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    • 5. 发明授权
    • Chip electronic part
    • 芯片电子部件
    • US06194248B1
    • 2001-02-27
    • US09368160
    • 1999-08-05
    • Keishiro AmayaKenichi Aoki
    • Keishiro AmayaKenichi Aoki
    • H01L2144
    • H01F41/041H01F17/0006H01F27/292H01G4/06Y10T29/4902
    • The present invention is a chip electronic part having: a ceramic member; a conductor pattern formed on the surface of the ceramic member; an insulating protective layer formed on the conductor pattern; an external electrode which is formed at least one end face of the ceramic member, electrically connected to the conductor pattern, and composed of an undercoating layer formed by dry plating and at least one plating layer formed by wet plating; and at least one groove formed near an end face of the insulating protective layer so as to limit the formation of the undercoating layer.
    • 本发明是一种芯片电子部件,具有:陶瓷部件; 形成在陶瓷构件的表面上的导体图案; 形成在导体图案上的绝缘保护层; 外部电极,其形成在所述陶瓷构件的至少一个端面上,与所述导体图案电连接,并且由通过干式电镀形成的底涂层和通过湿式电镀形成的至少一层电镀层构成; 以及在绝缘保护层的端面附近形成的至少一个槽,以限制底涂层的形成。