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1. 发明授权

US5400953A Method of printing a bonding agent 失效
标题翻译：打印粘合剂的方法
公开(公告)号：US5400953A
公开(公告)日：1995-03-28
申请号：US288895
申请日：1994-08-10
申请人： Kazuhiro Maeno
发明人： Kazuhiro Maeno
IPC分类号： B41F15/08 , H05K1/18 , H05K3/12 , H05K3/32 , H05K3/34
CPC分类号： H05K3/3442 , H05K3/321 , H05K1/181 , H05K2201/10636 , H05K2203/0278 , H05K2203/0545 , H05K3/1216 , H05K3/1225 , Y02P70/611 , Y02P70/613
摘要： Lands formed on the top surface of substrate are covered by a printing screen having a printing pattern, in order to mount chip components on the substrate. A paste bonding agent is supplied to the lands through the printing pattern, and a layer of bonding agent is formed on the lands. In the printing method, a plurality of bonding agent layers that are mutually separated are formed on the land. The chip component is placed on the bonding agent layers of the land. As the chip component is pressed to the land, the bonding agent layers are smashed and spread on the land prior to applying heat to said bonding agent layers.
摘要翻译：通过具有印刷图案的印刷屏幕覆盖形成在基板顶表面上的焊盘，以便将芯片部件安装在基板上。通过印刷图案将浆料粘合剂供给到焊盘，并且在焊盘上形成粘合剂层。在印刷方法中，在平台上形成相互分离的多个粘接剂层。将芯片部件放置在焊盘的粘合剂层上。当芯片部件被压到焊盘上时，在向所述接合剂层施加热量之前，将粘合剂层粉碎并铺展在焊盘上。

2. 发明授权

US07495924B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US07495924B2
公开(公告)日：2009-02-24
申请号：US11685670
申请日：2007-03-13
申请人： Kazuhiro Maeno
发明人： Kazuhiro Maeno
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H01L2924/0002 , H05K3/0061 , H05K2201/09745 , H01L2924/00
摘要： An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate and the heat radiating body. The heat generating component and the non-heat-generating component are mounted on the metal substrate. A gap that permits the heat conductive oil to enter the gap is defined between the metal substrate and the heat radiating body. The gap is arranged at a position corresponding to the non-heat-generating component or a position corresponding to a portion between the heat generating component and the non-heat-generating component.
摘要翻译：公开了一种具有散热体，金属基板，发热部件和非发热部件的电子设备。金属基板通过布置在金属基板和散热体之间的导热油固定在散热体上。发热部件和非发热部件安装在金属基板上。允许导热油进入间隙的间隙限定在金属基板和散热体之间。该间隙配置在与非发热部件对应的位置或与发热部件与非发热部件对应的位置。

3. 发明申请

US20070194428A1 Connection Structure and Method for Connecting flexible Printed Circuit to Main Substrate 有权
标题翻译：将柔性印刷电路连接到主基板的连接结构和方法
公开(公告)号：US20070194428A1
公开(公告)日：2007-08-23
申请号：US11670645
申请日：2007-02-02
申请人： Kunikazu Sato , Kazuhiro Maeno , Takamasa Nodo , Satoshi Ito
发明人： Kunikazu Sato , Kazuhiro Maeno , Takamasa Nodo , Satoshi Ito
IPC分类号： H01L23/02
CPC分类号： H05K3/363 , H05K3/284 , H05K3/305 , H05K2201/048 , H05K2201/09063 , H05K2201/09172
摘要： A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit is formed on the flexible printed circuit. A connection terminal to which a corresponding wiring pattern is connected is formed at the tip of the flexible printed circuit. A through-hole is formed between the wiring patterns. Potting resin is potted in each through-hole and around it. When the resin hardens, the potting resin joints the main substrate and the flexible printed circuit.
摘要翻译：主基板在其表面和内层中设置有布线图案。在柔性印刷电路上形成用于将主基板的信号线或电源线连接到外部电路的布线图案。在柔性印刷电路的末端形成连接相应布线图案的连接端子。在布线图案之间形成通孔。灌封树脂浸在每个通孔和周围。当树脂硬化时，灌封树脂接合主基板和柔性印刷电路。

