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1. 发明申请

US20060283713A1 SELECTIVE PLATING APPARATUS AND SELECTIVE PLATING METHOD 有权
标题翻译：选择性镀层设备和选择性镀层方法
公开(公告)号：US20060283713A1
公开(公告)日：2006-12-21
申请号：US11419904
申请日：2006-05-23
申请人： Yoko Ogihara , Takeshi Takano , Kazuo Nakabayashi
发明人： Yoko Ogihara , Takeshi Takano , Kazuo Nakabayashi
IPC分类号： C25D5/02
CPC分类号： C25D5/022 , C25D17/02 , H01L2924/0002 , H01L2924/00
摘要： A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of a surface of the metal member are exposed when the mask member is attached to the metal member, and having at least one supply opening for supplying electrolytic plating solution into the space and a discharge opening for discharging the electrolytic plating solution from the space both formed in a bottom portion of the recess portion; and at least one injection nozzle which injects the electrolytic plating solution in an oblique direction with respect to the predetermined parts of the surface of the metal member, and is arranged in vicinity of the supply opening.
摘要翻译：一种用于向金属构件施加选择性电镀的选择性电镀装置包括：掩模构件，具有凹部，使得当掩模构件附接到金属时，形成金属构件的表面的预定部分露出的空间并且具有至少一个用于向该空间供应电解电镀液的供给开口和用于从形成在凹部的底部的空间排出电解镀液的排出口; 以及至少一个注射喷嘴，其相对于金属构件的表面的预定部分沿倾斜方向注入电解镀液，并且布置在供应开口附近。

2. 发明授权

US07713398B2 Selective plating apparatus and selective plating method 有权
标题翻译：选择电镀设备和选择性电镀方法
公开(公告)号：US07713398B2
公开(公告)日：2010-05-11
申请号：US11419904
申请日：2006-05-23
申请人： Yoko Ogihara , Takeshi Takano , Kazuo Nakabayashi
发明人： Yoko Ogihara , Takeshi Takano , Kazuo Nakabayashi
IPC分类号： C25D5/08
CPC分类号： C25D5/022 , C25D17/02 , H01L2924/0002 , H01L2924/00
摘要： A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of a surface of the metal member are exposed when the mask member is attached to the metal member, and having at least one supply opening for supplying electrolytic plating solution into the space and a discharge opening for discharging the electrolytic plating solution from the space both formed in a bottom portion of the recess portion; and at least one injection nozzle which injects the electrolytic plating solution in an oblique direction with respect to the predetermined parts of the surface of the metal member, and is arranged in vicinity of the supply opening.
摘要翻译：一种用于向金属构件施加选择性电镀的选择性电镀装置包括：掩模构件，具有凹部，使得当掩模构件附接到金属时，形成金属构件的表面的预定部分露出的空间并且具有至少一个用于向该空间供应电解电镀液的供给开口和用于从形成在凹部的底部的空间排出电解镀液的排出口; 以及至少一个注射喷嘴，其相对于金属构件的表面的预定部分沿倾斜方向注入电解镀液，并且布置在供应开口附近。

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