会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明申请
    • TERMINATION DESIGN BY METAL STRAPPING GUARD RING TRENCHES SHORTED TO A BODY REGION TO SHRINK TERMINATION AREA
    • 终止设计通过金属捆绑护栏紧固到一个身体部位到收缩终止区域
    • US20150162410A1
    • 2015-06-11
    • US14098538
    • 2013-12-06
    • Karthik PadmanabhanMadhur Bobde
    • Karthik PadmanabhanMadhur Bobde
    • H01L29/40H01L29/78H01L29/36
    • H01L29/7802H01L29/0623H01L29/0878H01L29/1095H01L29/36H01L29/407H01L29/66712H01L29/78H01L29/7811
    • This invention discloses a semiconductor power device formed in a semiconductor substrate of a first conductivity type comprises an active cell area and a termination area surrounding the active cell area and disposed near edges of the semiconductor substrate. The termination area includes a plurality of trenches filled with a conductivity material forming a shield electrode and insulated by a dielectric layer along trench sidewalls and trench bottom surface wherein the trenches extending vertically through a body region of a second conductivity type near a top surface of the semiconductor substrate and further extending through a surface shield region of the first conductivity type. A dopant region of the second conductivity type disposed below the surface shield region extending across and surrounding a trench bottom portion of the trenches. At least a metal connector disposed above the top surface of the semiconductor substrates electrically connecting to the shield electrode of at least two trenches and shorted to the body region.
    • 本发明公开了一种形成在第一导电类型的半导体衬底中的半导体功率器件,包括有源电池区域和围绕有源电池区域的端接区域,并设置在半导体衬底的边缘附近。 终端区域包括填充有形成屏蔽电极的导电材料的多个沟槽,并且沿着沟槽侧壁和沟槽底表面被电介质层绝缘,其中沟槽垂直延伸穿过第二导电类型的体区附近靠近顶部表面 并且还延伸穿过第一导电类型的表面屏蔽区域。 第二导电类型的掺杂剂区域设置在表面屏蔽区域的下方,延伸穿过并围绕沟槽的沟槽底部。 至少一个金属连接器,设置在半导体衬底的顶表面之上,电连接到至少两个沟槽的屏蔽电极并且短路到身体区域。
    • 7. 发明授权
    • Dual-gate trench IGBT with buried floating P-type shield
    • 双栅极沟槽IGBT,埋入浮动P型屏蔽
    • US09048282B2
    • 2015-06-02
    • US13831066
    • 2013-03-14
    • Jun HuMadhur BobdeHamza Yilmaz
    • Jun HuMadhur BobdeHamza Yilmaz
    • H01L29/66H01L29/739
    • H01L29/7395H01L29/0623H01L29/0696H01L29/407H01L29/42368H01L29/4238H01L29/66333
    • A method of manufacturing an insulated gate bipolar transistor (IGBT) device comprising 1) preparing a semiconductor substrate with an epitaxial layer of a first conductivity type supported on the semiconductor substrate of a second conductivity type; 2) applying a gate trench mask to open a first trench and second trench followed by forming a gate insulation layer to pad the trench and filling the trench with a polysilicon layer to form the first trench gate and the second trench gate; 3) implanting dopants of the first conductivity type to form an upper heavily doped region in the epitaxial layer; and 4) forming a planar gate on top of the first trench gate and apply implanting masks to implant body dopants and source dopants to form a body region and a source region near a top surface of the semiconductor substrate.
    • 一种制造绝缘栅双极晶体管(IGBT)器件的方法,包括:1)制备具有第一导电类型的外延层的半导体衬底,该半导体衬底支撑在第二导电类型的半导体衬底上; 2)施加栅极沟槽掩模以打开第一沟槽和第二沟槽,随后形成栅极绝缘层以衬垫沟槽并用多晶硅层填充沟槽以形成第一沟槽栅极和第二沟槽栅极; 3)注入第一导电类型的掺杂剂以在外延层中形成上重掺杂区; 以及4)在所述第一沟槽栅极的顶部上形成平面栅极,并且将注入掩模施加到植入物体掺杂剂和源掺杂剂以在所述半导体衬底的顶表面附近形成体区域和源极区域。
    • 10. 发明授权
    • Self-aligned slotted accumulation-mode field effect transistor (AccuFET) structure and method
    • 自对准开槽积分型场效应晶体管(AccuFET)结构及方法
    • US08878292B2
    • 2014-11-04
    • US12074280
    • 2008-03-02
    • François HébertMadhur BobdeAnup Bhalla
    • François HébertMadhur BobdeAnup Bhalla
    • H01L29/739
    • H01L29/7828H01L29/0619H01L29/0623H01L29/0847H01L29/41766H01L29/456H01L29/66666
    • This invention discloses a semiconductor power device disposed in a semiconductor substrate. The semiconductor power device includes trenched gates each having a stick-up gate segment extended above a top surface of the semiconductor substrate surrounded by sidewall spacers. The semiconductor power device further includes slots opened aligned with the sidewall spacers substantially parallel to the trenched gates. The stick-up gate segment further includes a cap composed of an insulation material surrounded by the sidewall spacers. A layer of barrier metal covers a top surface of the cap and over the sidewall spacers and extends above a top surface of the slots. The slots are filled with a gate material same as the gate segment for functioning as additional gate electrodes for providing a depletion layer extends toward the trenched gates whereby a drift region between the slots and the trenched gate is fully depleted at a gate-to-drain voltage Vgs=0 volt.
    • 本发明公开了一种设置在半导体衬底中的半导体功率器件。 半导体功率器件包括沟槽栅极,每个沟槽栅极具有在由侧壁间隔物围绕的半导体衬底的顶表面之上延伸的伸出栅极段。 半导体功率器件还包括与基本上平行于沟槽栅极的侧壁间隔开的开口的槽。 粘贴门区段还包括由侧壁间隔物围绕的绝缘材料构成的盖。 阻挡金属层覆盖盖的顶表面并且覆盖在侧壁间隔物上并在槽的顶表面上方延伸。 这些槽填充有与栅极段相同的栅极材料,用作附加栅电极,用于提供向沟槽栅极延伸的耗尽层,借此栅极与沟槽栅极之间的漂移区域完全耗尽栅极 - 漏极 电压Vgs = 0伏。