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1. 发明授权

US06296495B1 Land grid package connector 失效
标题翻译：接地网封装连接器
公开(公告)号：US06296495B1
公开(公告)日：2001-10-02
申请号：US09535271
申请日：2000-03-23
申请人： Jwomin Wang , Nick Lin , Justin Yu
发明人： Jwomin Wang , Nick Lin , Justin Yu
IPC分类号： H01R1200
CPC分类号： H01R12/52 , H01R12/714 , H01R13/6315
摘要： An LGP connector comprises an insulative housing and a plurality of contacts. The housing defines a plurality of passageway sections for receiving the contacts therein. Each contact includes a soldering base for soldering the contact to a printed circuit board and an upper contact beam for electrically connecting the contact with an LGP chip, thereby electrically connecting the chip with the printed circuit board. Each contact comprises a pair of anti-rotation tabs extending from an end of the soldering base, and each passageway section transversely defines an anti-rotation cavity in a bottom face thereof and at a first side wall thereof for retaining the anti-rotation tabs of the contact.
摘要翻译： LGP连接器包括绝缘壳体和多个触点。壳体限定用于在其中接收触点的多个通道部分。每个触点包括用于将触点焊接到印刷电路板的焊接基座和用于将触点与LGP芯片电连接的上接触梁，从而将芯片与印刷电路板电连接。每个触点包括从焊接基座的一端延伸的一对防旋转突出部，并且每个通道部分在其底面和其第一侧壁处横向地限定防旋转腔，并在其第一侧壁处保持防旋转突出部联系人。

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