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    • 2. 发明授权
    • Double silicon-on-insulator device and method thereof
    • 双绝缘体硅器件及其方法
    • US06383892B1
    • 2002-05-07
    • US09225315
    • 1999-01-05
    • John Z. Colt, Jr.
    • John Z. Colt, Jr.
    • H01L2130
    • H01L21/7624
    • An integrated circuit chip wherein one or more semiconductor devices are completely isolated from bulk effects of other semiconductor devices in the same circuit and a method of making the integrated circuit chip. The devices may be passive devices such as resistors, or active devices such as diodes, bipolar transistors or field effect transistors (FETs). A multi-layer semiconductor body is formed of, preferably silicon and silicon dioxide. A conducting region or channel is formed in one or more of the layers. For the FET, silicon above and below the channel region provides controllable gates with vertically symmetrical device characteristics. Buried insulator layers may be added to isolate the lower gate of individual devices from each other and to create multiple vertically stacked isolated devices. Both PFET and NFET devices can be made with independent doping profiles in both depletion and accumulation modes.
    • 一种集成电路芯片,其中一个或多个半导体器件与同一电路中的其它半导体器件的本体效应完全隔离,以及制造集成电路芯片的方法。 这些器件可以是无源器件,例如电阻器或有源器件,例如二极管,双极晶体管或场效应晶体管(FET)。 多层半导体体优选由硅和二氧化硅形成。 在一个或多个层中形成导电区域或沟道。 对于FET,沟道区上方和下方的硅提供具有垂直对称器件特性的可控制栅极。 可以添加埋置的绝缘体层以将各个器件的下栅极彼此隔离并且产生多个垂直堆叠的隔离器件。 PFET和NFET器件都可以在耗尽和累积模式下以独立的掺杂分布形成。
    • 4. 发明授权
    • Double silicon-on-insulator device and method therefor
    • 双绝缘体硅器件及其方法
    • US6013936A
    • 2000-01-11
    • US130299
    • 1998-08-06
    • John Z. Colt, Jr.
    • John Z. Colt, Jr.
    • H01L29/73H01L21/02H01L21/265H01L21/329H01L21/331H01L21/762H01L27/085H01L27/12H01L29/786H01L23/16H01L23/48
    • H01L21/7624
    • An integrated circuit chip wherein one or more semiconductor devices are completely isolated from bulk effects of other semiconductor devices in the same circuit and a method of making the integrated circuit chip. The devices may be passive devices such as resistors, or active devices such as diodes, bipolar transistors or field effect transistors (FETs). A multi-layer semiconductor body is formed of, preferably silicon and silicon dioxide. A conducting region or channel is formed in one or more of the layers. For the FET, silicon above and below the channel region provides controllable gates with vertically symmetrical device characteristics. Buried insulator layers may be added to isolate the lower gate of individual devices from each other and to create multiple vertically stacked isolated devices. Both PFET and NFET devices can be made with independent doping profiles in both depletion and accumulation modes.
    • 一种集成电路芯片,其中一个或多个半导体器件与同一电路中的其它半导体器件的本体效应完全隔离,以及制造集成电路芯片的方法。 这些器件可以是无源器件,例如电阻器或有源器件,例如二极管,双极晶体管或场效应晶体管(FET)。 多层半导体体优选由硅和二氧化硅形成。 在一个或多个层中形成导电区域或沟道。 对于FET,沟道区上方和下方的硅提供具有垂直对称器件特性的可控制栅极。 可以添加埋置的绝缘体层以将各个器件的下栅极彼此隔离并且产生多个垂直堆叠的隔离器件。 PFET和NFET器件都可以在耗尽和累积模式下以独立的掺杂分布形成。