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1. 发明授权

US06333491B1 Apparatus and method for non-destructive, low stress removal of soldered electronic components 失效
公开(公告)号：US06333491B1
公开(公告)日：2001-12-25
申请号：US09704033
申请日：2000-11-01
申请人： Christian Bergeron , Raymond Lord , Mario Racicot
发明人： Christian Bergeron , Raymond Lord , Mario Racicot
IPC分类号： B23K300
CPC分类号： B23K1/018 , B23K2101/40
摘要： Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.

2. 发明授权

US6163014A Apparatus and method for non-destructive, low stress removal of soldered electronic components 失效
标题翻译：用于焊接电子部件的非破坏性，低应力消除的装置和方法
公开(公告)号：US6163014A
公开(公告)日：2000-12-19
申请号：US460279
申请日：1999-12-13
申请人： Christian Bergeron , Raymond Lord , Mario Racicot
发明人： Christian Bergeron , Raymond Lord , Mario Racicot
IPC分类号： B23K1/018 , B23K3/00 , B23K31/02 , F27B9/00 , F27B9/36
CPC分类号： B23K1/018 , B23K2101/40
摘要： Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.
摘要翻译：诸如已知的良好裸片（KGD）芯片的电路芯片从包括连接到至少一个芯片载体或衬底的多个电路芯片的组件中移除。基板被保持在顶板内，其中电路芯片位于底板内的相继的芯片空腔内。每个芯片腔包括相对于相邻的芯片腔由级联效应间距分开的负载表面。将级联效应剪切力依次施加到电路芯片以将其从衬底移除。芯片可以被加热到在焊料连接是固体的温度范围内有助于剪切的温度，并且芯片在拆卸之后进一步加热到焊料是液体的温度，以便于重新形成焊料以便随后将芯片连接到电子设备。

3. 发明授权

US06320163B2 Apparatus and method for non-destructive, low stress removal of soldered electronic components 失效
标题翻译：用于焊接电子部件的非破坏性，低应力消除的装置和方法
公开(公告)号：US06320163B2
公开(公告)日：2001-11-20
申请号：US09736589
申请日：2000-12-13
申请人： Christian Bergeron , Raymond Lord , Mario Racicot
发明人： Christian Bergeron , Raymond Lord , Mario Racicot
IPC分类号： B23K300
CPC分类号： B23K1/018 , B23K2101/40 , G06F11/26
摘要： Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.
摘要翻译：诸如已知的良好裸片（KGD）芯片的电路芯片从包括连接到至少一个芯片载体或衬底的多个电路芯片的组件中移除。基板被保持在顶板内，其中电路芯片位于底板内的相继的芯片空腔内。每个芯片腔包括相对于相邻的芯片腔由级联效应间距分开的负载表面。将级联效应剪切力依次施加到电路芯片以将其从衬底移除。芯片可以被加热到在焊料连接是固体的温度范围内有助于剪切的温度，并且芯片在拆卸之后进一步加热到焊料是液体的温度，以便于重新形成焊料以便随后将芯片连接到电子设备。

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