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1. 发明授权

US07540672B2 Digital still camera module 有权
标题翻译：数码相机模组
公开(公告)号：US07540672B2
公开(公告)日：2009-06-02
申请号：US11262592
申请日：2005-10-31
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
IPC分类号： G03B17/00
CPC分类号： H04N5/2254 , G02B7/025 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H04N5/2253 , H01L2924/00014
摘要： A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.
摘要翻译：数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装（2）和透镜镜筒（30）。图像传感器封装包括基板（20），图像传感器芯片（22）和盖子（28）。衬底在其中限定接收室（203）。图像传感器芯片安装在基板的接收室中。透明并且具有比基板更小的轮廓的盖被固定到基板的顶部，从而密封接收室。衬底的顶部在盖的周边具有未覆盖部分（29）。镜筒包括容纳在其中的至少一个透镜（31）。透镜筒牢固地附接到基板的顶部的未覆盖部分。

2. 发明申请

US20070057149A1 Image sensor chip package fabrication method 有权
标题翻译：图像传感器芯片封装制造方法
公开(公告)号：US20070057149A1
公开(公告)日：2007-03-15
申请号：US11453456
申请日：2006-06-14
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
IPC分类号： H01L27/00
CPC分类号： H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
摘要： An image sensor package method includes the steps of first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.
摘要翻译：图像传感器封装方法包括以下步骤：首先提供一种包括基座（24）和引线框架（320）的载体（30）。基座在其中具有空腔，引线框架包括多个导电件; 第二，将图像传感器芯片安装在基座上并被接纳在空腔中，图像传感器具有感光区域。第三，提供多条导线，每个电线将图像传感器芯片和载体的相应的一个导电片电连接。第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合剂装置。最后，将透明盖子安装在托架上，粘合剂将盖子固定在适当位置。

3. 发明申请

US20060097372A1 IC chip package with isolated vias 有权
标题翻译： IC芯片封装带隔离通孔
公开(公告)号：US20060097372A1
公开(公告)日：2006-05-11
申请号：US11262876
申请日：2005-10-31
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
IPC分类号： H01L23/02
CPC分类号： H01L23/49827 , H01L23/055 , H01L23/10 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2224/85399 , H01L2224/05599
摘要： An IC chip package includes a substrate (2), a chip (5), a plurality of bonding wires (52), and a cover (6). The substrate has a top surface, a receiving chamber (23) having an opening at the top surface, a plurality of solder pads (3) arranged around the top surface and respectively corresponding to the solder pads arranged at a bottom surface opposite to the top surface, and a plurality of vias (4) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads (51) arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate, and covers the opening.
摘要翻译： IC芯片封装包括基板（2），芯片（5），多个接合线（52）和盖（6）。衬底具有顶表面，在顶表面具有开口的接收室（23），围绕顶表面布置的多个焊盘（3），并且分别对应于布置在与顶部相对的底表面处的焊盘表面以及具有导电材料的多个通孔（4），其将顶部焊盘与其中限定的底部焊盘电连接。芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘（51）。接合线分别将衬底的顶部焊盘与芯片焊盘电连接。盖被固定到基板的顶表面，并且覆盖开口。

4. 发明授权

US07646429B2 Digital camera module packaging method 有权
标题翻译：数码相机模块包装方式
公开(公告)号：US07646429B2
公开(公告)日：2010-01-12
申请号：US11595297
申请日：2006-11-10
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254
摘要： A digital camera module packaging method includes: first, providing a carrier (20) including a base (21) defining a chamber (214) and a lead frame (23). The lead frame has a plurality of conduction pieces (233) embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip (30) with a photosensitive area (301) and a plurality of chip pads (302) is then mounted in the chamber. A plurality of wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder (50) is then provided. The carrier is mounted to the holder. Finally, a lens module (70) is mounted on the holder.
摘要翻译：一种数字照相机模块封装方法，包括：首先，提供一个载体（20），其包括限定腔室（214）和引线框架（23）的底座（21）。引线框具有嵌入基座中的多个导电片（233）。每个导电件的一端在基座的一个表面露出，并且导电件的另一端暴露在基座的另一个表面。然后将具有感光区域（301）和多个芯片焊盘（302）的图像传感器芯片（30）安装在室中。然后提供多根电线（40）。每条导线将图像传感器芯片的相应芯片焊盘和载体的相应导电片的一个暴露端部电连接。然后提供支架（50）。承载件安装在支架上。最后，镜头模块（70）安装在支架上。

