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1. 发明授权

US07371659B1 Substrate laser marking 有权
标题翻译：基板激光打标
公开(公告)号：US07371659B1
公开(公告)日：2008-05-13
申请号：US10020764
申请日：2001-12-12
申请人： Haruhiko Yamamoto , Hideaki Seto , Nobuyoshi Sato , Kyoko Kuroki
发明人： Haruhiko Yamamoto , Hideaki Seto , Nobuyoshi Sato , Kyoko Kuroki
IPC分类号： H01L21/76
CPC分类号： H01L23/544 , B23K26/361 , B41C1/05 , B41M5/24 , H01L2924/0002 , H01L2924/00
摘要： A method for forming a feature in a substrate, where residue within the feature can be easily removed. An upper sidewall portion of the feature is formed, where the upper sidewall portion forms a void in the substrate. The upper sidewall portion has an upper sidewall angle. A lower sidewall portion of the feature is formed, where the lower sidewall portion forms a void in the substrate. The lower sidewall portion has a lower sidewall angle. The upper sidewall angle of the upper sidewall portion is shallower than the lower sidewall angle of the lower sidewall portion. By forming the feature with a shallower sidewall angle at the top of the feature, any debris within the feature is more susceptible to rinsing, etching, or other cleaning procedures, and thus the feature is more easily cleaned than standard features having relatively steeper sidewalls.
摘要翻译：一种用于在衬底中形成特征的方法，其中特征内的残留物可以容易地去除。形成特征的上侧壁部分，其中上侧壁部分在基底中形成空隙。上侧壁部分具有上侧壁角。形成该特征的下侧壁部分，其中下侧壁部分在基底中形成空隙。下侧壁部分具有较低的侧壁角度。上侧壁部分的上侧壁角度比下侧壁部分的下侧壁角度浅。通过在特征顶部形成具有较浅侧壁角的特征，该特征内的任何碎屑更易于冲洗，蚀刻或其它清洁过程，因此该特征比具有较陡侧壁的标准特征更容易清洁。

2. 发明申请

US20080135981A1 Substrate Laser Marking 审中-公开
标题翻译：基板激光打标
公开(公告)号：US20080135981A1
公开(公告)日：2008-06-12
申请号：US12034750
申请日：2008-02-21
申请人： Haruhiko Yamamoto , Hideaki Seto , Nobuyoshi Sato , Kyoko Kuroki
发明人： Haruhiko Yamamoto , Hideaki Seto , Nobuyoshi Sato , Kyoko Kuroki
IPC分类号： H01L29/06
CPC分类号： H01L23/544 , B23K26/361 , B41C1/05 , B41M5/24 , H01L2924/0002 , H01L2924/00
摘要： A method for forming a feature in a substrate, where residue within the feature can be easily removed. An upper sidewall portion of the feature is formed, where the upper sidewall portion forms a void in the substrate. The upper sidewall portion has an upper sidewall angle. A lower sidewall portion of the feature is formed, where the lower sidewall portion forms a void in the substrate. The lower sidewall portion has a lower sidewall angle. The upper sidewall angle of the upper sidewall portion is shallower than the lower sidewall angle of the lower sidewall portion. By forming the feature with a shallower sidewall angle at the top of the feature, any debris within the feature is more susceptible to rinsing, etching, or other cleaning procedures, and thus the feature is more easily cleaned than standard features having relatively steeper sidewalls.
摘要翻译：一种用于在衬底中形成特征的方法，其中特征内的残留物可以容易地去除。形成特征的上侧壁部分，其中上侧壁部分在基底中形成空隙。上侧壁部分具有上侧壁角。形成该特征的下侧壁部分，其中下侧壁部分在基底中形成空隙。下侧壁部分具有较低的侧壁角度。上侧壁部分的上侧壁角度比下侧壁部分的下侧壁角度浅。通过在特征顶部形成具有较浅侧壁角的特征，该特征内的任何碎屑更易于冲洗，蚀刻或其它清洁过程，因此该特征比具有较陡侧壁的标准特征更容易清洁。

3. 发明授权

US07201176B2 Wafer chucking apparatus for spin processor 有权
标题翻译：用于旋转处理器的晶片夹紧装置
公开(公告)号：US07201176B2
公开(公告)日：2007-04-10
申请号：US11403137
申请日：2006-04-11
申请人： Kyoko Kuroki , Hideaki Seto
发明人： Kyoko Kuroki , Hideaki Seto
IPC分类号： B08B3/00
CPC分类号： H01L21/68728
摘要： A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
摘要翻译：晶片卡盘被配置为有效地保持晶片以进行晶片边缘和背面的旋转处理清洁。第一组可缩回尖端延伸以在清洁周期的第一部分期间保持晶片。第二组可伸缩尖端延伸以在清洁周期的第二部分期间保持晶片。在第二部分期间，在清洁周期的第一部分期间，在尖端和晶片边缘区域之间留下的残留物被去除。当晶片旋转时，从第一组尖端到第二组尖端的变化发生。

4. 发明申请

US20060180176A1 Wafer chucking apparatus for spin processor 有权
标题翻译：用于旋转处理器的晶片夹紧装置
公开(公告)号：US20060180176A1
公开(公告)日：2006-08-17
申请号：US11403137
申请日：2006-04-11
申请人： Kyoko Kuroki , Hideadki Seto
发明人： Kyoko Kuroki , Hideadki Seto
IPC分类号： C23G1/00 , B08B7/00 , B08B3/00
CPC分类号： H01L21/68728
摘要： A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
摘要翻译：晶片卡盘被配置为有效地保持晶片以进行晶片边缘和背面的旋转处理清洁。第一组可缩回尖端延伸以在清洁周期的第一部分期间保持晶片。在清洁周期的第二部分期间，第二组可伸缩尖端延伸以保持晶片。在第二部分期间，在清洁周期的第一部分期间，在尖端和晶片边缘区域之间留下的残留物被去除。当晶片旋转时，从第一组尖端到第二组尖端的变化发生。

5. 发明授权

US07056392B1 Wafer chucking apparatus and method for spin processor 有权
标题翻译：用于旋转处理器的晶片夹紧装置和方法
公开(公告)号：US07056392B1
公开(公告)日：2006-06-06
申请号：US10417708
申请日：2003-04-16
申请人： Kyoko Kuroki , Hideaki Seto
发明人： Kyoko Kuroki , Hideaki Seto
IPC分类号： B08B7/00
CPC分类号： H01L21/68728
摘要： A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
摘要翻译：晶片卡盘被配置为有效地保持晶片以进行晶片边缘和背面的旋转处理清洁。第一组可缩回尖端延伸以在清洁周期的第一部分期间保持晶片。第二组可伸缩尖端延伸以在清洁周期的第二部分期间保持晶片。在第二部分期间，在清洁周期的第一部分期间，在尖端和晶片边缘区域之间留下的残留物被去除。当晶片旋转时，从第一组尖端到第二组尖端的变化发生。

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