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1. 发明申请

US20070197755A1 Silicon-containing curing composition and heat cured product thereof 有权
标题翻译：含硅固化组合物及其热固化产物
公开(公告)号：US20070197755A1
公开(公告)日：2007-08-23
申请号：US10594221
申请日：2005-05-10
申请人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Yoshitaka Sugawara
发明人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Yoshitaka Sugawara
IPC分类号： C08L83/04 , C08G77/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/00
摘要： A curable composition which comprises at least one of the following (A), (B), and (C) and further contains the following (D) (provided that when (C) is not contained, both (A) and (B) are contained). (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′ and one or more Si—O—Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si—H group and one or more Si—O—Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′, an Si—H group, and one or more Si—O—Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst. The reactive group A′ is any of Si—R1, Si—O—R2, and Si—R3—OCOC(R4)═CH2, provided that R1 and R2 each is alkenyl, R3 is alkylene and/or arylene, and R4 is hydrogen or methyl.
摘要翻译：包含以下（A），（B）和（C）中的至少一个的可固化组合物，并且还包含以下（D）（前提是不含（C）时，（A）和（B）被包含）。（A）：重均分子量为1000以下的成分的含量为20重量％的含硅聚合物。％以下，具有反应性基团A'和一个或多个Si-O-Si键。（B）：重均分子量为1000以下的成分的含量为20重量％的含硅聚合物。％以下，并且具有Si-H基和一个或多个Si-O-Si键。（C）：重均分子量为1000以下的成分的含量为20重量％的含硅聚合物。％以下，具有反应性基团A'，Si-H基和一个或多个Si-O-Si键。（D）：铂催化剂用于固化反应的催化剂。反应性基团A'是Si-R 1，Si-OR 2和Si-R 3 -OCOC（R SUP）中的任何一种 > 4 ） - CH 2，条件是R 1和R 2各自为烯基，R 3， SUP>是亚烷基和/或亚芳基，R 4是氢或甲基。

2. 发明授权

US08937122B2 Compound having hindered amine backbone, and resin composition 有权
标题翻译：具有受阻胺主链的化合物和树脂组合物
公开(公告)号：US08937122B2
公开(公告)日：2015-01-20
申请号：US13518170
申请日：2011-11-15
申请人： Ken-ichiro Hiwatari , Tomoaki Saiki
发明人： Ken-ichiro Hiwatari , Tomoaki Saiki
IPC分类号： C08K5/34 , C08G77/388 , C08G77/12 , C09J183/14 , C08G77/50 , C08G77/00
CPC分类号： C08G77/388 , C08G77/12 , C08G77/50 , C08G77/80 , C08L83/00 , C09J183/14 , H01L2924/0002 , H01L2924/00
摘要： A compound has excellent thermal resistance and compatibility with resins, improves thermal resistance of resins, and specifically provides a compound represented by the following general formula (1). In formula (1), R1 to R4 each represent a C1-12 alkyl group or a C6-12 aryl group, y represents a number 1-2,000, and X1 represents a group represented by the formula (2) or (3). In formula (2), R5 represents a hydrogen atom, O., a C1-12 alkyl group or a C1-12 alkoxy group, L1 represents a C1-6 alkylene group or a C6-12 arylene group. In formula (3), R6 represents a C1-4 alkyl group or a C6-12 aryl group, X2 represents a group represented by the formula (2) or a hydrogen atom, s represents a number 2-6, L2 represents a C1-6 alkylene group or a C6-12 arylene group, and at least one of s number of X2s is the group represented by the formula (2).
摘要翻译：化合物具有优异的耐热性和与树脂的相容性，提高树脂的耐热性，并具体提供由以下通式（1）表示的化合物。式（1）中，R 1〜R 4各自表示碳原子数1〜12的烷基或碳原子数为6〜12的芳基，y表示数为1-2,000，X 1表示由式（2）或（3）表示的基团。在式（2）中，R 5表示氢原子，O.，C 1-12烷基或C 1-12烷氧基，L 1表示C 1-6亚烷基或C 6-12亚芳基。在式（3）中，R 6表示C 1-4烷基或C 6-12芳基，X 2表示式（2）表示的基团或氢原子，s表示2-6，L2表示C1 -6亚烷基或C 6-12亚芳基，并且X数中的至少一个为式（2）所示的基团。

