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    • 7. 发明授权
    • Poly silicon resistor, reference voltage circuit comprising the same, and manufacturing method of poly silicon resistor
    • 聚硅电阻器,包括其的参考电压电路以及多晶硅电阻器的制造方法
    • US08558608B2
    • 2013-10-15
    • US13559218
    • 2012-07-26
    • Jung-Hyun Choi
    • Jung-Hyun Choi
    • H01L25/00
    • H01L28/20H01C7/005H01C13/02H01C17/06
    • The present invention relates to a polysilicon resistor, a reference voltage circuit including the same, and a method for manufacturing the polysilicon resistor. The polysilicon resistor according includes a first polysilicon resistor and at least one of second polysilicon resistors, coupled to the first polysilicon resistor in series. The first polysilicon resistor and the at least one of the second polysilicon resistors are P-type polysilicon, and a doping concentration of the first polysilicon resistor is different from a doping concentration of the at least one of the second polysilicon resistors. The polysilicon resistor formed by serially coupling the first polysilicon resistor and the at least one of the second polysilicon resistors is applied with a constant current such that a reference voltage or a constant voltage is generated.
    • 多晶硅电阻器及其制造方法技术领域本发明涉及一种多晶硅电阻器及其制造方法。 多晶硅电阻器包括第一多晶硅电阻器和串联连接到第一多晶硅电阻器的第二多晶硅电阻器中的至少一个。 第一多晶硅电阻器和第二多晶硅电阻器中的至少一个是P型多晶硅,并且第一多晶硅电阻器的掺杂浓度不同于第二多晶硅电阻器中的至少一个的掺杂浓度。 通过串联耦合第一多晶硅电阻器和至少一个第二多晶硅电阻器形成的多晶硅电阻器被施加恒定电流,使得产生参考电压或恒定电压。
    • 9. 发明申请
    • METHOD AND APPARATUS FOR DEPOSITION OF DIFFUSION THIN FILM
    • 用于沉积薄膜沉积的方法和装置
    • US20110114474A1
    • 2011-05-19
    • US12743706
    • 2007-11-22
    • Sang-Youl BaeSi-Young ChoiSung-Youp ChungJung-Hyun Choi
    • Sang-Youl BaeSi-Young ChoiSung-Youp ChungJung-Hyun Choi
    • C23C14/34C23C14/22C23C14/14C23C14/54
    • C23C14/0641C23C14/325C23C14/345H01J37/34
    • This invention relates to a method and apparatus for deposition of a diffused thin film, useful in the fabrication of semiconductors and for the surface DC-Bias coating of various tools. In order to coat the surface of a treatment object, such as semiconductors, various molded products, or various tools, with a thin film, one or more process factors selected from among a bias voltage, a gas quantity, an arc power, and a sputtering power are continuously and variably adjusted, whereby the composition ratio of the thin film which is formed on the surface of the treatment object not through a chemical reaction but through a physical method is continuously varied, thus manufacturing a thin film having high hardness. The composition ratio of the thin film to be deposited is selected depending on the end use thereof, thereby depositing the thin film having superior wear resistance, impact resistance, and heat resistance.
    • 本发明涉及一种沉积扩散薄膜的方法和装置,可用于制造半导体和各种工具的表面直流偏置涂层。 为了涂覆诸如半导体,各种模制产品或具有薄膜的各种工具的处理对象的表面,从偏置电压,气体量,电弧功率和 溅射功率被连续且可变地调节,由此,不是通过化学反应而是通过物理方法形成在处理对象表面上的薄膜的组成比不断变化,因此制造具有高硬度的薄膜。 要沉积的薄膜的组成比根据其最终用途来选择,从而沉积具有优异的耐磨性,耐冲击性和耐热性的薄膜。