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1. 发明申请

US20080038476A1 Process for improving the adhesion of polymeric materials to metal surfaces 有权
标题翻译：改善聚合物材料与金属表面的粘附性的方法
公开(公告)号：US20080038476A1
公开(公告)日：2008-02-14
申请号：US11503780
申请日：2006-08-14
申请人： John L. Cordani
发明人： John L. Cordani
IPC分类号： B05D1/18
CPC分类号： H05K3/385 , C23C18/1831 , C23C18/24 , C23C18/31 , C23C18/32 , C23C22/362 , C23C28/00 , C23C28/04 , H05K3/383 , H05K3/384 , H05K2203/072 , H05K2203/073
摘要： A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel, electroless cobalt or electroless (or immersion) tin followed by phosphating the plated layer prior to bonding the polymeric material thereto. The process is particularly suited to treating printed circuit board inner-layers and lead frames.
摘要翻译：公开了一种用于增加聚合物材料对金属表面的粘附性的方法。该方法包括用化学镀镍，无电解钴或无电镀（或浸渍）锡层镀金属表面，然后在将聚合材料粘合到其之前使镀层磷化。该方法特别适用于处理印刷电路板内层和引线框架。

2. 发明授权

US5234542A Composition and process for stripping tin from copper surfaces 失效
标题翻译：从铜表面剥离锡的组成和工艺
公开(公告)号：US5234542A
公开(公告)日：1993-08-10
申请号：US847681
申请日：1992-03-04
申请人： John L. Cordani
发明人： John L. Cordani
IPC分类号： C23F1/44 , H05K3/06
CPC分类号： C23F1/44 , H05K3/067
摘要： A composition for stripping tin, and any underlying copper-tin intermetallic, from a copper surface, the composition being an aqueous solution of sulfuric acid and at least one member selected from an inorganic nitrate, preferably ferric nitrate, and nitric acid, and mixtures thereof.
摘要翻译：一种用于从铜表面剥离锡和任何下面的铜 - 锡金属间化合物的组合物，该组合物是硫酸水溶液和至少一种选自无机硝酸盐，优选硝酸铁和硝酸的组分，以及它们的混合物。

3. 发明授权

US5085730A Process for regenerating ammoniacal chloride etchants 失效
标题翻译：再生氨氯化物蚀刻剂的方法
公开(公告)号：US5085730A
公开(公告)日：1992-02-04
申请号：US614725
申请日：1990-11-16
申请人： John L. Cordani
发明人： John L. Cordani
IPC分类号： C23F1/34 , C23F1/46 , C25C1/12 , C25C7/02
CPC分类号： C23F1/46
摘要： A process is described for the direct electrolytic regeneration of chloride-based ammoniacal copper etchants without generating any significant amount of gaseous chlorine. The electrolysis is carried out using an etch resistant metal cathode and an anode which can be carbon, or an etch resistant metal optionally coated with a noble metal oxide. The process can be adapted to a closed loop system for maintaining at a substantially constant level the amount of copper present in an operating ammoniacal chloride etchant bath.
摘要翻译：描述了用于直接电解再生基于氯化物的氨铜蚀刻剂而不产生任何显着量的气态氯的方法。电解使用耐蚀刻金属阴极和可以是碳的阳极，或者可选地涂覆有贵金属氧化物的耐蚀刻金属进行。该方法可以适用于闭环系统，以保持在操作氨氯化物蚀刻液浴中存在的铜的量基本上恒定的水平。

4. 发明授权

US08088246B2 Process for improving the adhesion of polymeric materials to metal surfaces 有权
标题翻译：改善聚合物材料与金属表面的粘附性的方法
公开(公告)号：US08088246B2
公开(公告)日：2012-01-03
申请号：US12350380
申请日：2009-01-08
申请人： John L. Cordani, Jr. , Kesheng Feng , Steven A. Castaldi , Colleen Mckirryher
发明人： John L. Cordani, Jr. , Kesheng Feng , Steven A. Castaldi , Colleen Mckirryher
IPC分类号： B41J2/16 , C04B9/02
CPC分类号： H05K3/383 , B32B2305/076 , B32B2311/12 , B32B2457/08 , C23F1/18 , H05K2203/122
摘要： An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.
摘要翻译：本发明描述了粘合促进组合物和用粘合促进组合物处理金属表面的方法。粘合促进组合物包含氧化剂，酸，腐蚀抑制剂，卤离子源和选自巯基丙磺酸盐，巯基丙磺酸和二磺酸二磺酸二磺酸盐的材料。粘合促进组合物增加了聚合材料对金属表面的粘附性，并且还提供增加的耐酸性。

