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1. 发明授权

US08851259B2 Electromagnetic clutch, compressor, and manufacturing method for electromagnetic clutch 有权
标题翻译：电磁离合器，压缩机及电磁离合器的制造方法
公开(公告)号：US08851259B2
公开(公告)日：2014-10-07
申请号：US13379129
申请日：2010-06-17
申请人： Masafumi Hamasaki , Masanori Takahashi , Shinichi Isobe
发明人： Masafumi Hamasaki , Masanori Takahashi , Shinichi Isobe
IPC分类号： F16D27/112 , F04C29/00 , F16D27/06 , F04C18/02 , F16D27/00
CPC分类号： F16D27/112 , F04C18/0215 , F04C29/005 , F16D27/06 , F16D2027/008 , F16D2300/10 , Y10T29/4902
摘要： When grooves 44, 45A and 45B of an armature 42 and a rotor 43 are formed by laser beam machining, a metal oxide layer 100 is formed on wall surfaces defining the grooves 44, 45A and 45B. The metal oxide layer 100 is brought into sliding contact with a first contact surface A1 to a fourth contact surface A4 in a process in which an electromagnetic clutch is used, so that a part of the metal oxide layer 100 is ground and peeled off, whereby particles made of a metal oxide are produced. The particles enter the contact surface between the armature 42 and the rotor 43, which increases the frictional force therebetween to thereby prevent slippage. As a result, the torque transmission capability of the electromagnetic clutch M is enhanced, and the increase in the torque of a scroll compressor is achieved.
摘要翻译：当通过激光束加工形成电枢42和转子43的槽44,45A和45B时，在限定槽44,45A和45B的壁表面上形成金属氧化物层100。在使用电磁离合器的过程中，使金属氧化物层100与第一接触面A1滑动接触到第四接触面A4，使得金属氧化物层100的一部分被研磨剥离，由此制造由金属氧化物制成的颗粒。颗粒进入衔铁42和转子43之间的接触表面，这增加了它们之间的摩擦力，从而防止滑动。结果，提高了电磁离合器M的转矩传递能力，并且实现了涡旋式压缩机的转矩的增加。

2. 发明授权

US08717135B2 Electronic component and method of manufacturing the same 有权
标题翻译：电子部件及其制造方法
公开(公告)号：US08717135B2
公开(公告)日：2014-05-06
申请号：US13566836
申请日：2012-08-03
申请人： Koichiro Wada , Masashi Kuwahara , Yoshinari Nakada , Yuichi Kasuya , Masanori Takahashi , Tetsuo Kumahora
发明人： Koichiro Wada , Masashi Kuwahara , Yoshinari Nakada , Yuichi Kasuya , Masanori Takahashi , Tetsuo Kumahora
IPC分类号： H01F27/02 , H01F27/24
CPC分类号： H01F27/02 , H01F1/33 , H01F17/045 , H01F27/022 , H01F27/255 , H01F27/292 , Y10T29/49071
摘要： An electronic component has a drum-shaped core member constituted by an assembly of soft magnetic alloy grains containing iron (Fe), silicate (Si) and chromium (Cr), a coil conductive wire wound around the core member, a pair of terminal electrodes connected to ends of the coil conductive wire, and an outer sheath resin part covering the wound coil conductive wire and constituted by a magnetic powder-containing resin; wherein there is an area where only the resin material in the magnetic powder-containing resin is permeated from the surface of the core member to a specified depth.
摘要翻译：电子部件具有由铁（Fe），硅酸盐（Si）和铬（Cr）组成的软磁性合金晶粒组成的鼓形铁芯构件，缠绕在芯构件上的线圈导电线，一对端子电极连接到线圈导线的端部，以及覆盖卷绕的线圈导线并由含磁性粉末的树脂构成的外护套树脂部; 其中存在只有含磁粉的树脂中的树脂材料从芯构件的表面渗透到指定深度的区域。

3. 发明授权

US08710642B2 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus 有权
标题翻译：半导体装置，半导体装置的制造方法以及电子装置
公开(公告)号：US08710642B2
公开(公告)日：2014-04-29
申请号：US13424586
申请日：2012-03-20
申请人： Masanori Takahashi
发明人： Masanori Takahashi
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/3511 , H05K1/144 , H05K3/284 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device includes a first wiring board, a first semiconductor element mounted on the first wiring board, a second wiring board disposed over the first semiconductor element, and a second semiconductor element mounted on the second wiring board. The wiring boards are electrically interconnected by a connecting portion interposed therebetween. A resin layer is formed between the wiring boards such that the first semiconductor element mounted on the first wiring board is sealed and such that the wiring boards having the respective semiconductor elements mounted thereon are bonded together.
摘要翻译：半导体器件包括第一布线板，安装在第一布线板上的第一半导体元件，设置在第一半导体元件上的第二布线板以及安装在第二布线板上的第二半导体元件。布线板通过插入其间的连接部分电互连。在布线板之间形成树脂层，使得安装在第一布线板上的第一半导体元件被密封，并且将其上安装有各个半导体元件的布线板接合在一起。