3. 发明授权

US08735177B2 Diagnostic marker 有权
标题翻译：诊断标记
公开(公告)号：US08735177B2
公开(公告)日：2014-05-27
申请号：US11918465
申请日：2007-02-20
申请人： Shinji Sakuma , Shinji Yamashita , Ken-Ichiro Hiwatari , Yoshikazu Shoji
发明人： Shinji Sakuma , Shinji Yamashita , Ken-Ichiro Hiwatari , Yoshikazu Shoji
IPC分类号： G01N33/547 , G01N33/544
CPC分类号： A61K49/0039 , A61K49/0002 , A61K49/0043 , A61K49/0052 , A61K49/0056 , A61K49/0093
摘要： A diagnostic marker is composed of particles that have a diameter of from 1 nm to 100 μm, the particles possessing on their surfaces a site that has a high specific bonding ability to a specific antigen residing on the mucosa of digestive cancers and a site that has a low bonding ability to the mucosa of digestive organs, and further incorporating an identification material.
摘要翻译：诊断标记由直径为1nm至100μm的颗粒组成，颗粒在其表面上具有与存在于消化性癌症粘膜上的特异性抗原具有高特异性结合能力的位点，以及具有对消化器官粘膜的粘合能力低，并进一步掺入鉴定材料。

4. 发明授权

US08470937B2 Curable composition for semiconductor encapsulation 失效
标题翻译：用于半导体封装的可固化组合物
公开(公告)号：US08470937B2
公开(公告)日：2013-06-25
申请号：US13382571
申请日：2011-05-26
申请人： Ken-ichiro Hiwatari , Isamu Yumoto
发明人： Ken-ichiro Hiwatari , Isamu Yumoto
IPC分类号： C08L83/14
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/80 , C08L83/14 , H01L2924/0002 , H01L2924/12044 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.
摘要翻译：提供一种半导体封装用固化性组合物，其具有耐热性优异，耐高温电绝缘性，柔软性，耐热循环性优异的固化物，以及通过使该固化性组合物固化而封装的半导体装置。具体地说，提供一种半导体封装用固化性组合物，其含有作为（A）成分的特定含SiH基的硅氧烷化合物; 作为组分（B），特定的含乙烯基的硅氧烷化合物; 作为组分（C），具有至少三个SiH基或至少三个乙烯基的化合物; 和作为组分（D）的氢化硅烷化催化剂。

5. 发明申请

US20130018132A1 COMPOUND HAVING HINDERED AMINE BACKBONE, AND RESIN COMPOSITION 有权
标题翻译：具有铰链氨基反应物的化合物和树脂组合物
公开(公告)号：US20130018132A1
公开(公告)日：2013-01-17
申请号：US13518170
申请日：2011-11-15
申请人： Ken-ichiro Hiwatari , Tomoaki Saiki
发明人： Ken-ichiro Hiwatari , Tomoaki Saiki
IPC分类号： C08K5/544 , C09J183/04 , C08L83/04 , C07F7/02 , C08K3/22
CPC分类号： C08G77/388 , C08G77/12 , C08G77/50 , C08G77/80 , C08L83/00 , C09J183/14 , H01L2924/0002 , H01L2924/00
摘要： A compound has excellent thermal resistance and compatibility with resins, improves thermal resistance of resins, and specifically provides a compound represented by the following general formula (1). In formula (1), R1 to R4 each represent a C1-12 alkyl group or a C6-12 aryl group, y represents a number 1-2,000, and X1 represents a group represented by the formula (2) or (3). In formula (2), R5 represents a hydrogen atom, O., a C1-12 alkyl group or a C1-12 alkoxy group, L1 represents a C1-6 alkylene group or a C6-12 arylene group. In formula (3), R6 represents a C1-4 alkyl group or a C6-12 aryl group, X2 represents a group represented by the formula (2) or a hydrogen atom, s represents a number 2-6, L2 represents a C1-6 alkylene group or a C6-12 arylene group, and at least one of s number of X2s is the group represented by the formula (2).
摘要翻译：化合物具有优异的耐热性和与树脂的相容性，提高树脂的耐热性，并具体提供由以下通式（1）表示的化合物。式（1）中，R 1〜R 4各自表示碳原子数1〜12的烷基或碳原子数为6〜12的芳基，y表示数为1-2,000，X 1表示由式（2）或（3）表示的基团。在式（2）中，R 5表示氢原子，O.，C 1-12烷基或C 1-12烷氧基，L 1表示C 1-6亚烷基或C 6-12亚芳基。在式（3）中，R 6表示C 1-4烷基或C 6-12芳基，X 2表示式（2）表示的基团或氢原子，s表示2-6，L2表示C1 -6亚烷基或C 6-12亚芳基，并且X数中的至少一个为式（2）所示的基团。