5. 发明申请

US20100170638A1 Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces 有权
标题翻译：改善聚合材料与金属表面的粘合性的方法
公开(公告)号：US20100170638A1
公开(公告)日：2010-07-08
申请号：US12350380
申请日：2009-01-08
申请人： John L. Cordani, JR. , Kesheng Feng , Steven A. Castaldi , Colleen Mckirryher
发明人： John L. Cordani, JR. , Kesheng Feng , Steven A. Castaldi , Colleen Mckirryher
IPC分类号： B32B37/12 , C09D5/08
CPC分类号： H05K3/383 , B32B2305/076 , B32B2311/12 , B32B2457/08 , C23F1/18 , H05K2203/122
摘要： An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.
摘要翻译：本发明描述了粘合促进组合物和用粘合促进组合物处理金属表面的方法。粘合促进组合物包含氧化剂，酸，腐蚀抑制剂，卤离子源和选自巯基丙磺酸盐，巯基丙磺酸和二磺酸二磺酸二磺酸盐的材料。粘合促进组合物增加了聚合材料对金属表面的粘附性，并且还提供增加的耐酸性。

6. 发明授权

US5248398A Process for direct electrolytic regeneration of chloride-based ammoniacal copper etchant bath 失效
标题翻译：基于氯化物的乙酸铜蚀刻剂的直接电解再生方法
公开(公告)号：US5248398A
公开(公告)日：1993-09-28
申请号：US614929
申请日：1990-11-16
申请人： John L. Cordani
发明人： John L. Cordani
IPC分类号： C23F1/46 , C25C1/00 , C25C1/08 , C25C1/12 , C25D21/18
CPC分类号： C25C1/08 , C23F1/46 , C25C1/12
摘要： A novel bipolar cell is described together with a method for employing the same in the electrowinning of heavy metals (copper, nickel, cobalt and the like) from baths such as etchants, electroless plating baths and the like. In a particular application, the bipolar cell is used to regenerate a chloride-based ammoniacal copper etching bath by electrowinning a portion of the copper therein. The regeneration is accomplished without generating any significant amount of gaseous chlorine. The regeneration of the copper etching bath in this manner is used in a closed loop system for maintaining at a substantially constant level the amount of copper present in an operating ammoniacal chloride copper etchant bath.

7. 发明授权

US5017267A Composition and method for stripping tin or tin-lead alloy from copper surfaces 失效
标题翻译：从铜表面剥离锡或锡铅合金的组合物和方法
公开(公告)号：US5017267A
公开(公告)日：1991-05-21
申请号：US554126
申请日：1990-07-17
申请人： John L. Cordani
发明人： John L. Cordani
IPC分类号： C23F1/30 , C23F1/44 , H05K3/06
CPC分类号： C23F1/30 , C23F1/44 , H05K3/067
摘要： An aqueous composition for stripping tin or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, ferric nitrate, and a source of chlorate ion. The composition effects stripping without any appreciable formation of sludge or precipitate or suspended particles, and the chlorate component enables significant reduction in the concentration of alkane sulfonic acid otherwise needed for the stripping. Also described are stripping compositions containing a source of chlorate ion and an acid for solubilizing stripped tin or tin-lead, such as alkane sulfonic acid, acetic acid, formic acid and the like.
摘要翻译：一种用于从含铜烷基磺酸，优选甲烷磺酸，硝酸铁和氯酸根离子的铜表面汽提锡或焊料以及任何下面的铜 - 锡合金的含水组合物。该组合物在没有明显形成污泥或沉淀物或悬浮颗粒的情况下影响剥离，并且氯酸盐组分可显着降低除去所需的烷烃磺酸浓度。还描述了含有氯酸根离子源和用于溶解汽提锡或锡铅（如烷烃磺酸，乙酸，甲酸等）的酸的汽提组合物。

