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1. 发明授权

US06839221B2 Multilayer ceramic capacitor and process for preparing the same 有权
标题翻译：多层陶瓷电容器及其制备方法
公开(公告)号：US06839221B2
公开(公告)日：2005-01-04
申请号：US10786526
申请日：2004-02-25
申请人： Koshiro Sugimoto , Osamu Toyama , Koji Ishimine , Yuichi Komoto , Manabu Maeda
发明人： Koshiro Sugimoto , Osamu Toyama , Koji Ishimine , Yuichi Komoto , Manabu Maeda
IPC分类号： H01G4/12 , H01G4/30 , H01G4/06 , H01G4/20
CPC分类号： H01G4/30 , H01G4/12
摘要： The mean grain size (D2) of the main crystal phase 11 in the external cover dielectric layers 3 is made larger than the mean grain size (D1) of the main crystal phase 11 in the dielectric ceramic layers 7, and the amount of the secondary phase (M2) in the external cover dielectric layer 3 is made more than the amount of the secondary phase (M1) in the dielectric ceramic layer 7, or the volume proportion of the secondary phase 16 to the main crystal phase 11 in the external cover dielectric layer 3 is made lower than the volume proportion of the secondary phase 16 to the main crystal phase 11 in the dielectric ceramic layer 7. This constitution produces the multilayer ceramic capacitor having a large number of thin layers stacked one on another that is capable of suppressing the occurrence of delamination between the external cover dielectric layers and the effective dielectric material section and between the effective dielectric material sections due to the difference in shrinkage by firing even when particle size of the dielectric material powder is made smaller.
摘要翻译：外层电介质层3中的主晶相11的平均粒径（D2）大于电介质陶瓷层7中的主晶相11的平均粒径（D1），二次使外部电介质层3的相位（M2）大于介电陶瓷层7中的次级相（M1）的量，或二次相16与主晶相11在外盖中的体积比例使电介质层3比电介质陶瓷层7中的第二相16的主晶相11的体积比例低。这种结构产生了具有大量层叠的薄层的多层陶瓷电容器，抑制由于收缩差异而导致的外部电介质层与有效电介质材料部分之间以及有效电介质材料部分之间的分层的发生即使使电介质材料粉末的粒径更小，也可以进行烧成。

2. 发明授权

US07224570B2 Process for preparing multilayer ceramic capacitor and the multilayer ceramic capacitor 有权
标题翻译：制备多层陶瓷电容器和多层陶瓷电容器的工艺
公开(公告)号：US07224570B2
公开(公告)日：2007-05-29
申请号：US11168256
申请日：2005-06-27
申请人： Katsuyoshi Yamaguchi , Koshiro Sugimoto
发明人： Katsuyoshi Yamaguchi , Koshiro Sugimoto
IPC分类号： H01G4/008
CPC分类号： H01G4/30 , H01G4/0085 , Y10T29/435
摘要： A process for preparing a multilayer ceramic capacitor of the present invention comprises the steps of forming a pattern sheet, laminating a plurality of the pattern sheets and firing to obtain a multilayer ceramic capacitor comprising dielectric layers and internal electrode layers that are alternately laminated. The pattern sheet comprises a dielectric material green sheet and a conductor pattern. The conductor pattern is formed on the dielectric material green sheet and contains a main component selected from Ni, Cu and their alloy, at least one selected from the elements of the groups 3B to 6B of the periodic table and at least one selected from Mn, Co and Fe. The multilayer ceramic capacitor so obtained has an internal electrode layer wherein occurrence of discontinuous portions in conductor patterns is suppressed even after firing.
摘要翻译：制备本发明的多层陶瓷电容器的方法包括以下步骤：形成图案片，层叠多个图案片材并进行烧制以获得包括交替层压的电介质层和内部电极层的多层陶瓷电容器。图案片包括电介质材料生片和导体图案。导体图案形成在电介质材料生片上，并含有选自Ni，Cu及其合金中的主要成分，选自周期表第3B〜6B族元素中的至少一种以及选自Mn， Co和Fe。如此获得的层叠陶瓷电容器具有内部电极层，其中甚至在烧制之后也抑制导体图案中不连续部分的发生。

