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1. 发明授权

US5469329A Printed circuit board with bi-metallic heat spreader 失效
标题翻译：带双金属散热器的印刷电路板
公开(公告)号：US5469329A
公开(公告)日：1995-11-21
申请号：US287033
申请日：1994-08-08
申请人： Prathap A. Reddy , Jay D. Baker , Larry L. Kneisel
发明人： Prathap A. Reddy , Jay D. Baker , Larry L. Kneisel
IPC分类号： H01L23/36 , H05K7/20
CPC分类号： H05K7/20509 , H01L2924/0002
摘要： A printed wiring board adapted to mount electronic devices including one or more heat spreaders secured to the wiring board, the heat spreaders being formed of a material having high thermal conductivity, each heat spreader being adapted to support an electronic device which is bonded to the heat spreader, the portion of the heat spreader adjacent the electronic device having a metallic layer of low coefficient of thermal expansion that provides a localized area having a coefficient of thermal expansion that is approximately the same as that of the electronic device thereby tending to eliminate thermal stresses in the bond material used to attach the electronic device to the heat spreader, the relatively high thermally conductive material allowing thermal energy to be transferred effectively from the electronic device through the heat spreader to an adjacent heat sink.
摘要翻译：一种适于安装电子装置的印刷电路板，其包括固定到所述布线板的一个或多个散热器，所述散热器由具有高导热性的材料形成，每个散热器适于支撑结合到所述热的电子装置散热器，靠近电子设备的散热器的部分具有低热膨胀系数的金属层，其提供具有与电子设备大致相同的热膨胀系数的局部区域，从而有助于消除热应力在用于将电子设备连接到散热器的粘合材料中，相对高的导热材料允许热能从电子设备通过散热器有效地传递到相邻的散热器。

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