4. 发明授权

US08642760B2 Low hygroscopic aripiprazole drug substance and processes for the preparation thereof 有权
标题翻译：低吸湿性阿立哌唑药物及其制备方法
公开(公告)号：US08642760B2
公开(公告)日：2014-02-04
申请号：US13067750
申请日：2011-06-23
申请人： Takuji Bando , Satoshi Aoki , Junichi Kawasaki , Makoto Ishigami , Youichi Taniguchi , Tsuyoshi Yabuuchi , Kiyoshi Fujimoto , Yoshihiro Nishioka , Noriyuki Kobayashi , Tsutomu Fujimura , Masanori Takahashi , Kaoru Abe , Tomonori Nakagawa , Koichi Shinhama , Naoto Utsumi , Michiaki Tominaga , Yoshihiro Ooi , Shohei Yamada , Kenji Tomikawa
发明人： Takuji Bando , Satoshi Aoki , Junichi Kawasaki , Makoto Ishigami , Youichi Taniguchi , Tsuyoshi Yabuuchi , Kiyoshi Fujimoto , Yoshihiro Nishioka , Noriyuki Kobayashi , Tsutomu Fujimura , Masanori Takahashi , Kaoru Abe , Tomonori Nakagawa , Koichi Shinhama , Naoto Utsumi , Michiaki Tominaga , Yoshihiro Ooi , Shohei Yamada , Kenji Tomikawa
IPC分类号： C07D401/12
CPC分类号： C07D215/227 , C07B2200/13 , C07D215/22 , Y10T428/2982
摘要： The present invention provides low hygroscopic forms of aripiprazole and processes for the preparation thereof which will not convert to a hydrate or lose their original solubility even when a medicinal preparation containing the anhydrous Aripiprazole crystals is stored for an extended period.
摘要翻译：本发明提供低吸湿形式的阿立哌唑及其制备方法，即使当含有无水阿立哌唑晶体的药物制剂长时间储存时，其也不会转化为水合物或丧失其原始溶解度。

5. 发明申请

US20130200972A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US20130200972A1
公开(公告)日：2013-08-08
申请号：US13566836
申请日：2012-08-03
申请人： Koichiro WADA , Masashi KUWAHARA , Yoshinari NAKADA , Yuichi KASUYA , Masanori TAKAHASHI , Tetsuo KUMAHORA
发明人： Koichiro WADA , Masashi KUWAHARA , Yoshinari NAKADA , Yuichi KASUYA , Masanori TAKAHASHI , Tetsuo KUMAHORA
IPC分类号： H01F27/02 , H01F41/06
CPC分类号： H01F27/02 , H01F1/33 , H01F17/045 , H01F27/022 , H01F27/255 , H01F27/292 , Y10T29/49071
摘要： An electronic component has a drum-shaped core member constituted by an assembly of soft magnetic alloy grains containing iron (Fe), silicate (Si) and chromium (Cr), a coil conductive wire wound around the core member, a pair of terminal electrodes connected to ends of the coil conductive wire, and an outer sheath resin part covering the wound coil conductive wire and constituted by a magnetic powder-containing resin; wherein there is an area where only the resin material in the magnetic powder-containing resin is permeated from the surface of the core member to a specified depth.
摘要翻译：电子部件具有由铁（Fe），硅酸盐（Si）和铬（Cr）组成的软磁性合金晶粒组成的鼓形铁芯构件，缠绕在芯构件上的线圈导电线，一对端子电极连接到线圈导线的端部，以及覆盖卷绕的线圈导线并由含磁性粉末的树脂构成的外护套树脂部; 其中存在只有含磁粉的树脂中的树脂材料从芯构件的表面渗透到指定深度的区域。

