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2. 发明授权

US06351681B1 Method and apparatus for a multi-chip module that is testable and reconfigurable based on testing results 有权
标题翻译：基于测试结果可测试和可重新配置的多芯片模块的方法和装置
公开(公告)号：US06351681B1
公开(公告)日：2002-02-26
申请号：US09197720
申请日：1998-11-23
申请人： David Chih , Lee K. Lau , Keith S. K. Lee
发明人： David Chih , Lee K. Lau , Keith S. K. Lee
IPC分类号： G06F1900
CPC分类号： G01R31/318513 , G01R31/318505 , G06F11/20 , G06F15/7867
摘要： A method and apparatus for a multi-chip module that is testable and reconfigurable based on testing results is accomplished by a multi-chip module that includes a first circuit disposed on a first chip substrate, a second circuit disposed on second chip substrate, and an interconnecting substrate operably coupled to the first chip substrate and the second chip substrate. The interconnecting substrate connects the first circuit to the second circuit. The interconnecting substrate includes external connectors for accessing signals within the multi-chip module, which allow the multi-chip module to be fully tested. This testing may include isolating the first circuit and/or the second circuit by disabling other circuits in order to allow each of the circuits to be exercised without interference from other circuits. After testing the multi-chip module, configuration circuitry included on the multi-chip module may be used to reconfigure the multi-chip module based on results of the testing.
摘要翻译：一种基于测试结果可测试和可重新配置的多芯片模块的方法和装置由多芯片模块实现，该多芯片模块包括设置在第一芯片基板上的第一电路，以及设置在第二芯片基板上的第二电路，互连衬底，其可操作地耦合到第一芯片衬底和第二芯片衬底。互连基板将第一电路连接到第二电路。互连基板包括用于访问多芯片模块内的信号的外部连接器，其允许多芯片模块被完全测试。该测试可以包括通过禁用其他电路来隔离第一电路和/或第二电路，以便允许每个电路在没有来自其他电路的干扰的情况下被行使。在测试多芯片模块之后，可以使用包括在多芯片模块上的配置电路基于测试结果来重新配置多芯片模块。

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