4. 发明授权

US06213245B1 Cross member structure for transmission 有权
标题翻译：交叉构件传输结构
公开(公告)号：US06213245B1
公开(公告)日：2001-04-10
申请号：US09333704
申请日：1999-06-16
申请人： Makoto Murata , Kazuhiro Maeno , Tatsuya Okuno
发明人： Makoto Murata , Kazuhiro Maeno , Tatsuya Okuno
IPC分类号： B60K1700
CPC分类号： B62D21/155 , B60K5/12 , B60K17/00
摘要： A transmission having a propeller shaft in the rear is mounted on a cross member which is connected with left and right side frames of a vehicle. The cross member has a closed cross section extending in a transverse direction of the vehicle and is connected at a central portion thereof with the transmission. Two sets of three mounting bolts disposed in a triangular relationship connect the cross member with the left and right side frames through bolt holes slotted in an outward direction of the vehicle on the cross member. When the vehicle has a collision, the transmission is displaced rearwardly and the cross member is deformed to absorb an impact load until the propeller shaft is disconnected from the floor panel.
摘要翻译：在后部具有传动轴的变速器安装在与车辆的左右侧架连接的横梁上。横梁具有在车辆的横向方向上延伸的闭合横截面并且在其中心部分处与变速器连接。设置成三角关系的两组三个安装螺栓通过在横梁上沿车辆向外方向开槽的螺栓孔将横梁与左右侧架连接。当车辆发生碰撞时，变速器向后移位，并且横梁变形以吸收冲击载荷，直到传动轴从地板面断开。

5. 发明申请

US20080316720A1 Electronic components 审中-公开
标题翻译：电子元器件
公开(公告)号：US20080316720A1
公开(公告)日：2008-12-25
申请号：US12148560
申请日：2008-04-21
申请人： Kazuhiro Maeno
发明人： Kazuhiro Maeno
IPC分类号： H05K5/00
CPC分类号： H01L23/057 , H01L2924/0002 , H01L2924/00
摘要： Electronic components include a case, a circuit board, electronic parts, a plate-like electrode terminal, a metal cover, a stepped portion, a connecting terminal, and a fastening member. The case includes a connector portion and an opening. The connector portion has an external terminal. The circuit board mounting the electronic parts is accommodated in the case. The electrode terminal is accommodated in the case and electrically connected to the electronic parts. The plate-like electrode terminal includes a board-side end portion and a case-side end portion. The metal cover closes the opening so as to be spaced away from the circuit board and the electrode terminal. The connecting terminal is arranged on a stepped portion in the case. The connecting terminal is formed integrally with the external terminal. The fastening member connects the case-side end portion to the case. The fastening member electrically connects the case-side end portion to the connecting terminal.
摘要翻译：电子部件包括壳体，电路板，电子部件，板状电极端子，金属盖，台阶部，连接端子和紧固部件。壳体包括连接器部分和开口。连接器部分具有外部端子。安装电子部件的电路板容纳在壳体中。电极端子容纳在壳体中并电连接到电子部件。板状电极端子包括基板侧端部和壳体侧端部。金属盖封闭开口，以便与电路板和电极端子间隔开。连接端子布置在壳体中的阶梯部分上。连接端子与外部端子一体形成。紧固构件将壳体侧端部连接到壳体。紧固构件将壳体侧端部电连接到连接端子。

6. 发明申请

US20070207637A1 COMPOSITE CIRCUIT BOARD 审中-公开
标题翻译：复合电路板
公开(公告)号：US20070207637A1
公开(公告)日：2007-09-06
申请号：US11679698
申请日：2007-02-27
申请人： Satoshi Ito , Kazuhiro Maeno , Takamasa Nodo
发明人： Satoshi Ito , Kazuhiro Maeno , Takamasa Nodo
IPC分类号： H01R12/00
CPC分类号： H05K3/363 , H05K2201/09381 , H05K2201/09427
摘要： A composite circuit board includes a first circuit board having a first land and a second circuit board having a second land at least a part of which is soldered to a part of the first land face-to-face. The first land has a region overlapped by the second circuit board. The region has a non-facing region which does not face to the second land.
摘要翻译：复合电路板包括具有第一焊盘的第一电路板和具有第二焊盘的第二电路板，第二焊盘的至少一部分被面对面地焊接到第一焊盘的一部分。第一焊盘具有与第二电路板重叠的区域。该地区有一个不面向第二个土地的不面对的地区。

7. 发明授权

US06885097B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06885097B2
公开(公告)日：2005-04-26
申请号：US10019201
申请日：2001-04-24
申请人： Kazuhiro Maeno , Eiji Kono
发明人： Kazuhiro Maeno , Eiji Kono
IPC分类号： H01L25/07 , H01L23/04 , H05K5/02 , H05K7/18
CPC分类号： H01L24/49 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01039 , H01L2924/01068 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13091 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099
摘要： A board-shaped thermal conductor base board (3) is arranged on the bottom surface of a power module (1). Substrates (4) and (5) are arranged on the top surface of the thermal conductor base board (3), and semiconductor elements (6) and (7) are respectively arranged on the top surfaces of the substrates (4) and (5). The semiconductor elements (6, 7) are surrounded by a resinous case (2). A source electrode (13) is attached above and apart from the semiconductor elements (6, 7) by using the resinous case (2). The connection between the source electrode (13) and the sources of the semiconductor elements (7) are connected by wire bonding.
摘要翻译：在电源模块（1）的底面设有板状的导热体基板（3）。基板（4）和（5）布置在热导体基板（3）的顶表面上，并且半导体元件（6）和（7）分别设置在基板（4）和（5）的顶表面上）。半导体元件（6,7）被树脂壳体（2）包围。通过使用树脂壳体（2）将源电极（13）附接到半导体元件（6,7）的上方和外部。源电极（13）和半导体元件（7）的源极之间的连接通过引线接合连接。

