专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10328683B2 Adhesive agent, adhesive material using the same, and method of use thereof 有权
公开(公告)号：US10328683B2
公开(公告)日：2019-06-25
申请号：US13445398
申请日：2012-04-12
申请人： Katsuyuki Masuda , Masatoshi Yamaguchi , Eiichi Shinada , Takehiro Fukuyama , Yoshihiro Sakairi
发明人： Katsuyuki Masuda , Masatoshi Yamaguchi , Eiichi Shinada , Takehiro Fukuyama , Yoshihiro Sakairi
IPC分类号： C09J177/06 , C09J179/08 , B32B43/00 , C08G69/26 , C08G69/40 , C08G73/14
摘要： An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the condensation resin has a cyclohexane ring.

2. 发明授权

US09446576B2 Adhesive agent, adhesive material using the same, and method of use thereof 有权
标题翻译：粘合剂，使用其的粘合剂材料及其使用方法
公开(公告)号：US09446576B2
公开(公告)日：2016-09-20
申请号：US13445344
申请日：2012-04-12
申请人： Katsuyuki Masuda , Masatoshi Yamaguchi , Eiichi Shinada , Takehiro Fukuyama , Yoshihiro Sakairi
发明人： Katsuyuki Masuda , Masatoshi Yamaguchi , Eiichi Shinada , Takehiro Fukuyama , Yoshihiro Sakairi
IPC分类号： B32B37/00 , B32B43/00 , C08G69/26 , C09J177/06 , C09J179/08 , C08G69/40 , C08G73/14
CPC分类号： B32B43/006 , C08G69/265 , C08G69/40 , C08G73/14 , C09J177/06 , C09J179/08 , Y10T428/2896
摘要： An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A). and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the monomer (A) contains an isophthalic acid.

3. 发明授权

US08486837B2 Polishing slurry for metal, and polishing method 失效
公开(公告)号：US08486837B2
公开(公告)日：2013-07-16
申请号：US12318376
申请日：2008-12-29
申请人： Hiroshi Ono , Katsuyuki Masuda , Masanobu Habiro
发明人： Hiroshi Ono , Katsuyuki Masuda , Masanobu Habiro
IPC分类号： H01L21/00 , H01L21/02019 , H01L21/02247 , H01L21/30 , C11D11/0047 , C11D3/3945
CPC分类号： B24B37/00 , B24B37/04 , B24B37/044 , C09G1/02 , C23F1/42 , C23F3/00 , C23F3/06 , H01L21/3212
摘要： A polishing slurry for metal comprises an oxidizer, a metal oxide dissolving agent, a metal inhibitor, and water, wherein the metal inhibitor is at least one of a compound having an amino-triazole skeleton and a compound having an imidazole skeleton. The use of the polishing slurry for metal makes it possible to raise the polishing speed sufficiently while keeping the etching speed low, restrain the generation of corrosion of the surface of a metal and dishing, and form a metal-film-buried pattern having a high reliability in the process of formation of wiring of semiconductor devices.

4. 发明申请

US20130158225A1 NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME 有权
标题翻译：新型含硅聚合物聚酰胺树脂，聚酰胺树脂及其制造方法
公开(公告)号：US20130158225A1
公开(公告)日：2013-06-20
申请号：US13583727
申请日：2011-04-13
申请人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
发明人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
IPC分类号： C08G73/10 , C08G69/42
CPC分类号： C08G73/106 , C08G69/42 , C08G73/105 , C08G73/1075 , C08G73/1078 , C08G77/455
摘要： A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.
摘要翻译：包含由式（1）表示的重复单元的聚酰亚胺树脂：其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型，和包含由式（2）表示的重复单元的聚酰胺酸树脂：其中R是二胺残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的酰胺基和羧基中的任一个相对于降冰片烷环具有外部构型。聚酰亚胺树脂可溶于通用溶剂，透明度高，分子量高，机械性能优异，拉伸强度和伸长率优异。