5. 发明授权

US07365421B2 IC chip package with isolated vias 有权
标题翻译： IC芯片封装带隔离通孔
公开(公告)号：US07365421B2
公开(公告)日：2008-04-29
申请号：US11262876
申请日：2005-10-31
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
IPC分类号： H01L23/12 , H01L23/48 , H01L23/52
CPC分类号： H01L23/49827 , H01L23/055 , H01L23/10 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2224/85399 , H01L2224/05599
摘要： An IC chip package includes a substrate (2), a chip (5), a plurality of bonding wires (52), and a cover (6). The substrate has a top surface, a receiving chamber (23) having an opening at the top surface, a plurality of solder pads (3) arranged around the top surface and respectively corresponding to the solder pads arranged at a bottom surface opposite to the top surface, and a plurality of vias (4) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads (51) arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate, and covers the opening.
摘要翻译： IC芯片封装包括基板（2），芯片（5），多个接合线（52）和盖（6）。衬底具有顶表面，在顶表面具有开口的接收室（23），围绕顶表面布置的多个焊盘（3），并且分别对应于布置在与顶部相对的底表面处的焊盘表面以及具有导电材料的多个通孔（4），其将顶部焊盘与其中限定的底部焊盘电连接。芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘（51）。接合线分别将衬底的顶部焊盘与芯片焊盘电连接。盖被固定到基板的顶表面，并且覆盖开口。

6. 发明申请

US20070057148A1 Digital camera module package fabrication method 有权
标题翻译：数码相机模块封装制造方法
公开(公告)号：US20070057148A1
公开(公告)日：2007-03-15
申请号：US11453454
申请日：2006-06-14
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
IPC分类号： H01J5/02 , H01L27/00
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14683 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2924/16195 , H01L2924/00014
摘要： A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
摘要翻译：数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

7. 发明申请

US20060290802A1 Digital camera module with small sized image sensor chip package 有权
标题翻译：数码相机模块具有小尺寸图像传感器芯片封装
公开(公告)号：US20060290802A1
公开(公告)日：2006-12-28
申请号：US11402467
申请日：2006-04-12
申请人： Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254
摘要： A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.
摘要翻译：数码相机模块（200）包括透镜保持器（20），容纳在透镜保持器中的透镜模块（30）和安装到透镜保持器的图像传感器芯片封装（40）。透镜模块包括可移动地接合在透镜保持器中的透镜镜筒（301）和容纳在镜筒中的至少一个透镜（302）。图像传感器芯片封装包括基座（401），安装在基座上的图像传感器芯片（402），透明盖（405）和相对于图像传感器芯片定位透明盖的粘合剂（50）。粘合剂和透明盖协同地将图像传感器芯片密封在其中。

8. 发明申请

US20060093352A1 Digital still camera module 有权
标题翻译：数码相机模组
公开(公告)号：US20060093352A1
公开(公告)日：2006-05-04
申请号：US11262592
申请日：2005-10-31
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
IPC分类号： G03B17/00
CPC分类号： H04N5/2254 , G02B7/025 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H04N5/2253 , H01L2924/00014
摘要： A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.
摘要翻译：数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装（2）和透镜镜筒（30）。图像传感器封装包括基板（20），图像传感器芯片（22）和盖子（28）。衬底在其中限定接收室（203）。图像传感器芯片安装在基板的接收室中。透明并且具有比基板更小的轮廓的盖被固定到基板的顶部，从而密封接收室。衬底的顶部在盖的周边具有未覆盖部分（29）。镜筒包括容纳在其中的至少一个透镜（31）。透镜筒牢固地附接到基板的顶部的未覆盖部分。

9. 发明授权

US07342215B2 Digital camera module package fabrication method 有权
标题翻译：数码相机模块封装制造方法
公开(公告)号：US07342215B2
公开(公告)日：2008-03-11
申请号：US11453454
申请日：2006-06-14
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
IPC分类号： H01L27/00 , H01J5/02
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14683 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2924/16195 , H01L2924/00014
摘要： A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
摘要翻译：数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

10. 发明申请

US20070126915A1 Digital camera module packaging method 有权
标题翻译：数码相机模块包装方式
公开(公告)号：US20070126915A1
公开(公告)日：2007-06-07
申请号：US11595297
申请日：2006-11-10
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254
摘要： An image sensor chip package method includes the following steps: firstly, a plurality of shaped conductors are provided. Secondly, plastics are injected to partially enclose the conductors, thereby forming a base. Some of the conductors are exposed outside of the base. Thirdly, a ring-like middle portion is further formed on the base by means of injection. The base and the middle portion cooperatively form a space. Fourthly, an image sensor having a plurality of pads is disposed in the space. Fifthly, a number of bonding wires are provided to connect the pads and the conductors. Finally, a cover is secured to the top of the middle portion via an adhesive glue, thereby hermetically sealing the space and allowing light beams to pass therethrough.
摘要翻译：图像传感器芯片封装方法包括以下步骤：首先，多个形导体。其次，注射塑料以部分地包封导体，从而形成基底。一些导体暴露在基部外部。第三，通过注射在基座上进一步形成环状中间部分。底座和中间部分协同地形成一个空间。第四，具有多个焊盘的图像传感器设置在该空间中。第五，提供多个接合线来连接焊盘和导体。最后，通过胶粘剂将盖固定到中间部分的顶部，从而气密地密封空间并允许光束通过。

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