6. 发明申请

US20130194060A1 WIRE-WOUND INDUCTOR 有权
标题翻译：电线电感
公开(公告)号：US20130194060A1
公开(公告)日：2013-08-01
申请号：US13566847
申请日：2012-08-03
申请人： Yoshinari NAKADA , Koichiro WADA , Yuichi KASUYA , Masanori TAKAHASHI , Masashi KUWAHARA , Tetsuo KUMAHORA
发明人： Yoshinari NAKADA , Koichiro WADA , Yuichi KASUYA , Masanori TAKAHASHI , Masashi KUWAHARA , Tetsuo KUMAHORA
IPC分类号： H01F27/00
CPC分类号： H01F17/04 , H01F1/33 , H01F17/045 , H01F27/00 , H01F27/255 , H01F27/292 , H01F2017/048 , Y10T29/4902
摘要： Provided are a small wire-wound inductor having desired inductor characteristics, while allowing for high-density mounting and low-height mounting on circuit boards at the same time, as well as a method for manufacturing such wire-wound inductor which has a drum-shaped core member constituted by an assembly of soft magnetic alloy grains containing iron (Fe), silicon (Si) and 2 to 15 percent by weight of chromium (Cr), a coil conductive wire wound around the core member, a pair of terminal electrodes connected to the terminals of the coil conductive wire, and an outer sheath member covering the wound coil conductive wire and constituted by a magnetic powder-containing resin having a specified magnetic permeation ratio.
摘要翻译：提供了具有期望的电感特性的小型绕线电感器，同时允许同时在电路板上高密度安装和低高度安装，以及制造这种具有滚筒式电感器的绕线电感器的方法，由铁（Fe），硅（Si）和2〜15重量％的铬（Cr）构成的软磁性合金粒子的组合构成的环状芯部件，缠绕在芯部件上的线圈导电线，一对端子电极连接到线圈导线的端子，以及覆盖卷绕的线圈导线并由具有规定的磁导率的含磁性粉末的树脂构成的外护套构件。

7. 发明授权

US08474130B2 Tripod constant velocity joint, and method and device for assembling same 有权
标题翻译：三脚架等速万向节，以及组装方法和装置
公开(公告)号：US08474130B2
公开(公告)日：2013-07-02
申请号：US13263991
申请日：2010-02-22
申请人： Yoshihiro Tokuda , Masafumi Yamamoto , Masanori Takahashi , Hideki Kobayashi , Kaoru Tanaka , Yuki Funaki , Tomohiko Yamamoto , Tetsuya Watanabe
发明人： Yoshihiro Tokuda , Masafumi Yamamoto , Masanori Takahashi , Hideki Kobayashi , Kaoru Tanaka , Yuki Funaki , Tomohiko Yamamoto , Tetsuya Watanabe
IPC分类号： B23P19/00 , F16D3/205
CPC分类号： F16D3/2055 , B23P19/086 , B23P21/002 , Y10T29/49895 , Y10T29/53091 , Y10T29/53687
摘要： Provided are a tripod constant velocity joint, and a method and a device for assembling the joint. The opening of a through-hole formed in an inner member of the tripod constant velocity joint has formed therein a tapered, reduced diameter section having a diameter tapered from the opening toward the inside. A first annular groove is formed in the side wall of a driving power transmission shaft, and a clip serving as an engaging member is engaged with the first annular groove. A second annular groove is formed in the inner wall of the through-hole in the inner member. In inserting the driving power transmission shaft through the through-hole in the inner member, the tapered, reduced diameter section guides the shaft in such a manner that the clip is contracted toward the bottom surface of the first annular groove. The clip expands and contracts due to the elasticity thereof when the positions of the first annular groove and the second annular groove coincide with each other.
摘要翻译：提供三脚架等速万向节，以及组装接头的方法和装置。形成在三球销等速万向节的内部构件中的通孔的开口形成有从开口向内侧逐渐变细的锥形的直径减小的部分。第一环形槽形成在驱动动力传递轴的侧壁中，并且用作接合构件的夹与第一环形槽接合。第二环形槽形成在内部构件中的通孔的内壁中。在驱动动力传递轴通过内部构件中的通孔插入时，锥形减小部分引导轴，使得夹子朝向第一环形槽的底表面收缩。当第一环形槽和第二环形槽的位置彼此重合时，夹子由于其弹性而膨胀和收缩。

