类号： H01L23/544 , B41M5/24 , B41M5/267 , H01L24/48 , H01L24/49 , H01L2223/5448 , H01L2223/54486 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method is provided for laser optically marking integrated circuit (IC) packages in a non-destructive manner. The method provides an IC die encapsulated as a package in a compound of glass spheres and epoxy. An acute angle is defined between a laser optical path and an IC package planar surface. The IC package surface is scanned with a laser, and in response to ablating the IC package surface, a legible mark on the planar surface.
摘要翻译：提供了一种用于以非破坏性方式激光对集成电路（IC）封装进行光学标记的方法。该方法提供封装在玻璃球和环氧树脂化合物中的IC封装。在激光光路和IC封装平面之间限定锐角。 IC封装表面用激光扫描，并且响应于消除IC封装表面，在平坦表面上具有清晰的标记。

9. 发明申请

US20090323287A1 Integrated Circuit Cooling Apparatus for Focused Beam Processes 审中-公开
标题翻译：用于聚焦光束处理的集成电路冷却装置
公开(公告)号：US20090323287A1
公开(公告)日：2009-12-31
申请号：US12330376
申请日：2008-12-08
申请人： Joseph Martin Patterson
发明人： Joseph Martin Patterson
IPC分类号： H05K7/20
CPC分类号： H01L21/67098 , B23K26/703 , H01J37/20 , H01J37/28 , H01J2237/2001 , H01J2237/2007 , H01J2237/2817 , H01J2237/31745 , H01J2237/31749
摘要： A fixture and method are provided for cooling an IC in the performance of focused beam processes. The method provides a holding/cooling fixture with thermal electric (TE) jaws having an IC interface surface and a heatsink interface. An IC die is secured between the IC interface surfaces of the jaws. Electrical energy is supplied to the TE jaws, creating a negative temperature differential between the IC interface and heatsink interfaces. As a result, the IC die is cooled. A focused beam is applied to a local region of the IC die. Some examples of the focused beam include a focused ion beam (FIB), scanning electron microscope (SEM), E-beam, or a laser scanning microscope (LSM). The focused beam heats the local region of the IC, while the bulk of the IC remains cooled. Typically, each TE jaw includes a plurality of TE elements thermally connected in series.
摘要翻译：提供了一种夹具和方法，用于在聚焦光束过程的执行中冷却IC。该方法提供具有具有IC接口表面和散热器接口的热电（TE）钳口的保持/冷却固定装置。 IC芯片固定在钳口的IC接口表面之间。电能供应到TE钳口，在IC接口和散热器接口之间产生负温差。结果，IC管芯被冷却。聚焦光束被施加到IC芯片的局部区域。聚焦光束的一些实例包括聚焦离子束（FIB），扫描电子显微镜（SEM），电子束或激光扫描显微镜（LSM）。聚焦光束加热IC的局部区域，而大部分IC仍然冷却。通常，每个TE卡爪包括串联热连接的多个TE元件。

10. 发明申请

US20090206907A1 Thermaltronic Analog Device 有权
标题翻译： Thermaltronic模拟器件
公开(公告)号：US20090206907A1
公开(公告)日：2009-08-20
申请号：US12237027
申请日：2008-09-24
申请人： Joseph Martin Patterson
发明人： Joseph Martin Patterson
IPC分类号： G06G7/24
CPC分类号： H03K19/02
摘要： A method is provided for the electronic processing of analog signals in thermaltronic device. The method accepts an analog input signal, e.g., an AC signal, at a thermaltronic device input and generates a thermal electric (TE) temperature having a first transfer function responsive to the input signal. As opposed to having a digital response, the transfer function is either linear or logarithmic. An analog output signal, e.g., an AC signal, is generated having a second transfer function responsive to the TE, which is likewise either linear or logarithmic.
摘要翻译：提供了一种用于在热电子器件中进行模拟信号的电子处理的方法。该方法在热电子设备输入处接收模拟输入信号，例如AC信号，并产生响应于输入信号的具有第一传递函数的热电（TE）温度。与数字响应相反，传递函数是线性或对数的。产生具有响应于TE的第二传递函数的模拟输出信号，例如AC信号，其同样是线性或对数的。

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