会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Unidirectional ring lasers
    • 单向环形激光器
    • US5349601A
    • 1994-09-20
    • US123835
    • 1993-09-20
    • John P. HohimerDavid C. Craft
    • John P. HohimerDavid C. Craft
    • H01S3/063H01S3/083
    • H01S5/026H01S5/1028H01S5/1071
    • Unidirectional ring lasers formed by integrating nonreciprocal optical elements into the resonant ring cavity. These optical elements either attenuate light traveling in a nonpreferred direction or amplify light traveling in a preferred direction. In one preferred embodiment the resonant cavity takes the form of a circle with an S-shaped crossover waveguide connected to two points on the interior of the cavity such that light traveling in a nonpreferred direction is diverted from the cavity into the crossover waveguide and reinjected out of the other end of the crossover waveguide into the cavity as light traveling in the preferred direction.
    • 通过将不可逆光学元件集成到谐振环腔中形成的单向环形激光器。 这些光学元件可以衰减以非优选方向行进的光或放大沿优选方向行进的光。 在一个优选实施例中,谐振腔采用具有S形交叉波导的圆形形式,连接到空腔内部的两个点,使得以非推荐方向行进的光从空腔转移到交叉波导中并重新注入 的交叉波导的另一端插入到空腔中,作为沿优选方向行进的光。
    • 2. 发明授权
    • Semiconductor diode laser having an intracavity spatial phase controller
for beam control and switching
    • 具有用于光束控制和切换的腔内空间相位控制器的半导体二极管激光器
    • US5319659A
    • 1994-06-07
    • US883315
    • 1992-05-14
    • John P. Hohimer
    • John P. Hohimer
    • H01S5/042H01S5/062H01S5/0625H01S5/20H01S3/19
    • H01S5/0425H01S5/0625H01S5/06243H01S5/2036
    • A high-power broad-area semiconductor laser having a intracavity spatial phase controller is disclosed. The integrated intracavity spatial phase controller is easily formed by patterning an electrical contact metallization layer when fabricating the semiconductor laser. This spatial phase controller changes the normally broad far-field emission beam of such a laser into a single-lobed near-diffraction-limited beam at pulsed output powers of over 400 mW. Two operating modes, a thermal and a gain operating mode, exist for the phase controller, allowing for steering and switching the beam as the modes of operation are switched, and the emission beam may be scanned, for example, over a range of 1.4 degrees or switched by 8 degrees. More than one spatial phase controller may be integrated into the laser structure.
    • 公开了具有腔内空间相位控制器的大功率广域半导体激光器。 当制造半导体激光器时,通过图案化电接触金属化层,容易地形成集成的腔内空间相位控制器。 该空间相位控制器将这种激光器的通常宽的远场发射光束以超过400mW的脉冲输出功率变化为单裂纹近衍射受限束。 存在用于相位控制器的两种操作模式,即热和增益操作模式,当切换操作模式时允许转向和切换光束,并且发射光束可以例如在1.4度的范围内被扫描 或切换8度。 可以将多于一个空间相位控制器集成到激光器结构中。
    • 3. 发明授权
    • Micromechanical die attachment surcharge
    • 微机械模具附件结构
    • US06392144B1
    • 2002-05-21
    • US09516666
    • 2000-03-01
    • William F. FilterJohn P. Hohimer
    • William F. FilterJohn P. Hohimer
    • H01L2302
    • B81B7/0077B81C3/002B81C2203/058H01L23/13H01L2223/6622H01L2924/0002H03H9/1057H01L2924/00
    • An attachment structure is disclosed for attaching a die to a supporting substrate without the use of adhesives or solder. The attachment structure, which can be formed by micromachining, functions purely mechanically in utilizing a plurality of shaped pillars (e.g. round, square or polygonal and solid, hollow or slotted) that are formed on one of the die or supporting substrate and which can be urged into contact with various types of mating structures including other pillars, a deformable layer or a plurality of receptacles that are formed on the other of the die or supporting substrate, thereby forming a friction bond that holds the die to the supporting substrate. The attachment structure can further include an alignment structure for precise positioning of the die and supporting substrate to facilitate mounting the die to the supporting substrate. The attachment structure has applications for mounting semiconductor die containing a microelectromechanical (MEM) device, a microsensor or an integrated circuit (IC), and can be used to form a multichip module. The attachment structure is particularly useful for mounting die containing released MEM devices since these devices are fragile and can otherwise be damaged or degraded by adhesive or solder mounting.
    • 公开了一种用于在不使用粘合剂或焊料的情况下将模具附接到支撑基板的附接结构。 可以通过微机械加工形成的附接结构通过利用多个成形的支柱(例如圆形,正方形或多边形和固体,中空或开槽)来实现机械地起作用,其形成在模具或支撑基板之一上,并且可以是 促使其与各种类型的配合结构接触,包括其他柱,可变形层或多个容器,其形成在模具或支撑衬底的另一个上,从而形成将模具保持在支撑衬底上的摩擦接合。 附接结构还可以包括用于精确定位模具和支撑衬底以便于将模具安装到支撑衬底的对准结构。 附接结构具有用于安装包含微机电(MEM)器件,微传感器或集成电路(IC)的半导体管芯的应用,并且可用于形成多芯片模块。 安装结构对于安装具有释放的MEM装置的模具特别有用,因为这些装置是脆弱的,否则可能由于粘合剂或焊料安装而被损坏或劣化。