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    • 4. 发明授权
    • Stacked die interconnect validation
    • 堆叠芯片互连验证
    • US08402404B1
    • 2013-03-19
    • US13298541
    • 2011-11-17
    • Ashok MehtaStanley JohnKai-Yuan TingSandeep Kumar GoelChao-Yang Yeh
    • Ashok MehtaStanley JohnKai-Yuan TingSandeep Kumar GoelChao-Yang Yeh
    • G06F17/50
    • G06F17/5081G06F17/50G06F17/5072G06F17/5077G06F2217/78
    • A system includes an automated place and route tool to generate a layout of an integrated circuit (IC) die based on a gate level circuit description. A machine readable persistent storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second IC dies, respectively, and a second portion encoded with a second gate level description of the plurality of circuit patterns received from the tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented verification module is provided for comparing the first and second gate level descriptions and outputting an error report if the second gate level description has an error. The verification module outputs a verified second gate-level description of the first and second circuit patterns.
    • 一种系统包括基于门级电路描述产生集成电路(IC)裸片的布局的自动放置和布线工具。 机器可读永久存储介质分别包括第一部分,第一部分被编码为将分别形成在第一和第二IC管芯上的​​第一和第二电路图案的第一栅极级描述,以及用多个第二栅极电平描述编码的第二部分 从工具接收的电路图案。 第二门级描述包括电源和接地端口,并且第一门级描述不包括电源和接地端口。 提供了一种处理器实现的验证模块,用于比较第一和第二门级描述,并且如果第二门级描述具有错误则输出错误报告。 验证模块输出第一和第二电路图案的验证的第二门级描述。