5. 发明授权

US07871694B2 Prepreg, metal-clad laminate and printed circuit board using same 有权
标题翻译：预浸料，覆金属层压板和使用其的印刷电路板
公开(公告)号：US07871694B2
公开(公告)日：2011-01-18
申请号：US12180384
申请日：2008-07-25
申请人： Kazumasa Takeuchi , Makoto Yanagida , Masaki Yamaguchi , Katsuyuki Masuda
发明人： Kazumasa Takeuchi , Makoto Yanagida , Masaki Yamaguchi , Katsuyuki Masuda
IPC分类号： B32B27/04 , B32B27/12 , D04H1/00
CPC分类号： C08J5/24 , C08G59/504 , C08G73/1042 , C08G73/106 , C08G73/14 , C08K5/3445 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K1/0353 , H05K2201/0154 , Y10T428/12549 , Y10T428/249921 , Y10T428/249924 , Y10T428/249941 , Y10T428/249951 , C08L2666/20 , C08L2666/22
摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要翻译：本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。

6. 发明申请

US20090323300A1 Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board 审中-公开
标题翻译：导电箔与粘合层，导体包层层压板，印刷线路板和多层接线板
公开(公告)号：US20090323300A1
公开(公告)日：2009-12-31
申请号：US12298337
申请日：2007-04-24
申请人： Daisuke Fujimoto , Yasuyuki Mizuno , Kazutoshi Danjobara , Katsuyuki Masuda , Hikari Murai
发明人： Daisuke Fujimoto , Yasuyuki Mizuno , Kazutoshi Danjobara , Katsuyuki Masuda , Hikari Murai
IPC分类号： H05K1/14 , B32B7/12 , B32B5/16 , B32B3/10 , B32B27/34 , B32B27/04 , H05K1/00
CPC分类号： H05K3/386 , B32B5/022 , B32B5/024 , B32B7/12 , B32B15/08 , B32B15/12 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/10 , B32B27/12 , B32B27/281 , B32B27/285 , B32B27/306 , B32B27/32 , B32B27/38 , B32B27/42 , B32B2255/06 , B32B2255/26 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/02 , B32B2262/101 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/714 , B32B2307/718 , B32B2457/08 , C09J163/00 , H05K3/427 , H05K3/4602 , H05K2201/0355 , Y10T428/24355 , Y10T428/254 , Y10T428/265 , Y10T428/2852 , Y10T428/31721 , Y10T442/2459
摘要： The invention provides an adhesive layer-attached conductive foil and a conductor-clad laminated sheet which allow transmission loss to be satisfactorily reduced especially in the high-frequency band, which exhibit excellent heat resistance, and which allow production of printed circuit boards that are adequately resistant to interlayer peeling. The adhesive layer-attached conductive foil of the invention is provided with a conductive foil and an adhesive layer formed on the conductive foil, wherein the adhesive layer is composed of a curable resin composition containing component (A): a polyfunctional epoxy resin, component (B): a polyfunctional phenol resin and component (C): a polyamideimide. The conductor-clad laminated sheet of the invention comprises an insulating layer, a conductive layer situated facing the insulating layer, and an adhesive layer sandwiched between the insulating layer and conductive layer, and the adhesive layer is composed of a cured resin composition containing components (A), (B) and (C).
摘要翻译：本发明提供一种附着粘合剂层的导电箔和导体包覆层叠片，特别是在耐高温性优异的高频带中，能够令人满意地降低传输损失，并且能够适当地制造印刷电路板耐层间剥离。本发明的带粘合剂层的导电箔具有形成在导电箔上的导电箔和粘合层，其中粘合层由含有组分（A）的固化性树脂组合物组成：多官能环氧树脂，组分（ B）：多官能酚树脂和（C）成分：聚酰胺酰亚胺。本发明的导体包覆层压片包括绝缘层，面向绝缘层的导电层和夹在绝缘层和导电层之间的粘合层，并且粘合层由含有组分的固化树脂组合物 A），（B）和（C）。

7. 发明授权

US07519049B2 Mobile phone system for allowing a user to transmit voice messages 有权
标题翻译：用于允许用户发送语音消息的移动电话系统
公开(公告)号：US07519049B2
公开(公告)日：2009-04-14
申请号：US10790236
申请日：2004-03-02
申请人： Katsuyuki Masuda
发明人： Katsuyuki Masuda
IPC分类号： H04L12/66 , H04L29/08 , H04J1/02
CPC分类号： H04W88/181 , H04M1/642 , H04M1/7255 , H04M1/72563
摘要： The present invention provides a mobile phone system, which can give a desired voice message to a user of an opposite party terminal without speaking in a state that limitation to usable voice messages has been reduced, while allowing a user existing under an environment that he/she can not speak to listen to a voice from the opposite party terminal. A mobile phone terminal 1 is provided with means 12 for transmitting a connection request of a packet switching line to the side of a network and means 11 for transmitting data corresponding to a desired voice message, while the network is provided with data/voice message converting means 4 for converting transmitted data to a voice message corresponding thereto and means for merging the converted voice message to a circuit switching line of the opposite party terminal to transmit the same.
摘要翻译：本发明提供了一种移动电话系统，其能够在对可用语音消息的限制已经被减少的状态下向对方终端的用户发出期望的语音消息，同时允许存在于他/ 她不能说话来听对方的声音。移动电话终端1设置有用于将分组交换线路的连接请求发送到网络侧的装置12，以及用于发送对应于所需语音消息的数据的装置11，同时向网络提供数据/语音消息转换用于将发送的数据转换为对应的语音消息的装置4，以及用于将转换的语音消息合并到对方终端的电路交换线以发送的装置。