8. 发明申请

US20130083455A1 SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：US20130083455A1
公开(公告)日：2013-04-04
申请号：US13614594
申请日：2012-09-13
申请人： Masanori Takahashi , Satoshi Iwai
发明人： Masanori Takahashi , Satoshi Iwai
IPC分类号： H01G9/048
CPC分类号： H01G9/025 , H01G9/15 , H01G11/56
摘要： The present invention provides a solid electrolytic capacitor and a method producing the same, in which high reliability is realized and further in which the product yield is improved by suppressing the increase of ESR or the like. In the present invention, the electroconductive polymer layer includes first electroconductive polymer layer 3 and second electroconductive polymer layer 10, in which first electroconductive polymer layer 3 covers the surface of dielectric polymer 2, and the second electroconductive polymer layer is provided on a surface of first electroconductive polymer layer 3 covering the bottom surface and the side surfaces, and is provide with opening at least a part of the leading surface of first electroconductive polymer layer 3.
摘要翻译：本发明提供了一种固体电解电容器及其制造方法，其中实现了高可靠性，并且通过抑制ESR等的增加来提高产品成品率。在本发明中，导电聚合物层包括第一导电聚合物层3和第二导电聚合物层10，其中第一导电聚合物层3覆盖电介质聚合物2的表面，第二导电聚合物层设置在第一导电聚合物层导电聚合物层3覆盖底表面和侧表面，并且为第一导电聚合物层3的前表面的至少一部分提供开口。

9. 发明申请

US20120241950A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS 有权
标题翻译：半导体器件，制造半导体器件的方法和电子设备
公开(公告)号：US20120241950A1
公开(公告)日：2012-09-27
申请号：US13424586
申请日：2012-03-20
申请人： Masanori TAKAHASHI
发明人： Masanori TAKAHASHI
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/3511 , H05K1/144 , H05K3/284 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device includes a first wiring board, a first semiconductor element mounted on the first wiring board, a second wiring board disposed over the first semiconductor element, and a second semiconductor element mounted on the second wiring board. The wiring boards are electrically interconnected by a connecting portion interposed therebetween. A resin layer is formed between the wiring boards such that the first semiconductor element mounted on the first wiring board is sealed and such that the wiring boards having the respective semiconductor elements mounted thereon are bonded together.
摘要翻译：半导体器件包括第一布线板，安装在第一布线板上的第一半导体元件，设置在第一半导体元件上的第二布线板以及安装在第二布线板上的第二半导体元件。布线板通过插入其间的连接部分电互连。在布线板之间形成树脂层，使得安装在第一布线板上的第一半导体元件被密封，并且将其上安装有各个半导体元件的布线板接合在一起。

10. 发明授权

US08213160B2 Solid electrolytic capacitor and method of manufacturing same 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：US08213160B2
公开(公告)日：2012-07-03
申请号：US12076075
申请日：2008-03-13
申请人： Takeshi Saito , Yuji Yoshida , Takeo Kasuga , Koji Sakata , Katsuhiro Yoshida , Masanori Takahashi
发明人： Takeshi Saito , Yuji Yoshida , Takeo Kasuga , Koji Sakata , Katsuhiro Yoshida , Masanori Takahashi
IPC分类号： H01G4/228 , H01G9/10 , H01G9/00 , H05K5/03
CPC分类号： H01G9/012 , H01G9/15 , Y10T29/417
摘要： A solid electrolytic capacitor including a solid electrolytic capacitor component comprises a porous anode body 2 composed of valve metal having a anode lead 1 protruding therefrom, a anode oxide film, a solid electrolyte layer 4, a graphite layer 5, a silver paste layer 6, a resist layer 3 separating the anode lead 1 used as a anode portion and the porous anode body 2 used as a cathode portion, and a anode lead element 7 connected to the anode lead 1, the anode oxide film, solid electrolyte layer 4, graphite layer 5, silver paste layer 6 being successively formed on the surface of the porous anode body 2, wherein the solid electrolytic capacitor component is bonded on a mounting substrate 21 having a anode terminal 21a, a cathode terminal 21b, and an insulating portion 21c therebetween with a precuring insulating adhesive 9 formed on the insulating portion 21c of the mounting substrate 21 and precuring conductive adhesives 8 formed on the anode terminal and cathode terminal, and sealed with exterior resin 10.
摘要翻译：包括固体电解电容器部件的固体电解电容器包括由具有突出的阳极引线1的阀金属构成的多孔阳极体2，阳极氧化膜，固体电解质层4，石墨层5，银膏层6，分离用作阳极部分的阳极引线1和用作阴极部分的多孔阳极体2的抗蚀剂层3和连接到阳极引线1的阳极引线元件7，阳极氧化膜，固体电解质层4，石墨层5依次形成在多孔阳极体2的表面上的银糊层6，其中，固体电解电容器部件接合在具有阳极端子21a，阴极端子21b和绝缘部分21c的安装基板21上具有形成在安装基板21的绝缘部21c上的预固化绝缘粘合剂9，并且预先形成在阳极端子和阴极端子上的导电粘合剂8和密封 d与外部树脂10。

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