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    • 1. 发明授权
    • Negative thermal expansion materials
    • 负热膨胀材料
    • US5514360A
    • 1996-05-07
    • US397695
    • 1995-03-01
    • Arthur W. SleightMary A. ThundathilJohn S. O. Evans
    • Arthur W. SleightMary A. ThundathilJohn S. O. Evans
    • C01G41/00C01G25/02C01G27/02
    • C01G41/00
    • A method for making tungstate compounds according to the formula XW.sub.2 O.sub.8, wherein X is selected from the group consisting of zirconium, hafnium, and combinations thereof, is described. Also described are compositions that include the tungstate compounds, and a method for reducing the positive thermal expansion of a material using such tungstate compounds. Substantially single phase compounds can be made by practicing the method, which method also reduces the synthesis time relative to known methods, and expands the reactants that can be used for the synthesis over the methods reported previously. The tungstate compounds generally can be made by forming a solution, particularly an aqueous solution, comprising a W.sup.6+ compound and a second metal compound wherein the metal is selected from the group consisting of Zr.sup.4+, Hf.sup.4+ and combinations thereof. The solvent is removed from the solution by any known method to leave the solutes as a solid product. The solid product is then heated to a temperature of greater than about 600.degree. C., preferably at least about 1165.degree. C., more preferably from about 1165.degree. C. to about 1250.degree. C., and even more preferably to about 1200.degree. C. The heated product is then cooled to ambient temperature, generally relatively rapidly, to produce substantially single phase tungstate compounds.
    • 描述了制备根据式XW2​​O8的钨酸盐化合物的方法,其中X选自锆,铪及其组合。 还描述了包括钨酸盐化合物的组合物,以及使用这种钨酸盐化合物减少材料的正热膨胀的方法。 基本上单相化合物可以通过实施该方法制备,该方法相对于已知方法也降低了合成时间,并且扩展了可以用于合成的反应物,这些反应物先前报道的方法。 钨酸盐化合物通常可以通过形成包含W6 +化合物和第二金属化合物的溶液,特别是水溶液来制备,其中金属选自Zr4 +,Hf4 +及其组合。 通过任何已知的方法将溶剂从溶液中除去,以使溶质作为固体产物。 然后将固体产物加热至大于约600℃,优选至少约1165℃,更优选约1165℃至约1250℃,甚至更优选至约1200℃的温度。 然后将加热的产物通常相对快速地冷却至环境温度,以产生基本上单相的钨酸盐化合物。
    • 2. 发明授权
    • Materials with low or negative thermal expansion
    • US5919720A
    • 1999-07-06
    • US59679
    • 1998-04-13
    • Arthur W. SleightMary A. ThundathilJohn S. O. Evans
    • Arthur W. SleightMary A. ThundathilJohn S. O. Evans
    • C04B35/495H05K1/03C04B35/10
    • C04B35/495H05K1/0306
    • Low or negative thermal expansion compounds are described having a formula of A.sub.2-x.sup.3+ A.sub.y.sup.4+ M.sub.z.sup.3+ M.sub.3-y.sup.6+ P.sub.y O.sub.12. It currently is believed that y can vary from about 0 to about 2, x equals the sum of y and z and varies from about 0.1 to about 1.9. Without limitation, novel compounds satisfying the formula A.sub.2-x.sup.3+ A.sub.y.sup.4+ M.sub.z.sup.3+ M.sub.3-y.sup.6+ P.sub.y O.sub.12 where y=0 may be selected from the group consisting of Al.sub.1.5 In.sub.0.5 W.sub.3 O.sub.12, Al.sub.1.6 In.sub.0.4 W.sub.3 O.sub.12, Al.sub.1.7 In.sub.0.3 W.sub.3 O.sub.12, Al.sub.1.8 In.sub.0.2 W.sub.3 O.sub.12, YAlW.sub.3 O.sub.12, ScAlW.sub.3 O.sub.12, ScGaW.sub.3 O.sub.12, ScInW.sub.3 O.sub.12, ScHoW.sub.3 O.sub.12, ScYbMo.sub.3 O.sub.12 and ErInW.sub.3 O.sub.12. Without limitation, novel compounds satisfying the formula A.sub.2-x.sup.3+ A.sub.y.sup.4+ M.sub.z.sup.3+ M.sub.3-y.sup.6+ P.sub.y O.sub.12 where y=2 may be selected from the group consisting of Hf.sub.2 WP.sub.2 O.sub.12 and Hf.sub.2 MoP.sub.2 O.sub.12. The present invention also provides compositions useful for decreasing the positive thermal expansion of a material or materials included in the compositions. The compositions comprise at least a first material and a second material where the first material has low or negative thermal expansion properties and the second material exhibits positive thermal expansion. Novel compositions and methods for making and using such compositions can be made using a first material selected, without limitation, from the group consisting of Al.sub.2 W.sub.3 O.sub.12, Al.sub.2 Mo.sub.3 O.sub.12, In.sub.2 W.sub.3 O.sub.12, Al.sub.1.5 In.sub.0.5 W.sub.3 O.sub.12, Al.sub.1.6 In.sub.0.4 W.sub.3 O.sub.12, Al.sub.1.7 In.sub.0.3 W.sub.3 O.sub.12, Al.sub.1.8 In.sub.0.2 W.sub.3 O.sub.12, YAlW.sub.3 O.sub.12, ScAlW.sub.3 O.sub.12, ScGaW.sub.3 O.sub.12, ScInW.sub.3 O.sub.12, ScHoW.sub.3 O.sub.12, ScYbMo.sub.3 O.sub.12, ErInW.sub.3 O.sub.12, Al.sub.1.68 Sc.sub.0.02 In.sub.0.3 W.sub.3 O.sub.12, Zr.sub.2 WP.sub.2 O.sub.12, Zr.sub.2 MoP.sub.2 O.sub.12, Hf.sub.2 WP.sub.2 O.sub.12 and Hf.sub.2 MoP.sub.2 O.sub.12. A general method for making compounds having low or negative thermal expansion, and compositions containing such compounds, also is described. The first step of the method comprises purposefully designing compounds to be low or negative thermal expansion compounds according to rules derived empirically. The second step comprises making those compounds designed according to the rules. Examples of negative thermal expansion materials made by such method include NbO.sub.2 F and TaO.sub.2 F.