8. 发明申请

US20070277375A1 Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Printed Wiring Board, and, Method for Manufacturing Multi-Layer Printed Wiring Board 有权
标题翻译：印刷接线板预浸料，金属箔包层和印刷接线板，以及多层印刷接线板制造方法
公开(公告)号：US20070277375A1
公开(公告)日：2007-12-06
申请号：US11630651
申请日：2005-06-22
申请人： Nozomu Takano , Kazumasa Takeuchi , Katsuyuki Masuda , Masashi Tanaka , Kazuhito Obata , Yuuji Ooyama , Yoshitsugu Matsuura
发明人： Nozomu Takano , Kazumasa Takeuchi , Katsuyuki Masuda , Masashi Tanaka , Kazuhito Obata , Yuuji Ooyama , Yoshitsugu Matsuura
IPC分类号： H05K3/10
CPC分类号： B32B27/04 , B29K2105/0872 , H05K1/0366 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/53883
摘要： A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.
摘要翻译：根据本发明的印刷线路板预浸料是通过用热固性树脂组合物浸渍干燥基材而获得的印刷线路板预浸料，当其弯曲90°时，基材中不会发生裂纹。

9. 发明申请

US20060143990A1 Polishing fluid for metal, and polishing method 审中-公开
标题翻译：抛光液用于金属和抛光方法
公开(公告)号：US20060143990A1
公开(公告)日：2006-07-06
申请号：US10560228
申请日：2003-06-13
申请人： Hiroshi Ono , Katsuyuki Masuda , Masanobu Habiro
发明人： Hiroshi Ono , Katsuyuki Masuda , Masanobu Habiro
IPC分类号： C09K3/14
CPC分类号： H01L21/3212 , C09G1/02
摘要： A polishing slurry for metal comprises an oxidizer, a metal oxide dissolving agent, a metal inhibitor, and water, wherein the metal inhibitor is at least one of a compound having an amino-triazole skeleton and a compound having an imidazole skeleton. The use of the polishing slurry for metal makes it possible to raise the polishing speed sufficiently while keeping the etching speed low, restrain the generation of corrosion of the surface of a metal and dishing, and form a metal-film-buried pattern having a high reliability in the process of formation of wiring of semiconductor devices.
摘要翻译：金属研磨用浆料包含氧化剂，金属氧化物溶解剂，金属抑制剂和水，其中金属抑制剂是具有氨基 - 三唑骨架的化合物和具有咪唑骨架的化合物中的至少一种。通过使用金属研磨用浆料，能够使蚀刻速度保持在较低的水平，提高研磨速度，抑制金属表面的腐蚀和凹陷的产生，形成高的金属膜埋藏图案在半导体器件布线形成过程中的可靠性。

10. 发明授权

US08592546B2 Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same 有权
标题翻译：含硅脂环族聚酰亚胺树脂，聚酰胺酸树脂及其制造方法
公开(公告)号：US08592546B2
公开(公告)日：2013-11-26
申请号：US13583727
申请日：2011-04-13
申请人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
发明人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
IPC分类号： C08G77/452
CPC分类号： C08G73/106 , C08G69/42 , C08G73/105 , C08G73/1075 , C08G73/1078 , C08G77/455
摘要： A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.
摘要翻译：包含由式（1）表示的重复单元的聚酰亚胺树脂：其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型，和包含由式（2）表示的重复单元的聚酰胺酸树脂：其中R是二胺残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 与降冰片烷环结合的酰胺基和羧基中的任何一个相对于降冰片烷环都处于外部构型。聚酰亚胺树脂可溶于通用溶剂，透明度高，分子量高，机械性能优异，拉伸强度和伸长率优异。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式