3. 发明申请

US20050286204A1 Process for preparing multilayer ceramic capacitor and the multilayer ceramic capacitor 有权
标题翻译：制备多层陶瓷电容器和多层陶瓷电容器的工艺
公开(公告)号：US20050286204A1
公开(公告)日：2005-12-29
申请号：US11168256
申请日：2005-06-27
申请人： Katsuyoshi Yamaguchi , Koshiro Sugimoto
发明人： Katsuyoshi Yamaguchi , Koshiro Sugimoto
IPC分类号： H01G4/008 , H01G4/30 , H01G4/32
CPC分类号： H01G4/30 , H01G4/0085 , Y10T29/435
摘要： A process for preparing a multilayer ceramic capacitor of the present invention comprises the steps of forming a pattern sheet, laminating a plurality of the pattern sheets and firing to obtain a multilayer ceramic capacitor comprising dielectric layers and internal electrode layers that are alternately laminated. The pattern sheet comprises a dielectric material green sheet and a conductor pattern. The conductor pattern is formed on the dielectric material green sheet and contains a main component selected from Ni, Cu and their alloy, at least one selected from the elements of the groups 3B to 6B of the periodic table and at least one selected from Mn, Co and Fe. The multilayer ceramic capacitor so obtained has an internal electrode layer wherein occurrence of discontinuous portions in conductor patterns is suppressed even after firing.
摘要翻译：制备本发明的多层陶瓷电容器的方法包括以下步骤：形成图案片，层叠多个图案片材并进行烧制以获得包括交替层压的电介质层和内部电极层的多层陶瓷电容器。图案片包括电介质材料生片和导体图案。导体图案形成在电介质材料生片上，并含有选自Ni，Cu及其合金中的主要成分，选自元素周期表第3B-6B族元素中的至少一种和选自 Mn，Co和Fe。如此获得的层叠陶瓷电容器具有内部电极层，其中甚至在烧制之后也抑制导体图案中不连续部分的发生。

4. 发明授权

US07957119B2 Metal films, methods for production thereof, methods for production of laminated electronic components, and laminated electronic components 有权
标题翻译：金属膜，其制造方法，层压电子部件的制造方法以及层叠电子部件
公开(公告)号：US07957119B2
公开(公告)日：2011-06-07
申请号：US12065482
申请日：2006-08-21
申请人： Katsuyoshi Yamaguchi , Koshiro Sugimoto
发明人： Katsuyoshi Yamaguchi , Koshiro Sugimoto
IPC分类号： H01G4/008
CPC分类号： C22C19/03 , C22C13/00 , C25D3/562 , C25D5/48 , C25D5/50 , C25D7/00 , H01G4/008 , H01G4/0085 , H01G4/30 , Y10T428/24917
摘要： A metal film containing Ni as a main component and Mn and at least one element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table includes a central part and a peripheral part in which Mn and the element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table are present in a concentration higher in the peripheral part than that in the central part. The metal film used as a conductor layer can have an increased melting point at the peripheral part and thus can be prevented from shrinking during heating. The metal film used as a conductor layer in electronic components and the like can be prevented from plastically deforming or shrinking during heating so that the conductor layer can have a large effective area and high adhesion to ceramic layers.
摘要翻译：含有Ni作为主要成分的金属膜和Mn和选自元素周期表第3b，4b，5b和6b族元素中的至少一种元素包括中心部分和周边部分，其中Mn和选自元素周期表第3b，4b，5b和6b族元素组成的元素在周边部分的浓度高于中央部分的浓度。用作导体层的金属膜可以在周边部分具有增加的熔点，因此可以防止在加热期间收缩。可以防止在电子部件等中用作导体层的金属膜在加热期间发生塑性变形或收缩，使得导体层可以具有大的有效面积和对陶瓷层的高粘附性。

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