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1. 发明申请

US20150014839A1 Electronic Element Packaging Structure and Carrier Substrate Thereof 审中-公开
标题翻译：电子元件封装结构及载体基板
公开(公告)号：US20150014839A1
公开(公告)日：2015-01-15
申请号：US14326980
申请日：2014-07-09
申请人： Lighten Corporation
发明人： Shu-Mei KU
IPC分类号： H01L23/467 , H01L23/373 , H01L33/64 , H01L23/36
CPC分类号： H01L33/642 , H01L23/3735 , H01L23/427 , H01L33/648 , H01L2224/48091 , H01L2924/00014
摘要： The present invention discloses an electronic element packaging structure and a carrier substrate thereof. The electronic element packaging structure includes a heat conduction substrate, which is a vapor chamber having a vacuum cavity thereinside or a heat pipe; a circuit layer disposed on the heat conduction substrate, insulated from the heat conduction substrate, and exposing the upper surface of the heat conduction substrate; at least one chip directly disposed on the upper surface of the heat conduction substrate; an electric connection structure electrically connecting the chip and the circuit layer; and an encapsulant covering the chip and the electric connection structure.
摘要翻译：本发明公开了一种电子元件封装结构及其载体基板。电子元件封装结构包括导热衬底，其是具有其内部的真空腔的蒸气室或热管; 设置在所述导热基板上的与所述导热基板绝缘的电路层，以及使所述导热基板的上表面露出; 至少一个直接设置在所述导热基板的上表面上的芯片; 电连接结构，电连接芯片和电路层; 以及覆盖芯片和电连接结构的密封剂。

2. 发明申请

US20160056128A1 CHIP PACKAGE MODULE AND PACKAGE SUBSTRATE 审中-公开
标题翻译：芯片封装模块和封装基板
公开(公告)号：US20160056128A1
公开(公告)日：2016-02-25
申请号：US14832478
申请日：2015-08-21
申请人： Lighten Corporation
发明人： Shu-Mei KU
IPC分类号： H01L25/065 , H01L23/367 , H01L23/522 , H01L23/31 , H01L31/02 , H01L33/64 , H01L33/62 , H01L31/0203 , H01L31/024 , H01L23/14 , H01L33/52
CPC分类号： H01L25/0657 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L23/5226 , H01L31/048 , H01L33/52 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/16225 , H01L2225/06541 , H01L2225/06589 , H01L2924/181 , H01L2924/00012
摘要： A chip package module and a package substrate are disclosed herein. The package substrate provides a double-sided wiring structure, wherein a circuit layer is electrically connected with at least one chip, and wherein a heat-conduction wiring layer is extended to the underneath layer so as to increase the heat-conduction area and enhance the heat-dissipation efficiency. The present invention can apply to light emitting diode chips or solar chips to overcome the heat-dissipation problem.
摘要翻译：本文公开了芯片封装模块和封装衬底。封装基板提供双面布线结构，其中电路层与至少一个芯片电连接，并且其中导热布线层延伸到下层，以增加导热面积并增强散热效率。本发明可应用于发光二极管芯片或太阳能芯片以克服散热问题。

3. 发明申请

US20150342058A1 METHOD FOR MANUFACTURING HEAT CONDUCTING SUBSTRATE 审中-公开
标题翻译：制造导热基板的方法
公开(公告)号：US20150342058A1
公开(公告)日：2015-11-26
申请号：US14699598
申请日：2015-04-29
申请人： Lighten Corporation
发明人： Cheng-Tao YANG
IPC分类号： H05K3/00
CPC分类号： H05K3/0061 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10416 , H05K2203/0353
摘要： A method for manufacturing a heat conducting substrate includes providing a metal plate with a first surface and an opposed second surface; forming a plurality of micro bumps on the first surface; disposing an adhesive layer on the first surface among the micro bumps; providing a circuit layer with a plurality of first openings formed thereon, positions of the first openings corresponding to positions of the micro bumps; fixing the circuit layer onto the adhesive layer, wherein the micro bumps are exposed through the first openings respectively; manufacturing circuits on the circuit layer; and finally, thinning a thickness of the metal plate. The method for manufacturing a heat conducting substrate has the manufactured heat conducting substrate to meet the requirements of being thin-shaped and having high heat conducting electronic elements, and has the advantage of an improved yield.
摘要翻译：制造导热基板的方法包括：提供具有第一表面和相对的第二表面的金属板; 在所述第一表面上形成多个微凸块; 在微型凸块之间的第一表面上设置粘合剂层; 提供具有形成在其上的多个第一开口的电路层，所述第一开口的位置对应于所述微型突起的位置; 将电路层固定到粘合剂层上，其中微凸块分别通过第一开口露出; 电路层上制造电路; 最后减薄金属板的厚度。制造导热基板的方法具有制造的导热基板，以满足薄型的要求，并且具有高导热电子元件，并且具有提高的产量的优点。

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