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    • 8. 发明授权
    • Method of fabricating metal electronic enclosures
    • 制造金属电子外壳的方法
    • US6155093A
    • 2000-12-05
    • US336226
    • 1999-06-18
    • John M. Lipari
    • John M. Lipari
    • B23P15/00B21D28/02
    • B23P15/00
    • A method of forming metal enclosures specifically for electrical or electronic components which require precision in the formation of enclosure wells for containing the components. In accordance with the present invention the method comprises the steps of initially taking a metal blank having a depth thickness at least sufficient to accommodate a pre-determined enclosure well depth therein; determining the shape and depth of varying dimensions of the predetermined enclosure well; using a coining press and dies to separately cold form the determined shapes and depths which in toto form the desired well, and wherein each of the cold formings causes extrusion of a portion of metal to extend beyond the original depth thickness; after each cold forming with the coining press of the separate shapes and depth, using a metal removal device such as a grinder to remove the metal extrusion portion.
    • 形成专门用于电气或电子部件的金属外壳的方法,其需要精确地形成用于容纳部件的封闭井。 根据本发明,该方法包括以下步骤:首先采用具有至少足以容纳其中预定的封闭井深度的深度厚度的金属坯料; 确定预定外壳的不同尺寸的形状和深度; 使用压印机和模具分开冷成型确定的形状和深度,以形成所需的孔,并且其中每个冷成型件导致一部分金属的挤出延伸超过原始深度厚度; 在使用分离形状和深度的压印机进行每次冷成型之后,使用诸如研磨机的金属去除装置来移除金属挤出部分。