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    • 7. 发明申请
    • SOLDERING PROCESS
    • 焊接工艺
    • US20110062215A1
    • 2011-03-17
    • US12952962
    • 2010-11-23
    • Lawrence C. KayErik J. SeverinLuis A. Aguirre
    • Lawrence C. KayErik J. SeverinLuis A. Aguirre
    • C22B9/02B23K3/06
    • C22B9/103B23K35/262B23K35/3006B23K35/3618B23K37/047C22B7/006C22B7/04C22B9/10C22B9/106
    • A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.
    • 熔融焊料原位纯化的过程,使焊接工艺更有效,并产生更好的结果,特别是对于无铅焊接。 由于可靠的焊接温度降低,因此无铅焊料变得实用。 在熔融焊料的表面上保持一层活性添加剂,用于从焊料中清除金属氧化物,并将金属氧化物吸收到液体层中。 活性添加剂是具有亲核和/或亲电基团的有机液体。 作为示例,保持在波峰焊装置上的二聚酸层从金属清洗金属氧化物,并且吸收可能在表面上形成的浮渣。 清除金属氧化物清洗浴缸并降低焊料的粘度,并且焊接在波上的PC板等具有可靠的焊点。