6. 发明申请

US20120126435A1 CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION 失效
标题翻译：用于半导体封装的可固化组合物
公开(公告)号：US20120126435A1
公开(公告)日：2012-05-24
申请号：US13382571
申请日：2011-05-26
申请人： Ken-ichiro Hiwatari , Isamu Yumoto
发明人： Ken-ichiro Hiwatari , Isamu Yumoto
IPC分类号： H01L23/29 , C08G77/20
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/80 , C08L83/14 , H01L2924/0002 , H01L2924/12044 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.
摘要翻译：提供一种半导体封装用固化性组合物，其具有耐热性优异，耐高温电绝缘性，柔软性，耐热循环性优异的固化物，以及通过使该固化性组合物固化而封装的半导体装置。具体地说，提供一种半导体封装用固化性组合物，其含有作为（A）成分的特定含SiH基的硅氧烷化合物; 作为组分（B），特定的含乙烯基的硅氧烷化合物; 作为组分（C），具有至少三个SiH基或至少三个乙烯基的化合物; 和作为组分（D）的氢化硅烷化催化剂。

7. 发明申请

US20200324024A1 DECELLULARIZED TISSUE 审中-公开
公开(公告)号：US20200324024A1
公开(公告)日：2020-10-15
申请号：US16906111
申请日：2020-06-19
申请人： Jun NEGISHI , Ken-ichiro HIWATARI , Kyohei OCHIAI
发明人： Jun NEGISHI , Ken-ichiro HIWATARI , Kyohei OCHIAI
IPC分类号： A61L27/36 , A61K35/12
摘要： The present invention addresses the problem of providing a decellularized tissue having excellent cell adhesion properties. Provided is a decellularized tissue prepared by decellularizing a biological tissue, said decellularized tissue being characterized in that the ratio of endothermic energy amount, in terms of dry mass, of the decellularized tissue to the biological tissue before the decellularization is 0.70 or greater when measured by differential scanning calorimetry. The ratio by mass of DNA amount, in terms of dry mass, of the decellularized tissue to the biological tissue before the decellularization may be 0.300 or smaller.

8. 发明授权

US08003736B2 Silicon-containing compound, curable composition and cured product 失效
标题翻译：含硅化合物，固化性组合物和固化物
公开(公告)号：US08003736B2
公开(公告)日：2011-08-23
申请号：US12596933
申请日：2008-04-21
申请人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
发明人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
IPC分类号： C08F283/00
CPC分类号： C08G77/50 , C08L83/14 , C08L83/00
摘要： A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra-Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y=C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.
摘要翻译：一种式（1）的含硅化合物和含有其中Z是氢的式（1）的含硅化合物的固化组合物，其中Z是C 2 -C 4烯基或炔基的式（1）的含硅化合物和氢化硅烷化催化剂。该组合物具有优异的处理和固化性能，并提供具有优异的耐热性和柔韧性的固化产物。在式（1）中，Ra-Rg = C1-C12饱和脂族烃基或C6-C12芳族烃基。 Re和Rf不同时代表C1-C12饱和脂族烃基; Y = C2-C4亚烷基; Z =氢或C 2 -C 4烯基或炔基; K为2-7; T为1-7; P为0-3; 并且M和N是选择为N:M = 1:1至1:100的数字，所有M和N的总数至少为15，并且式（1）化合物的质均分子量为3,000至1,000,000 。