8. 发明申请

US20070211433A1 ELECTRONIC DEVICE 失效
标题翻译：电子设备
公开(公告)号：US20070211433A1
公开(公告)日：2007-09-13
申请号：US11685670
申请日：2007-03-13
申请人： Kazuhiro Maeno
发明人： Kazuhiro Maeno
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H01L2924/0002 , H05K3/0061 , H05K2201/09745 , H01L2924/00
摘要： An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate and the heat radiating body. The heat generating component and the non-heat-generating component are mounted on the metal substrate. A gap that permits the heat conductive oil to enter the gap is defined between the metal substrate and the heat radiating body. The gap is arranged at a position corresponding to the non-heat-generating component or a position corresponding to a portion between the heat generating component and the non-heat-generating component.
摘要翻译：公开了一种具有散热体，金属基板，发热部件和非发热部件的电子设备。金属基板通过布置在金属基板和散热体之间的导热油固定在散热体上。发热部件和非发热部件安装在金属基板上。允许导热油进入间隙的间隙限定在金属基板和散热体之间。该间隙配置在与非发热部件对应的位置或与发热部件与非发热部件对应的位置。

9. 发明授权

US07186926B2 Surface mounting structure for surface mounting an electronic component 有权
标题翻译：用于表面安装电子元件的表面安装结构
公开(公告)号：US07186926B2
公开(公告)日：2007-03-06
申请号：US11056749
申请日：2005-02-11
申请人： Kazuhiro Maeno
发明人： Kazuhiro Maeno
IPC分类号： H05K1/16
CPC分类号： H05K1/111 , H01L2224/10175 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , H05K2203/048 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A surface mounting structure for a surface mounting electronic component includes an electronic component, a circuit board and a solder fillet. The electronic component has on a marginal portion thereof a plurality of electrodes, each of which is formed so as to cover at least an under surface, both side faces and an end face of the electronic component. The circuit board has a set of lands, on which the electrodes of the electronic component are joined by soldering. Each land corresponds to one of the electrodes and has a restricting portion, which restricts movement of the electronic component at the time of solder melting during surface mounting, and also has a protrusion on each side of the corresponding electrode. The solder fillet is formed at least on each protrusion so as to correspond to both side faces of the corresponding electrode.
摘要翻译：用于表面安装电子部件的表面安装结构包括电子部件，电路板和焊接圆角。电子部件在其边缘部分上具有多个电极，每个电极形成为至少覆盖电子部件的至少一个下表面，两个侧面和端面。电路板具有一组焊盘，电子部件的电极通过焊接连接在该焊盘上。每个焊盘对应于一个电极，并且具有限制部分，其限制在表面安装期间焊料熔化时电子部件的移动，并且在相应电极的每一侧上还具有突起。焊料圆角至少形成在每个突起上，以对应于相应电极的两个侧面。

10. 发明授权

US07161235B2 Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method therefore 失效
标题翻译：因此，封装有多个半导体器件的半导体装置和布线方法
公开(公告)号：US07161235B2
公开(公告)日：2007-01-09
申请号：US10301252
申请日：2002-11-21
申请人： Kazuhiro Maeno
发明人： Kazuhiro Maeno
IPC分类号： H01L23/52
CPC分类号： H01L24/49 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49113 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A drain electrode wiring conductor through which a main current of a MOS transistor takes the form of a flat board, being inserted into a first side of the frame of a case, and extends along the first side. The source electrode wiring conductor also takes the form of a flat board, being inserted into the first side and a second side, and extends parallel to a drain electrode wiring conductor along the first side. The flow of the current in the drain electrode wiring conductor is opposite in direction to the flow of the current in the source electrode wiring conductor. With the configuration, the parasitic inductance of a semiconductor module including a plurality of MOS transistors can be reduced.
摘要翻译：一种漏电极布线导体，MOS晶体管的主电流通过该漏极电极布线导体插入到壳体的框架的第一侧中并且沿着第一侧延伸。源电极布线导体也采用平板的形式，插入第一侧和第二侧，并且沿着第一侧平行于漏极布线导体延伸。漏极布线导体中的电流的流动方向与源电极布线导体中的电流的流动相反。通过该结构，可以减少包括多个MOS晶体管的半导体模块的寄生电感。

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