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    • 2. 发明授权
    • Heating device containing a multi-lamp cone for heating semiconductor wafers
    • 包含用于加热半导体晶片的多灯锥体的加热装置
    • US06210484B1
    • 2001-04-03
    • US09150280
    • 1998-09-09
    • Kevin Hathaway
    • Kevin Hathaway
    • C23C1600
    • H01L21/67115
    • An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the present invention is directed to a heating device that contains at least one heating cone. The heating cone of the present invention includes a circular reflector that can be conically-shaped. A plurality of light energy sources are contained within the reflector. The light energy sources can be vertically oriented or can be tilted slightly towards the central axis of the heating cone. In this arrangement, it has been discovered that the heating cone produces a uniform irradiance distribution over a wafer being heated.
    • 公开了一种用于热处理半导体晶片的设备。 该装置包括加热装置,其包含用于将光能发射到晶片上的光能源组件。 特别地,本发明涉及一种包含至少一个加热锥体的加热装置。 本发明的加热锥体包括圆锥形的圆形反射器。 多个光能源包含在反射器内。 光能源可以垂直取向,或者可以朝向加热锥体的中心轴线稍微倾斜。 在这种布置中,已经发现加热锥体在被加热的晶片上产生均匀的辐照度分布。