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1. 发明授权

US07126159B2 Plural leds mounted within a central cutout of a surrounding circular reflective electrode 有权
标题翻译：安装在周围环形反射电极的中央切口内的多个LED
公开(公告)号：US07126159B2
公开(公告)日：2006-10-24
申请号：US10505845
申请日：2003-03-03
申请人： Junichi Itai , Takayuki Ishihara , Takeshi Kitamura
发明人： Junichi Itai , Takayuki Ishihara , Takeshi Kitamura
IPC分类号： H01L33/00 , H05B33/06
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/00014
摘要： A light emitting device includes a first patterned electrode 12 and a second patterned electrode 13 both of which are formed on a wiring board 11, an LED chip 19 mounted on the second patterned electrode 13, a metal wire 20 electrically connecting the LED chip 19 and the first patterned electrode 12 to each other, and a lens member 21 made of a transparent synthetic resin for packaging the LED chip 19 and the metal wire 20. The first patterned electrode 12 is circular and formed with a cutout 14 at the center thereof. The second patterned electrode 13 is arranged in the cutout 14. With this arrangement, the lens member 21 can be formed into a predetermined configuration, while the reflection of light by the patterned electrodes can be ensured.
摘要翻译：发光器件包括：第一图案化电极12和第二图案化电极13，它们都形成在布线板11上，安装在第二图案化电极13上的LED芯片19，将LED芯片19和第一图案化电极12彼此相对，以及由用于封装LED芯片19和金属线20的透明合成树脂制成的透镜构件21.第一图案化电极12是圆形的，在其中心处形成有切口14。第二图形电极13布置在切口14中。通过这种布置，透镜构件21可以形成为预定构造，同时可以确保由图案化电极反射光。

2. 发明授权

US08633506B2 Semiconductor light emitting device and method for manufacturing the same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08633506B2
公开(公告)日：2014-01-21
申请号：US12401852
申请日：2009-03-11
申请人： Masahiko Kobayakawa , Kazuhiro Mireba , Shintaro Yasuda , Junichi Itai , Taisuke Okada
发明人： Masahiko Kobayakawa , Kazuhiro Mireba , Shintaro Yasuda , Junichi Itai , Taisuke Okada
IPC分类号： H01L33/00
CPC分类号： H01L23/49503 , H01L23/31 , H01L23/48 , H01L23/495 , H01L23/4951 , H01L23/49541 , H01L23/49548 , H01L25/0753 , H01L25/167 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
摘要翻译：半导体发光器件包括半导体光源，围绕半导体光源的树脂封装以及固定到树脂封装的引线。引线设置有用于接合半导体光源的裸片接合焊盘以及与裸片接合焊盘相对的暴露表面。暴露表面被暴露表面的面内方向上的树脂封装围绕。

3. 发明申请

US20070040253A1 Chip type led 有权
标题翻译：芯片型led
公开(公告)号：US20070040253A1
公开(公告)日：2007-02-22
申请号：US10572861
申请日：2004-06-07
申请人： Junichi Itai
发明人： Junichi Itai
IPC分类号： H01L23/02
CPC分类号： H01L33/486 , H01L24/73 , H01L33/20 , H01L2224/32225 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/10158 , H01L2924/00012 , H01L2924/00
摘要： A chip type LED which is capable of laterally emitting light from the light emitting diode chip and having a relatively small thickness is provided. The chip type LED includes an insulating substrate 12, a light emitting diode chip 15 mounted on the upper surface of the insulating substrate, and a transparent package 16 provided on the upper surface of the insulating substrate to hermetically seal the light emitting diode chip. The light emitting diode chip 15 is mounted on the upper surface of the insulating substrate with the anode electrode 15f of the light emitting diode chip oriented downward and the cathode electrode 15a oriented upward.
摘要翻译：提供了能够从发光二极管芯片侧向发射光并且具有相对较小厚度的芯片型LED。芯片型LED包括绝缘基板12，安装在绝缘基板的上表面上的发光二极管芯片15和设置在绝缘基板的上表面上的透明封装16，以密封发光二极管芯片。发光二极管芯片15安装在绝缘基板的上表面上，其中发光二极管芯片的阳极15f朝向下方，阴极电极15向上取向。

4. 外观设计

USD576571S1 Light emitting diode module 有权
公开(公告)号：USD576571S1
公开(公告)日：2008-09-09
申请号：US29293848
申请日：2007-12-14
申请人： Junichi Itai
设计人： Junichi Itai