9. 发明授权

US07939614B2 Silicon-containing curing composition and heat cured product thereof 有权
标题翻译：含硅固化性组合物以及它们的热固化产物
公开(公告)号：US07939614B2
公开(公告)日：2011-05-10
申请号：US10594221
申请日：2005-05-10
申请人： Takashi Sueyoshi , Ken-Ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Yoshitaka Sugawara
发明人： Takashi Sueyoshi , Ken-Ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Yoshitaka Sugawara
IPC分类号： C08G77/04 , C08G77/12 , C08G77/14 , C08G77/20
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/00
摘要： A curable composition which comprises at least one of the following (A), (B), and (C) and further contains (D) (provided that when (C) is not contained, both (A) and (B) are in the composition. (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′ and one or more Si—O—Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si—H group and one or more Si—O—Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′, an Si—H group, and one or more Si—O—Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst. The reactive group A′ is any of Si—R1, Si—O—R2, and Si—R3—OCOC(R4)═CH2, provided that R1 and R2 each is alkenyl, R3 is alkylene and/or arylene, and R4 is hydrogen or methyl.
摘要翻译：一种可固化的组合物，其包含以下的（A）中的至少一种，（B），和（C），还含有（D）（条件是当（C）不包含，无论（A）和（B）是在该组合物（A）：含硅聚合物，其中具有1,000或更低的重均分子量成分的含量为20重量％或更低，其中有一个反应性基团A'和一个或多个SI- O-Si键（B）：A含硅聚合物，其中具有1,000或更低的重均分子量成分的含量为20重量％或更低，其具有Si-H基和一个或多个 Si-O-Si键（C）：其中重均分子量为1,000以下的成分的含量为20重量％以下且具有反应性基团A'的含硅聚合物， Si-H基和一个或多个Si-O-Si键;（D）：作为铂催化剂的用于固化反应的催化剂，反应性基团A'是Si-R 1，Si-O-R 2和的Si-R3 OCOC（R 4）═CH2，条件是R1和R2各自是链烯基，R 3是亚烷基和/或亚芳基，并且R 4是氢或甲基。

10. 发明申请

US20100179283A1 SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT 失效
标题翻译：含硅化合物，可固化组合物和固化产品
公开(公告)号：US20100179283A1
公开(公告)日：2010-07-15
申请号：US12596933
申请日：2008-04-21
申请人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
发明人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
IPC分类号： C08L83/00 , C07F7/02 , C08G77/12
CPC分类号： C08G77/50 , C08L83/14 , C08L83/00
摘要： A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra—Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y═C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.
摘要翻译：一种式（1）的含硅化合物和含有其中Z是氢的式（1）的含硅化合物的固化组合物，其中Z是C 2 -C 4烯基或炔基的式（1）的含硅化合物和氢化硅烷化催化剂。该组合物具有优异的处理和固化性能，并提供具有优异的耐热性和柔韧性的固化产物。在式（1）中，Ra-Rg = C1-C12饱和脂族烃基或C6-C12芳族烃基。 Re和Rf不同时代表C1-C12饱和脂族烃基; Y = C 2 -C 4亚烷基; Z =氢或C 2 -C 4烯基或炔基; K为2-7; T为1-7; P为0-3; 并且M和N是选择为N:M = 1:1至1:100的数字，所有M和N的总数至少为15，并且式（1）化合物的质均分子量为3,000至1,000,000 。

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