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1. 发明授权

US08279612B2 Electronic circuit device 有权
标题翻译：电子电路装置
公开(公告)号：US08279612B2
公开(公告)日：2012-10-02
申请号：US12719331
申请日：2010-03-08
申请人： Naotaka Murakami , Keiichi Tominaga , Masato Matsubara
发明人： Naotaka Murakami , Keiichi Tominaga , Masato Matsubara
IPC分类号： H05K1/00
CPC分类号： H05K1/147 , H01L2224/73204 , H01L2924/19105 , H05K3/0061 , H05K3/284 , H05K3/323 , H05K3/361 , H05K2201/09109 , H05K2201/09172 , H05K2203/0195
摘要： An electronic circuit device including a circuit board having electronic parts, and a flexible wiring board for connection between the circuit board and external equipment. The circuit board has circuit-side connection terminals juxtaposed on a mount surface having the electrical parts mounted thereon or a non-mount surface. The wiring board has terminals juxtaposed on one of the surfaces thereof so that the wiring-board-side connection terminals confront the circuit-side circuit board connection terminals, and free-end portions each formed so as to include at least one of the wiring-board-side connection terminals, and the wiring board free-end portions are not adhesively attached to the circuit board, and the circuit-side connection terminals are electrically connected to the corresponding wiring-board-side connection terminals while the circuit-side connection terminals confront the wiring-board-side connection terminals.
摘要翻译：一种电子电路装置，包括具有电子部件的电路板和用于在电路板和外部设备之间连接的柔性布线板。电路板具有并置在其上安装有电气部件的安装表面上的电路侧连接端子或非安装表面。布线板的一个表面上并列设有端子，使得布线板侧连接端子与电路侧电路板连接端子相对，并且各自形成为包括布线板侧连接端子中的至少一个的自由端部，板侧连接端子和布线板自由端部不粘合到电路板上，并且电路侧连接端子电连接到相应的布线板侧连接端子，而电路侧连接端子面对接线板侧的连接端子。

2. 发明授权

US08169782B2 Electronic circuit device 失效
标题翻译：电子电路装置
公开(公告)号：US08169782B2
公开(公告)日：2012-05-01
申请号：US12813918
申请日：2010-06-11
申请人： Ryohei Takahashi , Naotaka Murakami , Keiichi Tominaga
发明人： Ryohei Takahashi , Naotaka Murakami , Keiichi Tominaga
IPC分类号： H05K7/20
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/49838 , H01L23/4985 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/0102 , H01L2924/181 , H01L2924/19104 , H01L2924/19107 , H05K1/189 , H05K3/0058 , H05K3/386 , H05K2201/09781 , H05K2203/1316 , Y10T29/49117 , Y10T29/49146 , Y10T29/49158 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic circuit device that suppresses deformation of an adhesive layer of a flexible printed circuit board during formation of a resin seal portion, and suppresses deterioration of the circuit board caused by deformation of the adhesive layer. The electronic circuit device includes a substrate mounted with an electronic component; a flexible printed circuit board electrically connectable to the substrate and an external device, and includes a wiring conductor and a pair of insulation films covering upper and lower surfaces of the wiring conductor; and a resin molding portion to seal the substrate and a portion of the circuit board. The wiring conductor of the circuit board is adhered through an adhesive layer to at least one of the pair of insulation films, and a dummy wiring material that does not function as wiring is disposed on an outer side of a border between the circuit board and an outer peripheral portion of the plastic molding portion, and disposed between the pair of insulation films.
摘要翻译：一种在形成树脂密封部分期间抑制柔性印刷电路板的粘合剂层的变形的电子电路装置，并且抑制由粘合剂层的变形引起的电路板的劣化。电子电路装置包括安装有电子部件的基板; 可电连接到基板的柔性印刷电路板和外部装置，并且包括布线导体和覆盖布线导体的上表面和下表面的一对绝缘膜; 以及用于密封基板和电路板的一部分的树脂模制部分。电路板的布线导体通过粘合剂层粘合到一对绝缘膜中的至少一个上，并且不用作布线的虚拟布线材料设置在电路板和电路板之间的边界的外侧上塑料成型部的外周部，并配置在该一对绝缘膜之间。

