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    • 3. 发明申请
    • PULVERIZING APPARATUS
    • US20130105607A1
    • 2013-05-02
    • US13696101
    • 2011-04-28
    • Masahiro YoshikawaTakashi ShibataKohei Hosokawa
    • Masahiro YoshikawaTakashi ShibataKohei Hosokawa
    • B02C13/288
    • B02C13/288B02C17/163B02C17/166B02C17/1815B02C17/188B02C17/22
    • A pulverizing apparatus for processing a powder material that can be readily melted by friction heat generated between the pulverizing apparatus and the material. The pulverizing apparatus includes a casing (2) having a cylindrical inner face, a rotor (10) driven to rotate about the axis X of the casing and having a rugged portion (10G) in its outer periphery, a gas source providing a gas flow for conveying the powder material from a feed opening (3) provided at an end of the casing along the an axial direction to a discharge opening (4) provided at the other axial end of the casing, a coolant source providing coolant to flow in a coolant passage (15) formed inside the rotor. The rugged portion is divided along the axial direction by an annular cutout portion (11) extending along the peripheral direction of the rotor.
    • 一种用于加工粉碎材料的粉碎装置,其可以通过在粉碎装置和材料之间产生的摩擦热容易地熔化。 粉碎装置包括具有圆筒形内表面的壳体(2),被驱动为围绕壳体的轴线X旋转并且在其外周具有凹凸部分(10G)的转子(10),提供气流 用于将设置在壳体的端部处的进料口(3)沿轴向方向输送到设置在壳体的另一轴向端部处的排出口(4),冷却剂源提供冷却剂以在 冷却剂通道(15)形成在转子内部。 凹凸部沿着轴向沿着沿着转子的圆周方向延伸的环形切口部分(11)分开。
    • 6. 发明授权
    • Substrate housing container
    • 基材容器
    • US07876575B2
    • 2011-01-25
    • US12147045
    • 2008-06-26
    • Kohei Hosokawa
    • Kohei Hosokawa
    • H05K7/18H05K7/14
    • H01L21/67383
    • The present invention includes a ceiling portion 8, bottom portion 9, a substrate housing portion 3 formed by a side walls 5 to 7, a plurality of wafer slots 11 arrayed in parallel on the inner surface of the side walls 6 and 7, a slit portion 12 formed in an extended manner along the array direction of the wafer slots 11 on each of a second side wall 6 and a third side wall 7, a slide portion 18 movably arrayed along each of the slit portions 12, a plurality of substrate securing pieces arrayed with substantially the same intervals with the intervals of the wafer slots 11 on the inner surface of the slide portion 18, in which, with the slide portion being in a substrate securing position, the substrate housing pieces press and secure the substrate on the wafer slot 11, and in a substrate securing releasing position, the substrate housing pieces move separately from a circumferential portion of the substrate and releases a securing state of the substrate. In accordance with the present invention, it is possible to provide a substrate housing container which is able to hold the wafer in a predetermined position even in a case in which the substrate housing container is moved in which a lid body is released.
    • 本发明包括顶部8,底部9,由侧壁5至7形成的基板收纳部分3,平行于侧壁6和7的内表面上排列的多个晶片槽11,狭缝 在第二侧壁6和第三侧壁7中的每一个上沿着晶片槽11的排列方向延伸形成的部分12,沿着每个狭缝部分12可移动地排列的滑动部分18,多个基板固定 以与滑动部分18的内表面上的晶片槽11的间隔大致相同的间隔排列的片,其中,当滑动部分处于基板固定位置时,基板壳体件将基板压紧 晶片槽11,并且在基板固定解除位置中,基板壳体件与基板的圆周部分分开移动并释放基板的固定状态。 根据本发明,可以提供一种能够将晶片保持在预定位置的基板容纳容器,即使在其中释放盖体的基板容纳容器被移动的情况下也是如此。
    • 9. 发明申请
    • SUBSTRATE HOUSING CONTAINER
    • 基座容器
    • US20090002966A1
    • 2009-01-01
    • US12147045
    • 2008-06-26
    • Kohei Hosokawa
    • Kohei Hosokawa
    • H05K7/02
    • H01L21/67383
    • The present invention includes a ceiling portion 8, bottom portion 9, a substrate housing portion 3 formed by a side walls 5 to 7, a plurality of wafer slots 11 arrayed in parallel on the inner surface of the side walls 6 and 7, a slit portion 12 formed in an extended manner along the array direction of the wafer slots 11 on each of a second side wall 6 and a third side wall 7, a slide portion 18 movably arrayed along each of the slit portions 12, a plurality of substrate securing pieces arrayed with substantially the same intervals with the intervals of the wafer slots 11 on the inner surface of the slide portion 18, in which, with the slide portion being in a substrate securing position, the substrate housing pieces press and secure the substrate on the wafer slot 11, and in a substrate securing releasing position, the substrate housing pieces move separately from a circumferential portion of the substrate and releases a securing state of the substrate. In accordance with the present invention, it is possible to provide a substrate housing container which is able to hold the wafer in a predetermined position even in a case in which the substrate housing container is moved in which a lid body is released.
    • 本发明包括顶部8,底部9,由侧壁5至7形成的基板收纳部分3,平行于侧壁6和7的内表面上排列的多个晶片槽11,狭缝 在第二侧壁6和第三侧壁7中的每一个上沿着晶片槽11的排列方向延伸形成的部分12,沿着每个狭缝部分12可移动地排列的滑动部分18,多个基板固定 以与滑动部分18的内表面上的晶片槽11的间隔大致相同的间隔排列的片,其中,当滑动部分处于基板固定位置时,基板壳体件将基板压紧 晶片槽11,并且在基板固定解除位置中,基板壳体件与基板的圆周部分分开移动并释放基板的固定状态。 根据本发明,可以提供一种能够将晶片保持在预定位置的基板容纳容器,即使在其中释放盖体的基板容纳容器被移动的情况下也是如此。
    • 10. 发明授权
    • Circuit operation verification device and method
    • 电路运行验证装置及方法
    • US07228513B2
    • 2007-06-05
    • US10935271
    • 2004-09-08
    • Kohei Hosokawa
    • Kohei Hosokawa
    • G06F17/50
    • G06F17/5022
    • A circuit verification device includes emulators to which circuit portions obtained by dividing the circuit are implemented. The emulators communicate with each other through a bus to verify the functional operation of the circuit. The circuit is divided based on a communication occurrence pattern between circuit units so that the number of communications occurring between circuit portions is minimized. The input signals of the bus are preferably arranged in the bus address space in descending order of a signal change rate, and a burst transfer may be utilized. Through paths within the circuit being verified are searched, and a plurality of circuit units is divided so as to minimize the number of through paths among the circuit portions.
    • 电路验证装置包括实现通过划分电路获得的电路部分的仿真器。 仿真器通过总线相互通信,以验证电路的功能操作。 基于电路单元之间的通信发生模式来分割电路,使得在电路部分之间发生的通信的数量最小化。 总线的输入信号优选地以信号变化率的降序布置在总线地址空间中,并且可以利用突发传送。 搜索正在验证的电路内的通路,分割多个电路单元以使电路部分之间的通路数量最小化。