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1. 发明授权

US06494197B1 Dicing machine for cutting CSP plate into pellets 有权
标题翻译：切片机将CSP板切割成颗粒
公开(公告)号：US06494197B1
公开(公告)日：2002-12-17
申请号：US09650857
申请日：2000-08-29
申请人： Eiichi Yoshimura , Ken Togashi , Shinichi Namioka
发明人： Eiichi Yoshimura , Ken Togashi , Shinichi Namioka
IPC分类号： B28D102
CPC分类号： H01L21/67092 , B28D5/0076 , B28D5/0082 , B28D5/0094 , H01L21/67046 , H01L2224/97
摘要： Disclosed is a dicing machine for cutting a CSP plate into pellets and for transferring and putting them in a transport tray. The pick-up-and-transport means picks a selected pellet from a diced CSP plate to carry and put the so selected pellet in an allotted cell in a transport tray. On the way to the transport tray storage area, there is cleaning means for wiping and removing minute pieces of debris if any from the rear side of each pellet. The cleaning means includes a wiper in the form of rotary sponge roll, which is wet with washing liquid, and is rotated to expose its clean surface to each pellet all the time.
摘要翻译：公开了一种用于将CSP板切割成颗粒并将其转移并放置在运输托盘中的切割机。拾取和运输装置从切割的CSP板上取出选定的颗粒，将所选择的颗粒携带并放入运输托盘中的分配的单元中。在进入运输托盘存放区域的途中，存在清洁装置，用于从每个颗粒的后侧擦拭并除去微小碎片。清洁装置包括旋转海绵辊形式的擦拭器，其被洗涤液体润湿，并且随时旋转以将其清洁表面暴露于每个丸粒。

2. 发明授权

US5521495A Sensor for contactless determination of an angle of rotation of a rotatable structural element 失效
标题翻译：用于非接触式确定可旋转结构元件的旋转角度的传感器
公开(公告)号：US5521495A
公开(公告)日：1996-05-28
申请号：US310086
申请日：1994-09-22
申请人： Hajime Takahashi , Wataru Nagasaki , Ken Togashi , Kazuhiko Shimoda
发明人： Hajime Takahashi , Wataru Nagasaki , Ken Togashi , Kazuhiko Shimoda
IPC分类号： G01B7/00 , G01B7/30 , G01D5/20 , G01D5/22
CPC分类号： G01B7/30 , G01D5/20 , G01D5/22
摘要： A rotor 10 is constructed of a rotating shaft 7 and a semicylindrical rotating core 9 mounted on the shaft 7. A stator is coaxially arranged, with the rotor 10 being surrounded by a pair of annular stator coils 11 and 13 arranged one above the other in an axial direction of the rotor 10. A yoke member of the coils 11 and 13 is provided with magnetic material plates 19, 21, 23 and 25. The plates 19 and 21 for the coil 11 have halves 19A and 21A with inner peripheral portions protruding radially inwardly to approach the rotor 10, while the remaining plates 23 and 25 for the coil 13 have halves 23A and 25A with their inner peripheral portions protruding radially inwardly to approach the rotor 10. The halves 23A and 25A are oppositely disposed from the halves 19A and 21 A so as to have the coils 11 and 13 be opposite to each other in phase of the inductance as the rotor 10 rotates.
摘要翻译：转子10由安装在轴7上的旋转轴7和半圆柱形旋转芯9构成。定子同轴地布置，其中转子10被一对彼此上下布置的环形定子线圈11和13围绕线圈11和13的轭构件设置有磁性材料板19,21,23和25.用于线圈11的板19和21具有半部19A和21A，其中，内周部分突出径向向内以接近转子10，而用于线圈13的剩余板23和25具有半部23A和25A，其内周部分径向向内突出以接近转子10.半部23A和25A与半部19A相对设置和21A，以使得线圈11和13在转子10旋转时在电感的相位彼此相反。

3. 发明申请

US20110084050A1 LASER PROCESSING APPARATUS 有权
标题翻译：激光加工设备
公开(公告)号：US20110084050A1
公开(公告)日：2011-04-14
申请号：US12899757
申请日：2010-10-07
申请人： Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
发明人： Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
IPC分类号： B23K26/06 , B23K26/00
CPC分类号： B23K26/0853 , B23K26/0673 , C03B33/0222
摘要： A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.
摘要翻译：一种激光加工设备，包括激光施加单元。激光施加单元包括第一激光振荡单元，第二激光振荡单元，用于将从第一激光振荡单元振荡的激光束分支为三个光路的第一激光分支单元，用于分支激光束振荡的第二激光分支单元从第二激光振荡单元到三个光路中，三个第一聚焦单元，用于分别将激光束通过由第一激光分支单元获得的三个光路聚焦到玻璃基板，以及三个第二聚焦单元，用于分别聚焦激光束由第二激光分支单元获得的三个光路。第一聚焦单元和第二聚焦单元沿分度方向交替布置成一行。

4. 发明授权

US08404999B2 Laser processing apparatus 有权
标题翻译：激光加工设备
公开(公告)号：US08404999B2
公开(公告)日：2013-03-26
申请号：US12899757
申请日：2010-10-07
申请人： Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
发明人： Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
IPC分类号： B23K26/38 , B23K26/067
CPC分类号： B23K26/0853 , B23K26/0673 , C03B33/0222
摘要： A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.
摘要翻译：一种激光加工设备，包括激光施加单元。激光施加单元包括第一激光振荡单元，第二激光振荡单元，用于将从第一激光振荡单元振荡的激光束分支为三个光路的第一激光分支单元，用于分支激光束振荡的第二激光分支单元从第二激光振荡单元到三个光路中，三个第一聚焦单元，用于分别将激光束通过由第一激光分支单元获得的三个光路聚焦到玻璃基板，以及三个第二聚焦单元，用于分别聚焦激光束由第二激光分支单元获得的三个光路。第一聚焦单元和第二聚焦单元沿分度方向交替布置成一行。

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