3. 发明申请

US20110007478A1 ELECTRONIC CIRCUIT DEVICE 失效
标题翻译：电子电路设备
公开(公告)号：US20110007478A1
公开(公告)日：2011-01-13
申请号：US12813918
申请日：2010-06-11
申请人： Ryohei Takahashi , Naotaka Murakami , Keiichi Tominaga
发明人： Ryohei Takahashi , Naotaka Murakami , Keiichi Tominaga
IPC分类号： H05K7/20 , H05K1/14
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/49838 , H01L23/4985 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/0102 , H01L2924/181 , H01L2924/19104 , H01L2924/19107 , H05K1/189 , H05K3/0058 , H05K3/386 , H05K2201/09781 , H05K2203/1316 , Y10T29/49117 , Y10T29/49146 , Y10T29/49158 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic circuit device that suppresses deformation of an adhesive layer of a flexible printed circuit board during formation of a resin seal portion, and suppresses deterioration of the circuit board caused by deformation of the adhesive layer. The electronic circuit device includes a substrate mounted with an electronic component; a flexible printed circuit board electrically connectable to the substrate and an external device, and includes a wiring conductor and a pair of insulation films covering upper and lower surfaces of the wiring conductor; and a resin molding portion to seal the substrate and a portion of the circuit board. The wiring conductor of the circuit board is adhered through an adhesive layer to at least one of the pair of insulation films, and a dummy wiring material that does not function as wiring is disposed on an outer side of a border between the circuit board and an outer peripheral portion of the plastic molding portion, and disposed between the pair of insulation films.
摘要翻译：一种在形成树脂密封部分期间抑制柔性印刷电路板的粘合剂层的变形的电子电路装置，并且抑制由粘合剂层的变形引起的电路板的劣化。电子电路装置包括安装有电子部件的基板; 可电连接到基板的柔性印刷电路板和外部装置，并且包括布线导体和覆盖布线导体的上表面和下表面的一对绝缘膜; 以及用于密封基板和电路板的一部分的树脂模制部分。电路板的布线导体通过粘合剂层粘合到一对绝缘膜中的至少一个，并且不用作布线的虚拟布线材料设置在电路板和电路板之间的边界的外侧上塑料成型部的外周部，并配置在该一对绝缘膜之间。

4. 发明申请

US20100232115A1 ELECTRONIC CIRCUIT DEVICE 有权
标题翻译：电子电路设备
公开(公告)号：US20100232115A1
公开(公告)日：2010-09-16
申请号：US12719331
申请日：2010-03-08
申请人： Naotaka Murakami , Keiichi Tominaga , Masato Matsubara
发明人： Naotaka Murakami , Keiichi Tominaga , Masato Matsubara
IPC分类号： H05K7/20 , H05K1/00
CPC分类号： H05K1/147 , H01L2224/73204 , H01L2924/19105 , H05K3/0061 , H05K3/284 , H05K3/323 , H05K3/361 , H05K2201/09109 , H05K2201/09172 , H05K2203/0195
摘要： An electronic circuit device including a circuit board having electronic parts, and a flexible wiring board for connection between the circuit board and external equipment. The circuit board has circuit-side connection terminals juxtaposed on a mount surface having the electrical parts mounted thereon or a non-mount surface. The wiring board has terminals juxtaposed on one of the surfaces thereof so that the wiring-board-side connection terminals confront the circuit-side circuit board connection terminals, and free-end portions each formed so as to include at least one of the wiring-board-side connection terminals, and the wiring board free-end portions are not adhesively attached to the circuit board, and the circuit-side connection terminals are electrically connected to the corresponding wiring-board-side connection terminals while the circuit-side connection terminals confront the wiring-board-side connection terminals.
摘要翻译：一种电子电路装置，包括具有电子部件的电路板和用于在电路板和外部设备之间连接的柔性布线板。电路板具有并置在其上安装有电气部件的安装表面上的电路侧连接端子或非安装表面。布线板的一个表面上并列设有端子，使得布线板侧连接端子与电路侧电路板连接端子相对，并且各自形成为包括布线板侧连接端子中的至少一个的自由端部，板侧连接端子和布线板自由端部不粘合到电路板上，并且电路侧连接端子电连接到相应的布线板侧连接端子，而电路侧连接端子面对接线板侧连接端子。

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