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1. 发明授权

US5531556A Rearrangement apparatus for manufacturing system 失效
标题翻译：制造系统重排装置
公开(公告)号：US5531556A
公开(公告)日：1996-07-02
申请号：US280451
申请日：1994-07-26
申请人： Kenji Kiyokawa
发明人： Kenji Kiyokawa
IPC分类号： B25J15/00 , B23P21/00 , B25J15/08 , H05K13/04 , B65H9/08
CPC分类号： H05K13/0404 , B23P21/00
摘要： A plurality of main and sub-chucks are used in a manner wherein the main chucks are used to pick up objects from a first tray, to move the objects to a second tray, and to place them in the second tray in exactly the desired positions. A floating mechanism allows the main chucks to slide from side to side while the sub-chucks are released. The sub-chucks are arranged to grasp a fixed centering structure and to center the main chucks in exactly the required positions for the precision placement of the objects. During the operations wherein the objects are picked up from the first tray, the sub-chucks are released so that during the pickup operation, the main chucks may center on the objects which are being picked up. After the objects are grasped, the sub-chucks are closed to re-center the main chucks in exactly the positions required for accurate placement.
摘要翻译：使用多个主和副卡盘，其中主卡盘用于从第一托盘拾取物体，将物体移动到第二托盘，并将它们放置在第二托盘中的正好所需位置。浮动机构允许主夹头在副卡盘被释放时从一侧滑动到另一侧滑动。副卡盘被布置成抓住固定的定心结构并使主卡盘位于精确放置物体的所需位置的正好位置。在从第一托盘拾起物体的操作期间，副卡盘被释放，使得在拾取操作期间，主卡盘可以在被拾起的物体上居中。在抓住物体之后，子卡盘被关闭以将主卡盘重新定位在精确放置所需的位置。

2. 发明申请

US20060219277A1 Substrate-treating apparatus 审中-公开
标题翻译：底物处理装置
公开(公告)号：US20060219277A1
公开(公告)日：2006-10-05
申请号：US10564728
申请日：2004-07-16
申请人： Kenichiro Nakamura , Tsuyoshi Hirayama , Minoru Momodomi , Kenji Kiyokawa
发明人： Kenichiro Nakamura , Tsuyoshi Hirayama , Minoru Momodomi , Kenji Kiyokawa
IPC分类号： B08B3/00
CPC分类号： B08B1/04
摘要： To provide a substrate treating apparatus for keeping a substrate in contact with a treating tool under a prescribed pressure. According to this invention, a bracket 10 which is hoisted or lowered by a hoisting/lowering device 15 is provided with a treating tool 3 for carrying out the treatment such as cleaning for the surface of a substrate in contact with the surface under a prescribed pressure therefor, an operating shaft 4 with the treating tool 3 attached thereto, a holding member 6 for holding the operating shaft 4 freely only in its rotating direction, a servomotor 11 coupled to the holding member 6, for moving up and down the operating shaft 4, and a rotary motor 8 coupled with the operating shaft 4 through a pin joint 9. Separately from the hoisting/lowering device 15 for the bracket 10, the servo motor 11 for moving up and down the operating shaft 4 is provided. The servo motor is excited according to the difference between the weight of the operating shaft 4 inclusive of the treating tool 3 and a prescribed contact pressure or weight so that an output torque is applied to the operating shaft 4 to cancel the weight of the operating shaft 4, thereby keeping the treating tool 3 in contact with the substrate surface with the weight corresponding to the prescribed contact pressure.
摘要翻译：提供一种用于在规定压力下保持基板与处理工具接触的基板处理装置。根据本发明，由升降装置15提升或降下的支架10设置有处理工具3，用于在规定压力下进行与表面接触的基板表面的清洁处理具有安装有处理工具3的操作轴4，用于仅沿其旋转方向自由地保持操作轴4的保持构件6，联接到保持构件6的用于使操作轴4上下移动的伺服电动机11 以及通过销接头9与操作轴4连接的旋转电动机8.与用于支架10的升降装置15分开设置用于使操作轴4上下移动的伺服电动机11。伺服电动机根据操作轴4的包括处理工具3的重量与规定的接触压力或重量之间的差异来激励，使得输出扭矩施加到操作轴4以消除操作轴的重量 4，从而使处理工具3与基板表面接触，其重量对应于规定的接触压力。

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