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    • 1. 发明授权
    • Liquid coating apparatus with temperature controlling manifold
    • 带温控歧管的液体涂布设备
    • US06620245B2
    • 2003-09-16
    • US09893707
    • 2001-06-29
    • Seiki IshidaJunichi IwanoJun OokuraMichishige Saito
    • Seiki IshidaJunichi IwanoJun OokuraMichishige Saito
    • B05C1100
    • H01L21/6715H01L21/67248
    • An apparatus for processing a substrate of the present invention comprises a holder holding a substrate, a supply pipe being supplied with a processing solution from a first end and supplying the processing solution to the substrate from a second end, a first temperature controller having a first temperature controlled water circulated inside which controls a first temperature around the second end of the supply pipe and a second temperature controller having a second temperature controlled water drained from the first temperature controller circulated inside, which controls a second temperature around the first end of the supply pipe. With such a configuration, the temperature controlled water used for controlling the temperature of the processing solution just before its application onto the substrate can be recycled for controlling the temperature of the processing solution just after being supplied to a supply pipe.
    • 本发明的基板的处理装置包括保持基板的保持器,从第一端供给处理液并从第二端向基板供给的供给管,第一温度控制器,具有第一 循环在其内的温度控制的水控制围绕供应管的第二端的第一温度;以及第二温度控制器,具有从第一温度控制器排出的第二温度控制的水,该第一温度控制器在内部循环,第一温度控制水围绕供应的第一端控制第二温度 管。 通过这样的结构,用于控制刚刚施加到基板上的处理液的温度的温度控制水可以再循环,以便在供给到供给管之后控制处理溶液的温度。