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1. 发明授权

US06195329B1 Trouble releasing system and method for ATM logic IP subnetwork 失效
标题翻译： ATM逻辑IP子网的故障排除系统和方法
公开(公告)号：US06195329B1
公开(公告)日：2001-02-27
申请号：US09048272
申请日：1998-03-26
申请人： Kazuyuki Kawashima
发明人： Kazuyuki Kawashima
IPC分类号： G06F1107
CPC分类号： H04Q11/0478 , H04L2012/5614 , H04L2012/5619 , H04L2012/5627
摘要： The present invention provides a trouble releasing system wherein, in operation of an ATM logic IP subnetwork, interruption of communication by a stop of an address solution server is prevented. When a currently used NHS 4 which performs address solution in a logic IP subnetwork stops a server operation because of a trouble thereof, a standby NHS control unit 63 in a standby NHS 6 issues an instruction for change-over to a server operation, and consequently, the standby NHS 6 operates as a server for address solution. Further, an NHC control unit 53 in an NHC 5a retrieves an address of the standby NHS 6 registered in a server address database 51 and causes the standby NHS 6 to switchably perform communication of an address solution request.
摘要翻译：本发明提供了一种故障排除系统，其中在ATM逻辑IP子网的操作中，防止了地址解决方案服务器停止的通信中断。当由于故障而在逻辑IP子网中执行地址解决方案的当前使用的NHS 4由于其故障而停止服务器操作时，备用NHS 6中的备用NHS控制单元63发出用于切换到服务器操作的指令，因此备用NHS 6作为地址解决方案的服务器。此外，NHC 5a中的NHC控制单元53检索在服务器地址数据库51中登记的备用NHS 6的地址，并且使备用NHS 6切换地执行地址解决方案请求的通信。

2. 发明授权

US06919137B2 High-strength solder joint 有权
标题翻译：高强度焊点
公开(公告)号：US06919137B2
公开(公告)日：2005-07-19
申请号：US10665492
申请日：2003-09-22
申请人： Kazuyuki Kawashima , Yasunori Tanaka
发明人： Kazuyuki Kawashima , Yasunori Tanaka
IPC分类号： B23K1/00 , B23K1/19 , B23K35/00 , B23K35/26 , H01L21/60 , H01L23/12 , H05K3/34 , C25C5/10 , H01L23/48
CPC分类号： B23K35/262 , B23K35/007 , H01L24/73 , H01L2224/32225 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/12044 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/3463 , Y10T428/12507 , Y10T428/12514 , Y10T428/12736 , Y10T428/1291 , Y10T428/12944 , Y10T428/12993 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01004
摘要： A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.
摘要翻译：公开了一种实现焊料和镍/金化学镀表面之间的高强度接合的焊接方法。使用包括锡（Sn），银（Ag）和铜（Cu）的焊料来焊接镍/金化学镀层。在焊接接头处，形成镍层/金属间化合物层/焊料层的层结构。金属间化合物层主要由锡（Sn）和铜（Cu）组成，并且还包括镍（Ni）。金属间化合物层在其焊料层的侧面形成有花椰菜状的表面。

3. 发明授权

US06669077B1 High-strength solder joint 失效
标题翻译：高强度焊点
公开(公告)号：US06669077B1
公开(公告)日：2003-12-30
申请号：US09653865
申请日：2000-09-01
申请人： Kazuyuki Kawashima , Yasunori Tanaka
发明人： Kazuyuki Kawashima , Yasunori Tanaka
IPC分类号： B23K3102
CPC分类号： B23K35/262 , B23K35/007 , H01L24/73 , H01L2224/32225 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/12044 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/3463 , Y10T428/12507 , Y10T428/12514 , Y10T428/12736 , Y10T428/1291 , Y10T428/12944 , Y10T428/12993 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01004
摘要： A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.
摘要翻译：公开了一种实现焊料和镍/金化学镀表面之间的高强度接合的焊接方法。使用包括锡（Sn），银（Ag）和铜（Cu）的焊料来焊接镍/金化学镀层。在焊接接头处，形成镍层/金属间化合物层/焊料层的层结构。金属间化合物层主要由锡（Sn）和铜（Cu）组成，并且还包括镍（Ni）。金属间化合物层在其焊料层的侧面形成有花椰菜状表面。

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