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    • 2. 发明授权
    • System and method for preparation of tooling sheet, and program for preparation of tooling sheet
    • 制版工具的制作方法及制作工具的程序
    • US07035709B2
    • 2006-04-25
    • US10760459
    • 2004-01-21
    • Masato YamadaJun Oki
    • Masato YamadaJun Oki
    • G06F19/00
    • G05B19/40938G05B2219/36354Y02P90/265Y10T483/165
    • An optimum cutting tool is selected interactively in a cutting tools selection section, and a tooling sheet using the selected cutting tool is generated and output in a tooling sheet preparation section. The cutting tool selection section searches a cutting tool database using a unique order number for each cutting tool as a search key, and outputs a list of cutting tool search results, and when a declaration of intention to select an insert via the list is made, parameters indicating the recommended cutting conditions for the designated cutting tool are transferred to the tooling sheet preparation section. The tooling sheet preparation section generates and outputs tooling sheet item data for some items by computation with a prescribed formula, based on the transferred parameters. As a result, an accurate, interchangeable, and readily expandable system for the preparation of tooling sheets can be provided.
    • 在切削刀具选择部中交互地选择最佳切削刀具,并且生成使用所选择的切削刀具的加工工具,并将其输出到加工片材准备部。 切割工具选择部分使用针对每个切割工具的唯一订单号搜索切割工具数据库作为搜索关键字,并输出切割工具搜索结果的列表,并且当通过列表选择插入的意图声明时, 指示指定切削刀具的推荐切削条件的参数被转移到模具制备部分。 工装板准备部基于传送的参数,通过规定的公式计算生成并输出一些项目的工具表项目数据。 因此,可以提供用于准备工装片的精确,可互换和容易扩展的系统。
    • 4. 发明授权
    • Light-emitting device
    • 发光装置
    • US07786492B2
    • 2010-08-31
    • US12184285
    • 2008-08-01
    • Mitsuhiro OmaeJun OkiTakafumi Watanabe
    • Mitsuhiro OmaeJun OkiTakafumi Watanabe
    • H01L33/00
    • H01L33/46H01L25/0753H01L33/486H01L33/60H01L2224/48091H01L2224/48227H01L2924/00014
    • A light-emitting device offering satisfactory light emission characteristics combined with improved reliability has a substrate on the principal surface of which a non-polar electrode layer is formed, an LED chip mounted in a predetermined region on the non-polar electrode layer, a plurality of cathode and anode electrode layers formed on the principal surface of the substrate for supplying electric power to the LED chip, and a reflective frame formed of a metal material containing aluminum as its main content, the reflective frame having its inner circumferential surface formed into a reflective surface for reflecting the light from the LED chip. The reflective frame is fixed, directly, or indirectly with adhesive, to the non-polar electrode layer so as to surround the LED chip, with the inside of the reflective frame sealed with a light-transmitting member. An anodized aluminum coat with a thickness of 2 μm to 10 μm is formed by anodization at least on the inner circumferential surface, formed into the reflective surface, of the reflective frame.
    • 提供令人满意的发光特性与提高的可靠性结合的发光装置在其主表面上形成非极性电极层的基板,安装在非极性电极层上的预定区域中的LED芯片,多个 形成在用于向LED芯片提供电力的基板的主表面上的阴极和阳极电极层以及由以铝为主要成分的金属材料形成的反射框架,所述反射框架的内周面形成为 用于反射来自LED芯片的光的反射表面。 将反射框架直接或间接地用粘合剂固定到非极性电极层,以便围绕LED芯片,反射框架的内部用透光构件密封。 至少在形成反射面的反射面的内周面上通过阳极氧化形成厚度为2μm〜10μm的阳极氧化铝涂层。
    • 6. 发明申请
    • LIGHT-EMITTING DEVICE
    • 发光装置
    • US20090039368A1
    • 2009-02-12
    • US12184285
    • 2008-08-01
    • Mitsuhiro OmaeJun OkiTakafumi Watanabe
    • Mitsuhiro OmaeJun OkiTakafumi Watanabe
    • H01L33/00
    • H01L33/46H01L25/0753H01L33/486H01L33/60H01L2224/48091H01L2224/48227H01L2924/00014
    • A light-emitting device offering satisfactory light emission characteristics combined with improved reliability has a substrate on the principal surface of which a non-polar electrode layer is formed, an LED chip mounted in a predetermined region on the non-polar electrode layer, a plurality of cathode and anode electrode layers formed on the principal surface of the substrate for supplying electric power to the LED chip, and a reflective frame formed of a metal material containing aluminum as its main content, the reflective frame having its inner circumferential surface formed into a reflective surface for reflecting the light from the LED chip. The reflective frame is fixed, directly, or indirectly with adhesive, to the non-polar electrode layer so as to surround the LED chip, with the inside of the reflective frame sealed with a light-transmitting member. An anodized aluminum coat with a thickness of 2 μm to 10 μm is formed by anodization at least on the inner circumferential surface, formed into the reflective surface, of the reflective frame.
    • 提供令人满意的发光特性与提高的可靠性结合的发光装置在其主表面上形成非极性电极层的基板,安装在非极性电极层上的预定区域中的LED芯片,多个 形成在用于向LED芯片提供电力的基板的主表面上的阴极和阳极电极层以及由以铝为主要成分的金属材料形成的反射框架,所述反射框架的内周面形成为 用于反射来自LED芯片的光的反射表面。 将反射框架直接或间接地用粘合剂固定到非极性电极层,以便围绕LED芯片,反射框架的内部用透光构件密封。 至少在反射框架的反射面的内周面上进行阳极氧化,形成厚度为2μm〜10μm的阳极氧化铝涂层。