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2. 发明申请

US20080233663A1 SINGULATED BARE DIE TESTING 审中-公开
标题翻译：复合哑铃测试
公开(公告)号：US20080233663A1
公开(公告)日：2008-09-25
申请号：US11835545
申请日：2007-08-08
申请人： Robert Norbeck , Mark Ojeda , Ed Aquino
发明人： Robert Norbeck , Mark Ojeda , Ed Aquino
IPC分类号： H01L21/66 , G01R31/02
CPC分类号： G01R31/2893
摘要： There is testing of individual dice prior to their inclusion in a multi-chip package. A wafer is sawn into individual dice and the dice are placed onto a die tray. If the tray is not full, then dice can be added that originate from other wafers. Contacts perform diagnostic tests upon the dice to determine if individual dice function as expected. Mapping talkes place to distinguish between dice that passed the diagnostic test and those that did not. Multiple tests can take place in series, where various forms of consolidation and mapping takes place. Passing dice can become part of a multi-chip package while failing dice can be re-screened or scrapped.
摘要翻译：在将其包含在多芯片封装中之前，已经对各个骰子进行了测试。将晶片锯成单个骰子，并将骰子放置在模具托盘上。如果托盘未满，则可以添加源自其他晶片的骰子。联系人对骰子执行诊断测试，以确定骰子是否按预期方式运行。映射谈话的地方区分通过诊断测试的骰子和没有诊断测试的骰子。可以进行多种测试，其中进行各种形式的合并和映射。通过骰子可以成为多芯片封装的一部分，而骰子可能会被重新屏蔽或报废。

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