5. 发明申请

US20100163920A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
标题翻译：半导体发光器件
公开(公告)号：US20100163920A1
公开(公告)日：2010-07-01
申请号：US12663990
申请日：2008-06-11
申请人： Junichi Itai
发明人： Junichi Itai
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2924/01322 , H01L2224/48227 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor light emitting device (A) includes a resin package (5), a semiconductor light emitting element (4), a first lead (1A) and a second lead (1B). The resin package (5) has an upper surface and a bottom surface, and has translucency. The semiconductor light emitting element (4) is covered with the resin package (5) in a state where the semiconductor light emitting element faces the upper surface of the resin package (5). The first lead (1A) includes a bonding pad (11A) which supports the semiconductor light emitting element (4). The second lead (1B) is separated from the first lead (1A), and is electrically connected to the semiconductor light emitting element (4) via a wire (6). The leads (1A, 1B) have mounting terminals (13A, 13B) which are exposed from the bottom surface of the resin package (5). The mounting terminals (13A, 13B) are surrounded by the resin package (5) in an in-plane direction perpendicular to the thickness direction of the resin package.
摘要翻译：半导体发光器件（A）包括树脂封装（5），半导体发光元件（4），第一引线（1A）和第二引线（1B）。树脂封装（5）具有上表面和底表面，并且具有半透明性。在半导体发光元件面对树脂封装（5）的上表面的状态下，半导体发光元件（4）被树脂封装（5）覆盖。第一引线（1A）包括支撑半导体发光元件（4）的接合焊盘（11A）。第二引线（1B）与第一引线（1A）分离，经由引线（6）与半导体发光元件（4）电连接。引线（1A，1B）具有从树脂封装（5）的底面露出的安装端子（13A，13B）。安装端子（13A，13B）在与树脂封装的厚度方向垂直的面内方向上由树脂封装（5）包围。

6. 发明申请

US20090230413A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20090230413A1
公开(公告)日：2009-09-17
申请号：US12401852
申请日：2009-03-11
申请人： Masahiko KOBAYAKAWA , Kazuhiro MIREBA , Shintaro YASUDA , Junichi ITAI , Taisuke OKADA
发明人： Masahiko KOBAYAKAWA , Kazuhiro MIREBA , Shintaro YASUDA , Junichi ITAI , Taisuke OKADA
IPC分类号： H01L33/00 , H01L21/50
CPC分类号： H01L23/49503 , H01L23/31 , H01L23/48 , H01L23/495 , H01L23/4951 , H01L23/49541 , H01L23/49548 , H01L25/0753 , H01L25/167 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
摘要翻译：半导体发光器件包括半导体光源，围绕半导体光源的树脂封装以及固定到树脂封装的引线。引线设置有用于接合半导体光源的裸片接合焊盘以及与裸片接合焊盘相对的暴露表面。暴露表面被暴露表面的面内方向上的树脂封装围绕。

7. 发明授权

US07323704B2 Chip type led 有权
标题翻译：芯片型led
公开(公告)号：US07323704B2
公开(公告)日：2008-01-29
申请号：US10572861
申请日：2004-06-07
申请人： Junichi Itai
发明人： Junichi Itai
IPC分类号： H01L23/02
CPC分类号： H01L33/486 , H01L24/73 , H01L33/20 , H01L2224/32225 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/10158 , H01L2924/00012 , H01L2924/00
摘要： A chip type LED which is capable of laterally emitting light from the light emitting diode chip and having a relatively small thickness is provided. The chip type LED includes an insulating substrate 12, a light emitting diode chip 15 mounted on the upper surface of the insulating substrate, and a transparent package 16 provided on the upper surface of the insulating substrate to hermetically seal the light emitting diode chip. The light emitting diode chip 15 is mounted on the upper surface of the insulating substrate with the anode electrode 15f of the light emitting diode chip oriented downward and the cathode electrode 15a oriented upward.
摘要翻译：提供了能够从发光二极管芯片侧向发射光并且具有相对较小厚度的芯片型LED。芯片型LED包括绝缘基板12，安装在绝缘基板的上表面上的发光二极管芯片15和设置在绝缘基板的上表面上的透明封装16，以密封发光二极管芯片。发光二极管芯片15安装在绝缘基板的上表面上，其中发光二极管芯片的阳极15f朝向下方，阴极电极15向上取向。

8. 发明申请

US20050122031A1 Light-emitting device comprising led chip and method for manufacturing this device 有权
标题翻译：包括LED芯片的发光装置及其制造方法
公开(公告)号：US20050122031A1
公开(公告)日：2005-06-09
申请号：US10505845
申请日：2003-03-03
申请人： Junichi Itai , Takayuki Ishihara , Takeshi Kitamura
发明人： Junichi Itai , Takayuki Ishihara , Takeshi Kitamura
IPC分类号： H01L33/62 , H01L21/316 , H01L25/075 , H01L33/56 , H01L33/58 , H01L33/60 , H01J1/62
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/00014
摘要： A light emitting device includes a first patterned electrode 12 and a second patterned electrode 13 both of which are formed on a wiring board 11, an LED chip 19 mounted on the second patterned electrode 13, a metal wire 20 electrically connecting the LED chip 19 and the first patterned electrode 12 to each other, and a lens member 21 made of a transparent synthetic resin for packaging the LED chip 19 and the metal wire 20. The first patterned electrode 12 is circular and formed with a cutout 14 at the center thereof. The second patterned electrode 13 is arranged in the cutout 14. With this arrangement, the lens member 21 can be formed into a predetermined configuration, while the reflection of light by the patterned electrodes can be ensured.
摘要翻译：发光器件包括：第一图案化电极12和第二图案化电极13，它们都形成在布线板11上，安装在第二图案化电极13上的LED芯片19，将LED芯片19和第一图案化电极12彼此相对，以及由用于封装LED芯片19和金属线20的透明合成树脂制成的透镜构件21.第一图案化电极12是圆形的，在其中心处形成有切口14。第二图形电极13布置在切口14中。通过这种布置，透镜构件21可以形成为预定构造，同时可以确保由图案化电极反射光。

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