8. 发明授权

US4944851A Electrolytic method for regenerating tin or tin-lead alloy stripping compositions 失效
标题翻译：用于再生锡或锡铅合金剥离组合物的电解方法
公开(公告)号：US4944851A
公开(公告)日：1990-07-31
申请号：US361548
申请日：1989-06-05
申请人： John L. Cordani , Raymond A. Letize
发明人： John L. Cordani , Raymond A. Letize
IPC分类号： C23F1/44 , C23F1/46
CPC分类号： C23F1/44 , C23F1/46 , C25C1/14 , C25C1/18
摘要： An aqueous solution of alkane sulfonic acid and inorganic nitrate used to strip metals from substrate surfaces, such as in stripping tin or tin-lead from copper surfaces, is regenerated by subjecting it to electrolysis to case dissolved stripped metals therein to deposit in metallic form on the surfaces of a cathode.
摘要翻译：用于从基材表面剥离金属的链烷磺酸和无机硝酸盐的水溶液，例如从铜表面汽提锡或锡铅，通过使其电解以将其中溶解的汽提金属沉积在金属形式上来再生阴极的表面。

9. 发明授权

US07704562B2 Process for improving the adhesion of polymeric materials to metal surfaces 有权
标题翻译：改善聚合物材料与金属表面的粘附性的方法
公开(公告)号：US07704562B2
公开(公告)日：2010-04-27
申请号：US11503780
申请日：2006-08-14
申请人： John L. Cordani, Jr.
发明人： John L. Cordani, Jr.
IPC分类号： B05D1/18
CPC分类号： H05K3/385 , C23C18/1831 , C23C18/24 , C23C18/31 , C23C18/32 , C23C22/362 , C23C28/00 , C23C28/04 , H05K3/383 , H05K3/384 , H05K2203/072 , H05K2203/073
摘要： A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel, electroless cobalt or electroless (or immersion) tin followed by phosphating the plated layer prior to bonding the polymeric material thereto. The process is particularly suited to treating printed circuit board inner-layers and lead frames.
摘要翻译：公开了一种用于增加聚合物材料对金属表面的粘附性的方法。该方法包括用化学镀镍，无电解钴或无电镀（或浸渍）锡层镀金属表面，然后在将聚合材料粘合到其之前使镀层磷化。该方法特别适用于处理印刷电路板内层和引线框架。

10. 发明授权

US5207867A Composition and method for improving the surface insulation resistance of a printed circuit 失效
标题翻译：用于提高印刷电路表面绝缘电阻的组合物和方法
公开(公告)号：US5207867A
公开(公告)日：1993-05-04
申请号：US852791
申请日：1992-03-17
申请人： John L. Cordani
发明人： John L. Cordani
IPC分类号： H05K3/06 , H05K3/10 , H05K3/26
CPC分类号： H05K3/26 , H05K2201/0761 , H05K2203/0789 , H05K3/06 , H05K3/108
摘要： After the stripping or etching away of metal to expose surface areas of insulating resin material in a printed circuit process based upon metal-clad insulating substrate material, the exposed surface areas of insulating material are contacted with a liquid treatment composition, comprised of an aqueous acidic solution containing fluoride ion, effective to remove from the surface areas residual metal species otherwise associated therewith, such that the surface insulation resistance afforded by the insulating surface areas of the printed circuit is improved.
摘要翻译：在基于金属包覆的绝缘衬底材料的印刷电路工艺中剥离或蚀刻掉金属以露出绝缘树脂材料的表面区域之后，绝缘材料的暴露的表面积与液体处理组合物接触，所述液体处理组合物由酸性水溶液含有氟离子的溶液，有效地从表面区域除去与其相关的残留金属物质，从而提高了印刷电路的绝缘表面积所提供的表面绝缘电阻。

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